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MSP430F6779AIPEUR

Texas Instruments

MSP430F6779AIPEUR by Texas Instruments

MSP430F6779AIPEUR by Texas Instruments is a 16-bit microprocessor with 128 terminals, 524288 ROM words, and 32 RAM words. It features 6 ADC channels, DMA support, and peripherals like BOR and RTC. Ideal for industrial applications requiring low power consumption and high performance in a compact form factor.

Median Price

$12.680

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 961 parts In-Stock

1+ parts

$9.321

100+ parts

$8.142

1k+ parts

$5.615

10k+ parts

-

961

$9.321

$8.142

$5.615

-

Mouser Electronics

USA . 1,436 parts In-Stock

1+ parts

$16.040

100+ parts

$10.930

1k+ parts

$9.710

10k+ parts

-

1,436

$16.040

$10.930

$9.710

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DigiKey

USA . 1,406 parts In-Stock

1+ parts

-

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1,406

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Distributors (In-Stock)

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Digiode

USA . 452 parts In-Stock

1+ parts

$8.855

100+ parts

-

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452

$8.855

-

-

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Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$11.493

100+ parts

-

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50

$11.493

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Chip Stock

USA . 3,659 parts In-Stock

1+ parts

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3,659

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Vyrian

USA . 1,038 parts In-Stock

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-

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1,038

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Distributors (Availability)

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Semicontronic

India . 1,126 parts In-Stock

1+ parts

$7.920

100+ parts

$7.722

1k+ parts

$7.682

10k+ parts

-

1,126

$7.920

$7.722

$7.682

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Corphita

USA . 204 parts In-Stock

1+ parts

$8.389

100+ parts

-

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10k+ parts

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204

$8.389

-

-

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Continental Prestige Electronics

USA . 2,731 parts In-Stock

1+ parts

$11.493

100+ parts

-

1k+ parts

-

10k+ parts

$11.263

2,731

$11.493

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-

$11.263

Netroflash

USA . 50 parts In-Stock

1+ parts

$11.493

100+ parts

-

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50

$11.493

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-

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Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$11.723

100+ parts

$11.723

1k+ parts

$11.723

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500

$11.723

$11.723

$11.723

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Ampacity Inc.

Singapore . 1,273 parts In-Stock

1+ parts

$17.240

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1,273

$17.240

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Corohmni

South Africa . 159 parts In-Stock

1+ parts

$33.194

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159

$33.194

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Parana Technologies

USA . 1,652 parts In-Stock

1+ parts

$48.169

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1,652

$48.169

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DigiPath Technology Company

USA . 1,832 parts In-Stock

1+ parts

$53.041

100+ parts

$48.797

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1,832

$53.041

$48.797

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ChromeModa Solutions

Germany . 3,631 parts In-Stock

1+ parts

$54.123

100+ parts

$44.381

1k+ parts

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3,631

$54.123

$44.381

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IDEA Electronic Components Group

UK . 1,408 parts In-Stock

1+ parts

$54.123

100+ parts

$51.417

1k+ parts

$48.711

10k+ parts

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1,408

$54.123

$51.417

$48.711

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Lixinc

USA . 6,734 parts In-Stock

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6,734

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Argo Parts USA

USA . 2,860 parts In-Stock

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2,860

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Robosynatics

Brazil . 200 parts In-Stock

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200

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Lucentia Tech

USA . 200 parts In-Stock

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200

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Overview

Elevate your projects with the MSP430F6779AIPEUR by Texas Instruments, a top-tier manufacturer known for cutting-edge technology. This versatile microprocessor circuit offers unparalleled performance and reliability in a compact, low-profile package. With a wide range of peripherals including ADC channels and DMA channels, this product is perfect for a variety of applications. Experience seamless connectivity with I2C, IRDA, SPI, and UART options. Trust in Texas Instruments to deliver quality and innovation, making your projects stand out from the rest.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, perfect for portable electronic devices.

Maximum Supply Voltage: 3.6 V

Allows for a higher supply voltage, providing flexibility in power supply options for various applications.

Bit Size: 16

A 16-bit architecture allows for more precise calculations and data processing compared to lower bit sizes, enhancing overall performance.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

The inclusion of a microprocessor circuit enables advanced control and processing capabilities, making this product suitable for complex tasks.

Maximum Clock Frequency: 0.032768 MHz

With a high maximum clock frequency, the product can perform tasks quickly and efficiently, meeting the demands of time-sensitive applications.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F6779AIPEUR attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY

Address Bus Width:

0

Bit Size:

16

Bus Compatibility:

I2C; SPI; UART

CPU Family:

MSP430

Maximum Clock Frequency:

.032768 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

R-PQFP-G128

JESD-609 Code:

e4

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

90

No. of Terminals:

128

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

32768

RAM Words:

32

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRDA(4), SPI(6), UART(4)

Peripherals:

BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT

Analog To Digital Convertors:

6-Ch 10-Bit

Trade Compliance

MSP430F6779AIPEUR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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