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OMAPL138EZWTA3E

Texas Instruments

OMAPL138EZWTA3E by Texas Instruments

OMAPL138EZWTA3E by Texas Instruments is a MICROPROCESSOR CIRCUIT with 32-bit External Data Bus Width and 50 MHz Max Clock Frequency. It is ideal for industrial applications requiring I2C, SPI, UART, and USB bus compatibility. This low-profile IC operates b/w -40 to 105 °C with a supply voltage range of 1.25V to 1.35V.

Median Price

$32.519

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 273 parts In-Stock

1+ parts

$25.068

100+ parts

$21.896

1k+ parts

$15.101

10k+ parts

-

273

$25.068

$21.896

$15.101

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Mouser Electronics

USA . 64 parts In-Stock

1+ parts

$39.970

100+ parts

$27.850

1k+ parts

-

10k+ parts

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64

$39.970

$27.850

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-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 479 parts In-Stock

1+ parts

$23.815

100+ parts

-

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-

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479

$23.815

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Nova Conductors

Japan . 62 parts In-Stock

1+ parts

$26.270

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62

$26.270

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Vyrian

USA . 6,914 parts In-Stock

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6,914

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 709 parts In-Stock

1+ parts

$16.612

100+ parts

-

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709

$16.612

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-

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Ampacity Inc.

Singapore . 181 parts In-Stock

1+ parts

$21.310

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181

$21.310

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Corphita

USA . 3,505 parts In-Stock

1+ parts

$22.561

100+ parts

-

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3,505

$22.561

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Continental Prestige Electronics

USA . 5,485 parts In-Stock

1+ parts

$26.270

100+ parts

-

1k+ parts

-

10k+ parts

$25.745

5,485

$26.270

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-

$25.745

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$26.270

100+ parts

-

1k+ parts

$24.957

10k+ parts

$24.431

1,000

$26.270

-

$24.957

$24.431

Corohmni

South Africa . 4,907 parts In-Stock

1+ parts

$27.540

100+ parts

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4,907

$27.540

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Semicontronic

India . 181 parts In-Stock

1+ parts

$46.380

100+ parts

$45.220

1k+ parts

$44.989

10k+ parts

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181

$46.380

$45.220

$44.989

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Parana Technologies

USA . 131 parts In-Stock

1+ parts

$63.413

100+ parts

$5,888.895

1k+ parts

$57.072

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131

$63.413

$5,888.895

$57.072

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DigiPath Technology Company

USA . 2,088 parts In-Stock

1+ parts

$69.826

100+ parts

$64.240

1k+ parts

-

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2,088

$69.826

$64.240

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ChromeModa Solutions

Germany . 5,898 parts In-Stock

1+ parts

$71.251

100+ parts

$58.426

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-

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5,898

$71.251

$58.426

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IDEA Electronic Components Group

UK . 378 parts In-Stock

1+ parts

$71.251

100+ parts

$67.688

1k+ parts

$64.126

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378

$71.251

$67.688

$64.126

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Argo Parts USA

USA . 4,013 parts In-Stock

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4,013

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Overview

Unlock the power of advanced technology with the OMAPL138EZWTA3E by Texas Instruments. With a reputation for excellence in manufacturing, this product offers unparalleled quality and reliability. Ideal for a wide range of applications in the category of Other Function uPs,uCs & Peripheral ICs, this versatile device provides customers with exceptional value and benefits. From its innovative design to its cutting-edge technology, the OMAPL138EZWTA3E delivers superior performance and efficiency, making it the perfect choice for all your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and lightweight, making the product suitable for a wide range of applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and reducing production costs.

Maximum Supply Voltage: 1.35 V

The high maximum supply voltage allows for flexibility in power supply options for the product.

Package Shape: SQUARE

The square package shape helps in efficient use of PCB space and layout design.

Package Style: GRID ARRAY, LOW PROFILE, FINE PITCH

This package style allows for high pin count in a compact space, enabling high functionality in a small form factor.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature ensures reliable performance in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for use in a wide range of temperature environments.

Terminal Finish: TIN SILVER COPPER

This terminal finish ensures good electrical conductivity and corrosion resistance for long-term reliability.

Maximum Clock Frequency: 50 MHz

The high maximum clock frequency enables fast processing speeds and high performance.

Nominal Supply Voltage: 1.3 V

The nominal supply voltage provides a stable power source for the product's operation.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs OMAPL138EZWTA3E attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Additional Features:

IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY

Bus Compatibility:

I2C; SPI; UART; USB

Maximum Clock Frequency:

50 MHz

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B361

JESD-609 Code:

e1

Length:

16 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

361

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.4 mm

Speed:

456 rpm

Maximum Supply Voltage:

1.35 V

Minimum Supply Voltage:

1.25 V

Nominal Supply Voltage:

1.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Trade Compliance

OMAPL138EZWTA3E Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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