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OMAPL138EZWT4

Texas Instruments

OMAPL138EZWT4 by Texas Instruments

The Texas Instruments OMAPL138EZWT4 is a MICROPROCESSOR CIRCUIT with 32-bit External Data Bus Width and 50 MHz Max Clock Frequency. It operates b/w 0 to 90 °C, suitable for applications requiring I2C, SPI, UART, USB compatibility in a PLASTIC/EPOXY package style.

Median Price

$37.430

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 801 parts In-Stock

1+ parts

$24.115

100+ parts

$21.064

1k+ parts

$14.527

10k+ parts

-

801

$24.115

$21.064

$14.527

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Mouser Electronics

USA . 275 parts In-Stock

1+ parts

$37.430

100+ parts

$25.150

1k+ parts

$24.970

10k+ parts

-

275

$37.430

$25.150

$24.970

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DigiKey

USA . 55 parts In-Stock

1+ parts

$37.430

100+ parts

$26.934

1k+ parts

$25.835

10k+ parts

-

55

$37.430

$26.934

$25.835

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,789 parts In-Stock

1+ parts

$22.909

100+ parts

-

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2,789

$22.909

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Nova Conductors

Japan . 1,000 parts In-Stock

1+ parts

$25.277

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1,000

$25.277

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Sensible Micro Corp

USA . 15,790 parts In-Stock

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15,790

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Chip Stock

USA . 14,470 parts In-Stock

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14,470

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Vyrian

USA . 5,217 parts In-Stock

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5,217

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Avant Electronics Limited

UK . 360 parts In-Stock

1+ parts

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360

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ComSIT Distribution GmbH

Germany . 231 parts In-Stock

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231

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Inventory MP

USA . 5 parts In-Stock

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5

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Bristol Electronics

USA . 5 parts In-Stock

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5

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 317 parts In-Stock

1+ parts

$20.500

100+ parts

-

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317

$20.500

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Corphita

USA . 4,431 parts In-Stock

1+ parts

$21.704

100+ parts

-

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4,431

$21.704

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Continental Prestige Electronics

USA . 2,857 parts In-Stock

1+ parts

$25.277

100+ parts

-

1k+ parts

-

10k+ parts

$24.771

2,857

$25.277

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-

$24.771

Netroflash

USA . 50 parts In-Stock

1+ parts

$25.277

100+ parts

-

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50

$25.277

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Corohmni

South Africa . 1,117 parts In-Stock

1+ parts

$25.277

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1,117

$25.277

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Component Stockers USA

USA . 1,187 parts In-Stock

1+ parts

$27.640

100+ parts

$21.770

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1,187

$27.640

$21.770

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Semicontronic

India . 312 parts In-Stock

1+ parts

$44.610

100+ parts

$43.495

1k+ parts

$43.272

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312

$44.610

$43.495

$43.272

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Parana Technologies

USA . 1,880 parts In-Stock

1+ parts

$53.514

100+ parts

-

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1,880

$53.514

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ChromeModa Solutions

Germany . 6,437 parts In-Stock

1+ parts

$60.128

100+ parts

$49.305

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6,437

$60.128

$49.305

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IDEA Electronic Components Group

UK . 1,941 parts In-Stock

1+ parts

$60.128

100+ parts

$57.122

1k+ parts

$54.115

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1,941

$60.128

$57.122

$54.115

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A-Z Elektronik GmbH

Germany . 6,844 parts In-Stock

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6,844

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Lixinc

USA . 5,897 parts In-Stock

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5,897

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Argo Parts USA

USA . 4,624 parts In-Stock

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Futuretech Components

Singapore . 3,000 parts In-Stock

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Kepictronics

USA . 3,000 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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DigiPath Technology Company

USA . 1,268 parts In-Stock

1+ parts

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$54.211

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1,268

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$54.211

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Perfect Parts

USA . 935 parts In-Stock

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935

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Overview

Enhance your electronic design projects with the OMAPL138EZWT4 by Texas Instruments. This top-of-the-line microprocessor circuit offers unparalleled quality and reliability, thanks to its renowned manufacturer. Perfect for a wide range of applications, this peripheral IC provides seamless integration with I2C, SPI, UART, and USB buses. With a maximum clock frequency of 50 MHz and a low profile package shape, this device delivers exceptional performance while maximizing space efficiency. Trust in Texas Instruments to bring you cutting-edge technology that exceeds expectations. Elevate your projects with the OMAPL138EZWT4 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protects internal components from external elements

Surface Mount: YES

Easily mounted onto a PCB without the need for additional hardware, saving space and simplifying assembly

Maximum Supply Voltage: 1.35 V

Efficient power consumption and compatibility with various power sources

Package Shape: SQUARE

Optimal use of space on the PCB

No. of Terminals: 361

Provides a wide range of connectivity options for peripherals and external devices

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Enhances signal integrity and thermal performance

Minimum Supply Voltage: 1.25 V

Allows for operation in low-power environments

Maximum Operating Temperature: 90 °C

Ensures reliable performance in high-temperature environments

Minimum Operating Temperature: 0 °C

Wide temperature range for operation in various conditions

Terminal Finish: TIN SILVER COPPER

Provides excellent conductivity and corrosion resistance

Terminal Position: BOTTOM

Easy access for soldering and connecting to the PCB

Maximum Seated Height: 1.4 mm

Low-profile design for compact applications

Width: 16 mm

Compact form factor for space-constrained designs

External Data Bus Width: 32

High data transfer capability for efficient communication

Maximum Clock Frequency: 50 MHz

High-speed processing for quick response times

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper soldering during assembly

Peak Reflow Temperature °C: 260

Optimal temperature for soldering and board attachment

Length: 16 mm

Square shape for uniform dimensions on all sides

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Integrated microprocessor for advanced functionality and processing capabilities

Technology: CMOS

Low power consumption and high noise immunity

Terminal Form: BALL

Ball terminals for reliable connections and ease of soldering

Nominal Supply Voltage: 1.3 V

Stable voltage supply for consistent performance

Bus Compatibility: I2C; SPI; UART; USB

Wide range of communication protocols for connecting to various devices

Terminal Pitch: 0.8 mm

Fine pitch for high-density mounting and improved signal integrity

Moisture Sensitivity Level (MSL): 3

Moderate sensitivity to moisture for reliability in humid environments

Speed: 456 rpm

High processing speed for quick data handling and responsiveness

Technical Specifications

Other Function uPs,uCs & Peripheral ICs OMAPL138EZWT4 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Additional Features:

IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY

Bus Compatibility:

I2C; SPI; UART; USB

Maximum Clock Frequency:

50 MHz

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B361

JESD-609 Code:

e1

Length:

16 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

361

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.4 mm

Speed:

456 rpm

Maximum Supply Voltage:

1.35 V

Minimum Supply Voltage:

1.25 V

Nominal Supply Voltage:

1.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Trade Compliance

OMAPL138EZWT4 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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