Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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MCIMX6S7CVM08ACR by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 105 °C, with supply voltage range of 1.275V to 1.5V. Ideal for applications requiring low profile and fine pitch package style.
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This material is commonly used in electronic components for its durability and resistance to heat, making the product reliable for long-term use.
Surface mount technology allows for compact design and efficient assembly, making the product suitable for small and portable electronic devices.
The low maximum supply voltage reduces power consumption and heat generation, increasing the energy efficiency of the product.
Square packages are efficient in terms of space utilization and alignment during mounting, contributing to the product's overall compactness.
Having a high number of terminals allows for a greater degree of connectivity and functionality, increasing the product's versatility.
The low minimum supply voltage ensures stable operation even in low power conditions, making the product suitable for battery-powered applications.
The high maximum operating temperature range ensures the product's reliability in various environmental conditions, enhancing its durability.
The wide range of minimum operating temperature allows the product to function effectively in extreme cold environments, increasing its usability.
This finish provides good conductivity and corrosion resistance, ensuring stable connections and longevity of the product.
Bottom terminal position facilitates easy and secure mounting on circuit boards, enhancing the product's assembly efficiency.
The low seated height contributes to the product's slim profile and enables sleek and compact electronic designs.
The moderate width facilitates proper spacing and alignment within electronic assemblies, enhancing the product's compatibility with standard mounting configurations.
The short time at peak reflow temperature minimizes the risk of component damage during the soldering process, ensuring the product's reliability.
The high peak reflow temperature allows for efficient soldering and bonding, ensuring strong and reliable connections in the product.
The standard length contributes to the product's overall compactness and compatibility with industry-standard mounting configurations.
The system-on-chip integration simplifies circuit design, reduces component count, and enhances overall performance and efficiency of the product.
CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of digital systems, making the product energy-efficient and versatile.
Ball terminal form provides reliable and consistent connections, ensuring secure attachment and stable functionality of the product.
The fine terminal pitch allows for high-density mounting and precise alignment, enhancing the product's connectivity and compatibility with modern electronic designs.
MSL 3 indicates that the product can withstand exposure to a moderate level of moisture during storage and handling, ensuring its reliability and performance in various environmental conditions.
Other Function uPs,uCs & Peripheral ICs MCIMX6S7CVM08ACR attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors
Additional Features:
JESD-30 Code:
JESD-609 Code:
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MCIMX6S7CVM08ACR Peripheral ICs trade compliance attributes, and parameters.
ECCN
5A992.C
ECCN Governance
EAR
HTS
8542.31.00.01
SB
8542.31.00.00
PCN Design/Specification - Manual Updates 14/Jul/2019 Mult Dev 26/May/2023
PCN Assembly/Origin - Mult Dev A/T Chg 20/Apr/2021
PCN Packaging - Automated Packing Implementation 05/Jul/2023 Mult Dev Pkg Seal 15/Dec/2020
NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.
Executive Director, President, CEO
Kurt Sievers
Executive VP, CFO
Bill Betz
Executive VP, Chief Sales Officer
Ron Martino
ICN8
Fabrication
Fab Initiation
1996
Netherlands
Nijmegen
Wafer Capacity
55,000
ATMC (Austin Tech & Mfg Center)
1995
USA
Austin
30,000
N/A
1989
Germany
Boeblingen
CHD
1993
Chandler
OHTC
1991
24,000
New Expansion Fab
2026
ECHO
2020
10,000
2N2222A
Secos
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .6 A; JEDEC-95 Code: TO-92;
1N4148WS
Good-ark Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
EU2B-YS2J03C
Idec
ROTARY SWITCH;
1N4148
Vishay Intertechnology
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
BAV99
Weitronic Enterprise
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
LL4148
Diotec Semiconductor Ag
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
Motorola
RECTIFIER DIODE; Surface Mount: YES; Maximum Output Current: .1 A; Maximum Reverse Recovery Time: .006 us; Maximum Repetitive Peak Reverse Voltage: 70 V; JESD-609 Code: e0;
EU2B-YS3103F
LM358M
National Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
Leshan Radio
LM358AN
Texas Instruments
LM358AN by Texas Instruments is an Operational Amplifier with 2 functions. It has a Max Input Offset Voltage of 5000 uV and Nominal Common Mode Reject Ratio of 85 dB. Widely used in voltage-feedback applications due to its high Min Voltage Gain of 15000 and Unity Gain Bandwidth of 1000 kHz.
SMBJ18CA
Vishay Semiconductors
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: J BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1552200253
Molex
WIRE AND CABLE;
BSS138BKW,115
NXP Semiconductors
NXP Semiconductors' BSS138BKW,115 is a N-CHANNEL FET with 60V DS breakdown voltage and 0.32A ID. Ideal for SWITCHING applications, it features a built-in diode, 1.6 ohm RDS(on), and operates in ENHANCEMENT MODE. Suitable for surface mount with GULL WING terminals, it meets AEC-Q101 standards.
Pro-an Electronic
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Maximum Clamping Voltage: 29.2 V; Polarity: BIDIRECTIONAL; Nominal Breakdown Voltage: 21.05 V; Maximum Repetitive Peak Reverse Voltage: 18 V;
LM317T
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Package Code: TO-220; Terminal Form: THROUGH-HOLE; No. of Outputs: 1; Package Equivalence Code: SIP3,.1TB;
Fairchild Semiconductor
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Terminal Form: THROUGH-HOLE; Maximum Output Current-1: 1.5 A; No. of Outputs: 1; Qualification Status: Not Qualified;
1N4148WT
Sangdest Microelectronics (Nanjing)
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
MBRS360T3G
Onsemi
MBRS360T3G by Onsemi is a Schottky rectifier diode with a max forward voltage of 0.63V and a max output current of 3A. It is designed for applications requiring high-speed switching and low power loss, making it suitable for use in various electronic devices.
IRLML6401TRPBF
Infineon Technologies
IRLML6401TRPBF by Infineon is a P-CHANNEL FET for SWITCHING applications. It features a 12V DS Breakdown Voltage, 34A IDM, and 0.05ohm RDS(on). With a small outline package style, it operates in an ambient temperature range of -55 to 150 °C.
XCZU11EG-L1FFVC1760I
Xilinx
XCZU11EG-L1FFVC1760I by Xilinx is a MICROPROCESSOR CIRCUIT with 1760 terminals in a GRID ARRAY package. It operates b/w -40 to 100 °C and has a supply voltage range of 0.698V to 0.742V. Ideal for industrial applications requiring high-performance CMOS technology.
ESP32-S3-WROOM-1-N4R2
Espressif Systems (Shanghai)
ESP32-S3-WROOM-1-N4R2 by Espressif Systems is a 41-terminal SoC with CMOS technology. It operates b/w -40 to 85 °C and requires 3-3.6 V supply voltage. Ideal for IoT applications due to its compact size (18x25.5 mm) and surface-mount capability.
NRF52832-QFAA-T
Nordic Semiconductor Asa
NRF52832-QFAA-T by Nordic Semiconductor Asa is a 48-terminal SoC with CMOS technology. It operates b/w -40 to 85 °C and supports supply voltage range of 1.7V to 3.6V. Ideal for applications requiring low-profile, surface-mount chips in various electronic devices.
XCZU25DR-2FSVG1517E
XCZU25DR-2FSVG1517E by Xilinx is a PROGRAMMABLE SoC with CMOS technology. It operates b/w 0-100 °C, with supply voltage range of 0.825-0.876 V. Suitable for various applications requiring high-performance microcontrollers and peripheral ICs in a surface-mount GRID ARRAY package.
XCZU11EG-2FFVC1760I
XCZU11EG-2FFVC1760I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C, with supply voltage range of 0.825V to 0.876V. This GRID ARRAY package is ideal for industrial applications requiring high performance and reliability.
MCIMX286CVM4CR2
MCIMX286CVM4CR2 by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 85 °C, with supply voltage range of 1.35-1.55 V. This low profile, fine pitch IC is ideal for industrial applications requiring high performance in a compact form factor.
CC2541F128RHAT
CC2541F128RHAT by Texas Instruments is a 40-terminal microprocessor circuit with 8192 bytes of RAM. Operating at 3V, it supports I2C, SPI, USART, and USB bus compatibility. Ideal for industrial applications requiring a temperature range of -40 to 85°C.
XCZU7EG-L1FBVB900I
The Xilinx XCZU7EG-L1FBVB900I is a CMOS microprocessor circuit with 900 terminals in a grid array package. It operates b/w -40 to 100 °C and has a supply voltage range of 0.698V to 0.742V. Ideal for industrial applications requiring high-performance processing capabilities.
MCIMX6S7CVM08ACR
MCIMX7D3EVK10SD
MCIMX7D3EVK10SD by NXP Semiconductors is a System on Chip with 488 terminals, operating b/w -20 to 105°C. It has a supply voltage range of 1.2-1.25V and uses CMOS technology. Ideal for applications requiring high performance in compact spaces.
MGM210PA22JIA2R
Silicon Labs
SYSTEM ON CHIP;
Z84C4010PEG
Zilog
Other uPs/uCs/Peripheral ICs; Terminal Finish: MATTE TIN; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 40; JESD-609 Code: e3;
MPFS250TS-FCG1152I
Microchip Technology
MPFS250TS-FCG1152I by Microchip Technology is a programmable SoC with a package style of grid array and 1152 terminals. It operates at a voltage range of 0.97V to 1.03V and has a max seated height of 2.99mm. This IC is commonly used in applications requiring other function uPs, uCs, and peripheral devices.
AM4372BZDNA60
AM4372BZDNA60 by Texas Instruments is a System on Chip with 491 terminals in a low profile grid array package. It operates b/w -40 to 105°C, with supply voltage range of 1.056V to 1.144V. Ideal for industrial applications requiring high performance and reliability in compact designs.
MCIMX257CJM4A
Freescale Semiconductor
SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 400; Package Code: LFBGA; Package Shape: SQUARE;
MPFS250T-1FCG1152I
MPFS250T-1FCG1152I by Microchip Tech is a 1152-terminal programmable SoC with CMOS tech. Operates b/w -40 to 100°C, voltage range of 0.97V to 1.03V. Ideal for applications requiring high-density integrated circuits in compact spaces.
FXLC95000CLR1
FXLC95000CLR1 by NXP Semiconductors is a CMOS microprocessor circuit with 24 terminals and a rectangular package shape. It operates at a min supply voltage of 1.71V and has an industrial temperature grade of -40 to 85°C. This peripheral IC is suitable for various applications requiring low voltage and compact size.
RN2903A-I/RM098
Microchip RN2903A-I/RM098 is a CMOS microprocessor IC with 47 terminals. It operates b/w -40 to 85°C, with supply voltage range of 2.1-3.6V. Ideal for industrial applications requiring TS16949 screening and surface mount compatibility.
XC7Z020-3CLG400E
The Xilinx XC7Z020-3CLG400E is a System on Chip with CMOS technology. It operates b/w 0-100°C, with supply voltage range of 0.95-1.05V. Featuring a grid array package style, it's ideal for applications requiring low profile and fine pitch components in the Other Function uPs,uCs & Peripheral ICs category.
STSPIN32F0B
STMicroelectronics
MICROPROCESSOR CIRCUIT; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Peak Reflow Temperature (C): NOT SPECIFIED;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
MCIMX287CVM4B
MCIMX287CVM4B by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 85 °C and has a supply voltage range of 1.35V to 1.55V. With a grid array package style, it's ideal for industrial applications requiring low profile and fine pitch components.
SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;
MCIMX535DVV1C
MCIMX535DVV1C by NXP Semiconductors is a System on Chip with 529 terminals, operating at -20 to 85°C. It has a supply voltage range of 0.9/1.25-1.3V and peak reflow temperature of 260°C. Ideal for applications requiring high-performance computing in compact form factors.
SYSTEM ON CHIP; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 529; Package Code: FBGA; Package Shape: SQUARE;
MCIMX535DVV1CR2
MCIMX535DVV1CR2 by NXP Semiconductors is a SYSTEM ON CHIP with 529 terminals, operating at -20 to 85 °C. It has a supply voltage range of 0.9/1.25-1.3 V and uses BALL terminal form for various applications in Other Function uPs,uCs & Peripheral ICs.
MCIMX7D5EVM10SD
SYSTEM ON CHIP; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 541; Package Code: LFBGA; Package Shape: SQUARE;
MCIMX6Q6AVT10AD
SYSTEM ON CHIP; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 624; Package Code: FBGA; Package Shape: SQUARE;
MCIMX6Q7CVT08AD
SoC; Terminal Form: BALL; No. of Terminals: 624; Package Code: FBGA; Package Shape: SQUARE; Terminal Finish: TIN SILVER COPPER;
MCIMX6Q7CVT08AD by NXP Semiconductors is a 624-terminal SoC with CMOS technology. It operates b/w -40 to 105 °C, with supply voltage ranging from 1.275V to 1.5V. Ideal for industrial applications requiring fine-pitch grid array package style.
MCIMX6Q6AVT10ADR
MCIMX6Q6AVT10ADR by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 125 °C, suitable for automotive applications. With 624 terminals in a GRID ARRAY package style, it has a low supply voltage range of 1.35-1.5 V for power efficiency.
MCIMX535DVV2C
SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 529; Package Code: FBGA; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): 40;
MCIMX6Y2CVM08AB
MCIMX6Y2CVM08AB by NXP Semiconductors is a low-profile, fine-pitch grid array SoC with 289 terminals. It operates b/w -40 to 105°C and has a supply voltage range of 1.325V to 1.5V. Ideal for applications requiring high-performance computing in compact spaces.
MCIMX6Q5EYM10AD
SYSTEM ON CHIP; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE;
MCIMX6Q5EYM10AD by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w -20 to 105 °C, with a supply voltage range of 1.35V to 1.5V. This IC has a grid array package style, 624 terminals, and is suitable for various uP and uC applications.
MCIMX6Y2DVM09AB
SYSTEM ON CHIP; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;
MCIMX6S7CVM08AC
MCIMX6S7CVM08AC by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 105 °C, with a supply voltage range of 1.275V to 1.5V. This low-profile, fine-pitch IC with 624 terminals is ideal for industrial applications requiring high performance in a compact form factor.
MCIMX6Q7CVT08AE
MCIMX6Q7CVT08AE by NXP Semiconductors is a 624-terminal SoC with CMOS technology. It operates b/w -40 to 105 °C, with supply voltage range of 1.275V to 1.5V. Ideal for industrial applications requiring fine pitch grid array package style.
MCIMX6Y2CVM05AB
MCIMX6Y2CVM05AB by NXP Semiconductors is a low-profile, fine-pitch grid array SoC with 289 terminals. It operates b/w -40 to 105 °C and has a supply voltage range of 1.275V to 1.5V. Ideal for applications requiring high-performance computing in compact spaces.
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