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MSP430F67791AIPZR

Texas Instruments

MSP430F67791AIPZR by Texas Instruments

MSP430F67791AIPZR by Texas Instruments is a 16-bit microprocessor circuit with 6 ADC channels and 3 DMA channels. It has a max clock frequency of 0.032768 MHz and is commonly used in industrial applications requiring low power consumption.

Median Price

$17.040

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 88,983 parts In-Stock

1+ parts

$9.054

100+ parts

$7.908

1k+ parts

$5.454

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-

88,983

$9.054

$7.908

$5.454

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DigiKey

USA . 1,556 parts In-Stock

1+ parts

$17.040

100+ parts

$11.662

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$10.922

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-

1,556

$17.040

$11.662

$10.922

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Mouser Electronics

USA . 748 parts In-Stock

1+ parts

$18.300

100+ parts

$12.490

1k+ parts

$11.110

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-

748

$18.300

$12.490

$11.110

-

Distributors (In-Stock)

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Nova Conductors

Japan . 99 parts In-Stock

1+ parts

$7.866

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-

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99

$7.866

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Digiode

USA . 935 parts In-Stock

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$8.601

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935

$8.601

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Maritex

Poland . 990 parts In-Stock

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$16.276

100+ parts

$10.159

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$8.249

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990

$16.276

$10.159

$8.249

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Vyrian

USA . 30,178 parts In-Stock

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Chip Stock

USA . 5,456 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 30,371 parts In-Stock

1+ parts

$7.700

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-

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30,371

$7.700

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Semicontronic

India . 30,095 parts In-Stock

1+ parts

$7.700

100+ parts

$7.508

1k+ parts

$7.469

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30,095

$7.700

$7.508

$7.469

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Continental Prestige Electronics

USA . 5,720 parts In-Stock

1+ parts

$7.866

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$7.709

5,720

$7.866

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-

$7.709

Netroflash

USA . 500 parts In-Stock

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$7.866

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$7.866

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Corphita

USA . 684 parts In-Stock

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$8.149

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684

$8.149

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Corohmni

South Africa . 3,138 parts In-Stock

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$24.594

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3,138

$24.594

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Parana Technologies

USA . 2,198 parts In-Stock

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$74.928

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$74.928

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IDEA Electronic Components Group

UK . 1,816 parts In-Stock

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$84.189

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$79.980

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$75.770

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1,816

$84.189

$79.980

$75.770

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ChromeModa Solutions

Germany . 1,618 parts In-Stock

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$84.189

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$69.035

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1,618

$84.189

$69.035

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Lixinc

USA . 17,981 parts In-Stock

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Argo Parts USA

USA . 3,310 parts In-Stock

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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Futuretech Components

Singapore . 1,000 parts In-Stock

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Kepictronics

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A-Z Elektronik GmbH

Germany . 1,000 parts In-Stock

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DigiPath Technology Company

USA . 692 parts In-Stock

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$75.905

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iodParts Technologies Inc.

India . 10 parts In-Stock

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Overview

Discover the MSP430F67791AIPZR, a high-quality microprocessor circuit designed by Texas Instruments. Offering incredible value and benefits, this innovative product is perfect for a wide range of applications. With its advanced features, including 6-channel 10-bit analog-to-digital converters, PWM channels, and connectivity options like I2C, IRDA, SPI, and UART, this microprocessor circuit provides unparalleled performance and flexibility. Whether you're looking to enhance industrial automation systems or create cutting-edge IoT devices, the MSP430F67791AIPZR delivers outstanding results. Trust in Texas Instruments' expertise and choose this reliable solution for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material makes the package lightweight and durable, ideal for portable or rugged applications.

Maximum Supply Voltage: 3.6 V

High maximum supply voltage allows for flexibility in power supply options and compatibility with a wide range of systems.

CPU Family: MSP430

The MSP430 CPU family is known for its low power consumption, making it suitable for energy-efficient devices.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Having a microprocessor circuit as a peripheral IC enhances the functionality and processing capabilities of the product.

Analog To Digital Convertors: 6-Ch 10-Bit

Multiple analog to digital converters with 10-bit resolution provide accurate and efficient conversion of analog signals.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F67791AIPZR attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY

Address Bus Width:

0

Bit Size:

16

Bus Compatibility:

I2C; SPI; UART

CPU Family:

MSP430

Maximum Clock Frequency:

.032768 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

62

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

32768

RAM Words:

32

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRDA(4), SPI(6), UART(4)

Peripherals:

BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT

Analog To Digital Convertors:

6-Ch 10-Bit

Trade Compliance

MSP430F67791AIPZR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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