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OMAPL132EZWTA2

Texas Instruments

OMAPL132EZWTA2 by Texas Instruments

OMAPL132EZWTA2 by Texas Instruments is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates at speeds up to 200 rpm and has a low profile GRID ARRAY package style. Ideal for industrial applications, it has a wide temperature range from -40 to 105 °C.

Median Price

$15.187

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 53,976 parts In-Stock

1+ parts

$15.187

100+ parts

$13.266

1k+ parts

$9.149

10k+ parts

-

53,976

$15.187

$13.266

$9.149

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,598 parts In-Stock

1+ parts

$14.428

100+ parts

-

1k+ parts

-

10k+ parts

-

1,598

$14.428

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-

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Chip Stock

USA . 4,500 parts In-Stock

1+ parts

-

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4,500

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-

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Vyrian

USA . 3,403 parts In-Stock

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3,403

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,455 parts In-Stock

1+ parts

$13.668

100+ parts

-

1k+ parts

-

10k+ parts

-

4,455

$13.668

-

-

-

Parana Technologies

USA . 197 parts In-Stock

1+ parts

$16.955

100+ parts

-

1k+ parts

$17.185

10k+ parts

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197

$16.955

-

$17.185

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Corohmni

South Africa . 251 parts In-Stock

1+ parts

$17.540

100+ parts

-

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251

$17.540

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-

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ChromeModa Solutions

Germany . 6,646 parts In-Stock

1+ parts

$19.051

100+ parts

$15.622

1k+ parts

-

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6,646

$19.051

$15.622

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-

IDEA Electronic Components Group

UK . 2,306 parts In-Stock

1+ parts

$19.051

100+ parts

$18.098

1k+ parts

$17.146

10k+ parts

-

2,306

$19.051

$18.098

$17.146

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AZTECH Wire

Italy . 1,123 parts In-Stock

1+ parts

$21.960

100+ parts

-

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10k+ parts

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1,123

$21.960

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

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100+ parts

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5,000

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Futuretech Components

Singapore . 2,190 parts In-Stock

1+ parts

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2,190

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A-Z Elektronik GmbH

Germany . 1,540 parts In-Stock

1+ parts

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100+ parts

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1,540

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DigiPath Technology Company

USA . 1,521 parts In-Stock

1+ parts

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100+ parts

$17.176

1k+ parts

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10k+ parts

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1,521

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$17.176

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Overview

Unlock a world of possibilities with the Texas Instruments OMAPL132EZWTA2. Crafted with precision and expertise, this innovative product is designed to deliver unmatched performance in a variety of applications. Whether you're looking to enhance your microprocessor circuit or upgrade your peripheral ICs, this cutting-edge technology offers exceptional value, reliability, and efficiency. Trust in Texas Instruments to provide you with the tools you need to take your projects to the next level. Elevate your work with the OMAPL132EZWTA2 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides good thermal and electrical insulation, making the product reliable and durable.

Surface Mount: YES

Surface mount technology allows for efficient and space-saving assembly of the product onto circuit boards.

Maximum Supply Voltage: 1.32 V

High maximum supply voltage ensures compatibility with a wide range of power sources, increasing versatility.

Package Shape: SQUARE

Square package shape helps with easy positioning and alignment during manufacturing processes.

No. of Terminals: 361

Large number of terminals enables complex connectivity and functionality within the product.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Grid array package style with low profile and fine pitch design aids in high-density mounting and signal routing.

Minimum Supply Voltage: 1.14 V

Low minimum supply voltage ensures efficient power consumption and operation of the product.

Maximum Operating Temperature: 105 °C

High maximum operating temperature allows for reliable performance in industrial environments with elevated temperatures.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature ensures the product can withstand cold conditions without performance issues.

Terminal Finish: TIN SILVER COPPER

Terminal finish with Tin Silver Copper plating offers good electrical conductivity and corrosion resistance.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy mounting on PCBs and efficient heat dissipation.

Maximum Seated Height: 1.4 mm

Low maximum seated height allows for compact integration of the product in space-constrained applications.

Width: 16 mm

Compact width dimension enables the product to fit into tight spaces for various design requirements.

Maximum Time At Peak Reflow Temperature (s): 30

Long time at peak reflow temperature allows for proper soldering and connection reliability during manufacturing.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures effective bonding of components during assembly processes.

Length: 16 mm

Optimal length dimension helps in maintaining a balanced form factor for the product in diverse applications.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures the product can operate reliably in harsh environmental conditions.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Microprocessor circuit integration provides advanced processing capabilities and versatility for various applications.

Technology: CMOS

CMOS technology offers low power consumption and high integration density, enhancing the product's efficiency.

Terminal Form: BALL

Ball terminal form enables efficient soldering and connectivity for robust electrical connections.

Nominal Supply Voltage: 1.2 V

Stable nominal supply voltage ensures consistent performance and power efficiency in the product.

Terminal Pitch: 0.8 mm

Fine terminal pitch enables high-density mounting and precise connection in compact electronic designs.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate sensitivity to moisture, which is suitable for standard manufacturing and handling processes.

Speed: 200 rpm

Operating at 200 rpm speed, the product can handle high-speed data processing and communication tasks efficiently.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs OMAPL132EZWTA2 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Additional Features:

IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY

JESD-30 Code:

S-PBGA-B361

JESD-609 Code:

e1

Length:

16 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

361

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.4 mm

Speed:

200 rpm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Trade Compliance

OMAPL132EZWTA2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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