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MCIMX6D7CVT08AD

NXP Semiconductors

MCIMX6D7CVT08AD by NXP Semiconductors

MCIMX6D7CVT08AD by NXP Semiconductors is a 624-terminal SoC with CMOS technology. It operates b/w -40 to 105 °C, with supply voltage ranging from 1.275V to 1.5V. Ideal for industrial applications requiring fine pitch grid array packages in a compact square shape.

Median Price

$59.830

Lifecycle Status

Suppliers In-Stock

24

In-Stock Inventory

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Arrow

USA . 12 parts In-Stock

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Verical

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Chip1Stop

Japan . 652 parts In-Stock

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DigiKey

USA . 576 parts In-Stock

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$95.820

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$73.170

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Mouser Electronics

USA . 186 parts In-Stock

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$95.820

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Avnet

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Rochester

USA . 1,617 parts In-Stock

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Flip Electronics (Authorized)

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Digiode

USA . 1,156 parts In-Stock

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DF Sales Co.

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DF Sales Co.

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Nova Conductors

Japan . 46 parts In-Stock

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Vyrian

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DigiKey Marketplace

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Bristol Electronics

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Chip Stock

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Anansix

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Flip Electronics

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ACDS - Activité Composants Distribution Service

France . 148 parts In-Stock

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Cyclops Electronics Ltd

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Atlantic Semiconductor

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Semicontronic

India . 420 parts In-Stock

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$41.310

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$40.277

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$40.071

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Ampacity Inc.

Singapore . 463 parts In-Stock

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Corphita

USA . 1,897 parts In-Stock

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Corohmni

South Africa . 36 parts In-Stock

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Component Stockers USA

USA . 4,659 parts In-Stock

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$60.670

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Continental Prestige Electronics

USA . 5,902 parts In-Stock

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Netroflash

USA . 1,000 parts In-Stock

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Aztec Data Supply Inc.

USA . 2,895 parts In-Stock

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Modulus Dynamics

Lithuania . 2,012 parts In-Stock

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Microchip USA

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A-Z Elektronik GmbH

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S.R.D Solutions

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Perfect Parts

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Futuretech Components

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Robosynatics

Brazil . 771 parts In-Stock

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Lucentia Tech

USA . 771 parts In-Stock

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Lixinc

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Authorized Procurement Solutions

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Overview

Experience the pinnacle of innovation with the MCIMX6D7CVT08AD by NXP Semiconductors, a leading manufacturer in the semiconductor industry. This cutting-edge product falls under the category of Other Function uPs,uCs & Peripheral ICs, offering unparalleled quality and reliability. With a wide range of applications, this device is designed to exceed expectations in industrial settings. Unlock the potential of your projects with the MCIMX6D7CVT08AD, providing exceptional value, benefits, and advantages to customers seeking top-notch performance and efficiency. Elevate your work to new heights with this state-of-the-art technology from NXP Semiconductors.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and protection for the internal components of the product.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards.

Maximum Supply Voltage: 1.5 V

This higher maximum supply voltage allows for flexibility in power requirements for various applications.

Package Shape: SQUARE

The square shape of the package allows for efficient use of space on the circuit board.

No. of Terminals: 624

Having a high number of terminals allows for a greater degree of connectivity and functionality.

Maximum Operating Temperature: 105 °C

This high operating temperature range ensures the product can perform reliably in various environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MCIMX6D7CVT08AD attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

Additional Features:

EACH GPIO MODULE SUPPORTS 32 BITS OF I/O

JESD-30 Code:

S-PBGA-B624

JESD-609 Code:

e1

Length:

21 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

624

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA624,25X25,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

2.16 mm

Maximum Supply Voltage:

1.5 V

Minimum Supply Voltage:

1.275 V

Nominal Supply Voltage:

1.4 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

21 mm

Peripheral IC Type:

SoC

Trade Compliance

MCIMX6D7CVT08AD Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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