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MCIMX6S7CVM08ACR

NXP Semiconductors

MCIMX6S7CVM08ACR by NXP Semiconductors

MCIMX6S7CVM08ACR by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 105 °C, with supply voltage range of 1.275V to 1.5V. Ideal for applications requiring low profile and fine pitch package style.

Median Price

$53.520

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 905 parts In-Stock

1+ parts

$53.520

100+ parts

$40.366

1k+ parts

-

10k+ parts

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905

$53.520

$40.366

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Mouser Electronics

USA . 375 parts In-Stock

1+ parts

$53.520

100+ parts

$40.370

1k+ parts

$37.320

10k+ parts

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375

$53.520

$40.370

$37.320

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Verical

USA . 8,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$36.037

10k+ parts

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8,000

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-

$36.037

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Distributors (In-Stock)

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Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$36.408

100+ parts

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500

$36.408

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Digiode

USA . 4,843 parts In-Stock

1+ parts

$41.316

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4,843

$41.316

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TME

Poland . 8,000 parts In-Stock

1+ parts

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$35.320

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8,000

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$35.320

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Chip Stock

USA . 7,420 parts In-Stock

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7,420

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Vyrian

USA . 614 parts In-Stock

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614

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Anansix

USA . 440 parts In-Stock

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440

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Flip Electronics

USA . 69 parts In-Stock

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69

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ComSIT Distribution GmbH

Germany . 5 parts In-Stock

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5

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Distributors (Availability)

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Continental Prestige Electronics

USA . 6,202 parts In-Stock

1+ parts

$34.825

100+ parts

-

1k+ parts

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10k+ parts

$34.129

6,202

$34.825

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-

$34.129

Netroflash

USA . 500 parts In-Stock

1+ parts

$36.408

100+ parts

-

1k+ parts

$34.588

10k+ parts

$33.860

500

$36.408

-

$34.588

$33.860

Corohmni

South Africa . 5,209 parts In-Stock

1+ parts

$36.496

100+ parts

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5,209

$36.496

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Ampacity Inc.

Singapore . 386 parts In-Stock

1+ parts

$36.970

100+ parts

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386

$36.970

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

1+ parts

$37.591

100+ parts

$35.711

1k+ parts

$35.711

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2,000

$37.591

$35.711

$35.711

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Corphita

USA . 2,742 parts In-Stock

1+ parts

$39.141

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2,742

$39.141

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Component Stockers USA

USA . 438 parts In-Stock

1+ parts

$45.070

100+ parts

$31.750

1k+ parts

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438

$45.070

$31.750

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Aztec Data Supply Inc.

USA . 2,812 parts In-Stock

1+ parts

$58.552

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2,812

$58.552

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Microchip USA

USA . 1,458 parts In-Stock

1+ parts

$76.457

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1,458

$76.457

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Semicontronic

India . 754 parts In-Stock

1+ parts

$80.460

100+ parts

$78.448

1k+ parts

$78.046

10k+ parts

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754

$80.460

$78.448

$78.046

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UNI Independent Distributors

Spain . 5,874 parts In-Stock

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5,874

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Perfect Parts

USA . 1,120 parts In-Stock

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Argo Parts USA

USA . 1,117 parts In-Stock

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1,117

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Overview

Unleash the power of cutting-edge technology with the MCIMX6S7CVM08ACR by NXP Semiconductors. This high-quality System on Chip offers unparalleled performance and functionality, making it the ideal solution for a wide range of applications. With its advanced features and reliable manufacturer, this product ensures top-notch quality and seamless integration into your projects. Trust NXP Semiconductors to deliver innovation and excellence with the MCIMX6S7CVM08ACR, providing you with the value and benefits you need to stay ahead in today's competitive market.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used in electronic components for its durability and resistance to heat, making the product reliable for long-term use.

Surface Mount: YES

Surface mount technology allows for compact design and efficient assembly, making the product suitable for small and portable electronic devices.

Maximum Supply Voltage: 1.5 V

The low maximum supply voltage reduces power consumption and heat generation, increasing the energy efficiency of the product.

Package Shape: SQUARE

Square packages are efficient in terms of space utilization and alignment during mounting, contributing to the product's overall compactness.

No. of Terminals: 624

Having a high number of terminals allows for a greater degree of connectivity and functionality, increasing the product's versatility.

Minimum Supply Voltage: 1.275 V

The low minimum supply voltage ensures stable operation even in low power conditions, making the product suitable for battery-powered applications.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature range ensures the product's reliability in various environmental conditions, enhancing its durability.

Minimum Operating Temperature: -40 °C

The wide range of minimum operating temperature allows the product to function effectively in extreme cold environments, increasing its usability.

Terminal Finish: TIN SILVER COPPER

This finish provides good conductivity and corrosion resistance, ensuring stable connections and longevity of the product.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy and secure mounting on circuit boards, enhancing the product's assembly efficiency.

Maximum Seated Height: 1.6 mm

The low seated height contributes to the product's slim profile and enables sleek and compact electronic designs.

Width: 21 mm

The moderate width facilitates proper spacing and alignment within electronic assemblies, enhancing the product's compatibility with standard mounting configurations.

Maximum Time At Peak Reflow Temperature (s): 40

The short time at peak reflow temperature minimizes the risk of component damage during the soldering process, ensuring the product's reliability.

Peak Reflow Temperature °C: 260

The high peak reflow temperature allows for efficient soldering and bonding, ensuring strong and reliable connections in the product.

Length: 21 mm

The standard length contributes to the product's overall compactness and compatibility with industry-standard mounting configurations.

Peripheral IC Type: SYSTEM ON CHIP

The system-on-chip integration simplifies circuit design, reduces component count, and enhances overall performance and efficiency of the product.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of digital systems, making the product energy-efficient and versatile.

Terminal Form: BALL

Ball terminal form provides reliable and consistent connections, ensuring secure attachment and stable functionality of the product.

Terminal Pitch: 0.8 mm

The fine terminal pitch allows for high-density mounting and precise alignment, enhancing the product's connectivity and compatibility with modern electronic designs.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates that the product can withstand exposure to a moderate level of moisture during storage and handling, ensuring its reliability and performance in various environmental conditions.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MCIMX6S7CVM08ACR attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

Additional Features:

24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE

JESD-30 Code:

S-PBGA-B624

JESD-609 Code:

e1

Length:

21 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

624

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage:

1.5 V

Minimum Supply Voltage:

1.275 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

21 mm

Peripheral IC Type:

Trade Compliance

MCIMX6S7CVM08ACR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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