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OMAPL132BZWT2E

Texas Instruments

OMAPL132BZWT2E by Texas Instruments

OMAPL132BZWT2E by Texas Instruments is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates at a voltage range of 1.14V to 1.32V and features a GRID ARRAY package style with 361 terminals, making it suitable for applications requiring low profile and fine pitch components in electronics design.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,468 parts In-Stock

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2,468

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Digiode

USA . 181 parts In-Stock

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181

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 254 parts In-Stock

1+ parts

$10.959

100+ parts

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254

$10.959

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One Stop Electronics

USA . 1,516 parts In-Stock

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$34.000

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1,516

$34.000

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Corohmni

South Africa . 1,069 parts In-Stock

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$35.119

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1,069

$35.119

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Parana Technologies

USA . 784 parts In-Stock

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$52.447

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784

$52.447

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ChromeModa Solutions

Germany . 6,349 parts In-Stock

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$58.929

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$48.322

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6,349

$58.929

$48.322

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IDEA Electronic Components Group

UK . 318 parts In-Stock

1+ parts

$58.929

100+ parts

$55.983

1k+ parts

$53.036

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318

$58.929

$55.983

$53.036

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Corphita

USA . 1,984 parts In-Stock

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1,984

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DigiPath Technology Company

USA . 790 parts In-Stock

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$53.130

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790

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$53.130

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Overview

Upgrade your electronic devices with the OMAPL132BZWT2E by Texas Instruments, a cutting-edge microprocessor circuit designed to enhance performance and efficiency. Manufactured with precision and expertise, this versatile IC is perfect for a wide range of applications, offering customers unmatched value and benefits. Experience seamless integration and reliability with Texas Instruments' top-notch technology, and unlock new possibilities for your projects. Elevate your designs with the OMAPL132BZWT2E today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the product, ensuring long-term reliability.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and production costs.

Maximum Supply Voltage: 1.32 V

The high maximum supply voltage allows for versatility in different power supply configurations, making the product suitable for a variety of applications.

Package Shape: SQUARE

The square package shape is compact and space-efficient, making it suitable for devices with limited board space.

No. of Terminals: 361

The high number of terminals allows for a wide range of connectivity options, making the product versatile and adaptable to different system requirements.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

This package style offers high-density mounting, low profile design, and fine pitch for efficient PCB layout and space-saving benefits.

Minimum Supply Voltage: 1.14 V

The low minimum supply voltage ensures energy efficiency and can help extend battery life in portable applications.

Terminal Position: BOTTOM

The bottom terminal position simplifies the PCB layout and assembly process, making it convenient for manufacturers to integrate the product into their designs.

Maximum Seated Height: 1.4 mm

The low seated height allows for a slim and compact product profile, ideal for applications where space constraints are a concern.

Width: 16 mm

The compact width of the product enables it to fit into tight spaces or within small devices, increasing design flexibility.

Length: 16 mm

The compact length of the product contributes to its overall small form factor, making it suitable for applications with size limitations.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Being a microprocessor circuit, this product offers advanced processing capabilities, suitable for applications requiring high-speed and complex functions.

Technology: CMOS

CMOS technology provides low power consumption, high noise immunity, and compatibility with a wide range of voltages, making the product energy-efficient and versatile.

Terminal Form: BALL

The ball terminal form offers reliable electrical connections, suitable for applications where high performance and durability are essential.

Nominal Supply Voltage: 1.2 V

The nominal supply voltage is at an optimal level for stable and efficient operation, ensuring reliable performance in various operating conditions.

Terminal Pitch: 0.8 mm

The small terminal pitch allows for high-density mounting and compact PCB design, enabling the product to be used in space-constrained applications.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs OMAPL132BZWT2E attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Additional Features:

IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY

JESD-30 Code:

S-PBGA-B361

Length:

16 mm

No. of Terminals:

361

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.4 mm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

16 mm

Peripheral IC Type:

Trade Compliance

OMAPL132BZWT2E Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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