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XCZU7EV-3FFVC1156E

Xilinx

XCZU7EV-3FFVC1156E by Xilinx

XCZU7EV-3FFVC1156E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100 °C, with supply voltage range of 0.873-0.927 V. This GRID ARRAY package is ideal for applications requiring high-performance processing in compact form factors.

Median Price

$6,235.400

Lifecycle Status

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4

In-Stock Inventory

1k+

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Nova Conductors

Japan . 200 parts In-Stock

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$6,235.400

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Vyrian

USA . 1,237 parts In-Stock

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VNN

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Digiode

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Semicontronic

India . 833 parts In-Stock

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$9.000

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$8.775

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$8.730

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AZTECH Wire

Italy . 355 parts In-Stock

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Modulus Dynamics

Lithuania . 525 parts In-Stock

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$13.850

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$13.850

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Corohmni

South Africa . 1,868 parts In-Stock

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$15.515

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Ampacity Inc.

Singapore . 1,191 parts In-Stock

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$17.000

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One Stop Electronics

USA . 485 parts In-Stock

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MARBEL Systems

Belgium . 1,832 parts In-Stock

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Texas Native Microelectronics

USA . 450 parts In-Stock

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$39.129

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Kenton Components

USA . 2,819 parts In-Stock

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$46.955

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$41.320

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Qasali Group International

UK . 450 parts In-Stock

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$105.648

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$92.971

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Aranea Global

USA . 1,000 parts In-Stock

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$5,866.264

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Argo Parts USA

USA . 3,234 parts In-Stock

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$6,173.046

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$6,110.692

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$6,048.338

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$6,110.692

$6,048.338

Continental Prestige Electronics

USA . 34 parts In-Stock

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$6,235.400

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QUARKTWIN TECHNOLOGY LTD

USA . 18,981 parts In-Stock

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Supply Digital

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Corphita

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Vigor

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Overview

Unleash the power of cutting-edge technology with the XCZU7EV-3FFVC1156E by Xilinx. Known for their top-notch quality and reliability, Xilinx delivers unmatched performance in the category of Other Function uPs, uCs & Peripheral ICs. This innovative product offers customers a seamless experience, providing superior value and benefits while catering to a wide range of applications. Elevate your projects with the XCZU7EV-3FFVC1156E and discover the endless possibilities it brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides good durability and protection for the components inside, ensuring a longer lifespan for the product.

Surface Mount: YES

Being surface mountable makes it easy to integrate this product into various electronic designs, saving space and providing flexibility in placement.

Maximum Supply Voltage: 0.927 V

The maximum supply voltage of 0.927 V indicates that this product can operate efficiently with low power consumption, making it suitable for energy-efficient applications.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy integration and assembly in electronic circuits, providing a compact and neat design.

No. of Terminals: 1156

With a high number of terminals, this product offers a wide range of connectivity options, making it versatile for use in various applications.

Package Style (Meter): GRID ARRAY

The grid array package style provides efficient heat dissipation and enhances electrical performance, making this product suitable for high-performance applications.

Minimum Supply Voltage: 0.873 V

The low minimum supply voltage of 0.873 V allows for reliable operation even in low-voltage conditions, making this product suitable for battery-powered devices.

Maximum Operating Temperature: 100 °C

The high maximum operating temperature of 100°C ensures that this product can withstand elevated temperatures without compromising performance, making it suitable for industrial applications.

Minimum Operating Temperature: 0 °C

The minimum operating temperature of 0°C ensures that this product can operate reliably even in cold environments, making it versatile for use in various conditions.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

The use of tin/silver/copper terminal finish provides good conductivity and corrosion resistance, ensuring reliable connectivity and longevity of the product.

Terminal Position: BOTTOM

Having the terminals positioned at the bottom simplifies the assembly process and allows for easy connection with other components, enhancing overall ease of use.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature of 30 seconds reduces the risk of thermal damage during soldering, ensuring the longevity and reliability of the product.

Peak Reflow Temperature °C: 245

The peak reflow temperature of 245°C allows for efficient soldering and assembly processes, ensuring a strong and reliable connection for the product.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

With a microprocessor circuit as the peripheral IC type, this product offers advanced processing capabilities, making it suitable for complex computing tasks and applications.

Technology: CMOS

The CMOS technology used in this product provides low power consumption and high noise immunity, making it energy-efficient and reliable for various electronic applications.

Terminal Form: BALL

Having a ball terminal form simplifies the assembly process and improves solder joint reliability, ensuring easy integration and longevity of the product.

Nominal Supply Voltage: 0.9 V

The nominal supply voltage of 0.9 V indicates the optimal operating voltage for this product, ensuring efficient performance and compatibility with various power sources.

Moisture Sensitivity Level (MSL): 4

The moisture sensitivity level of 4 indicates that this product can withstand moderate exposure to moisture without compromising performance, making it suitable for a wide range of environmental conditions.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XCZU7EV-3FFVC1156E attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

R-PBGA-B1156

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Maximum Supply Voltage:

.927 V

Minimum Supply Voltage:

.873 V

Nominal Supply Voltage:

.9 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

XCZU7EV-3FFVC1156E Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.4

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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