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AM6442BSFGHAALV

Texas Instruments

AM6442BSFGHAALV by Texas Instruments

AM6442BSFGHAALV by Texas Instruments is a SYSTEM ON CHIP with CMOS technology. It operates at speeds up to 1000 rpm and has a max supply voltage of 0.79 V. This IC is ideal for applications requiring high performance in a compact form factor, such as mobile devices and IoT products.

Median Price

$32.788

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 7,434 parts In-Stock

1+ parts

$26.295

100+ parts

$23.373

1k+ parts

$17.186

10k+ parts

-

7,434

$26.295

$23.373

$17.186

-

Mouser Electronics

USA . 232 parts In-Stock

1+ parts

$39.280

100+ parts

$27.470

1k+ parts

-

10k+ parts

-

232

$39.280

$27.470

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-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$22.307

100+ parts

-

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-

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300

$22.307

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-

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Digiode

USA . 2,189 parts In-Stock

1+ parts

$24.980

100+ parts

-

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2,189

$24.980

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-

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Vyrian

USA . 6,701 parts In-Stock

1+ parts

-

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6,701

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VNN

France . 1,000 parts In-Stock

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1,000

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aranea Global

USA . 2,000 parts In-Stock

1+ parts

$21.861

100+ parts

-

1k+ parts

$20.987

10k+ parts

-

2,000

$21.861

-

$20.987

-

Semicontronic

India . 3,556 parts In-Stock

1+ parts

$22.350

100+ parts

$21.791

1k+ parts

$21.680

10k+ parts

-

3,556

$22.350

$21.791

$21.680

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Ampacity Inc.

Singapore . 3,346 parts In-Stock

1+ parts

$22.350

100+ parts

-

1k+ parts

-

10k+ parts

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3,346

$22.350

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Corphita

USA . 2,611 parts In-Stock

1+ parts

$23.666

100+ parts

-

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2,611

$23.666

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Corohmni

South Africa . 44 parts In-Stock

1+ parts

$80.440

100+ parts

-

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44

$80.440

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Argo Parts USA

USA . 1,327 parts In-Stock

1+ parts

-

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1,327

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Continental Prestige Electronics

USA . 305 parts In-Stock

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305

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Robosynatics

Brazil . 250 parts In-Stock

1+ parts

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250

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Lucentia Tech

USA . 250 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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250

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Overview

Experience cutting-edge technology with the AM6442BSFGHAALV by Texas Instruments. This high-quality product offers unmatched performance and reliability, thanks to the renowned reputation of its manufacturer. Perfect for a wide range of applications in the category of Other Function uPs,uCs & Peripheral ICs, this versatile device provides customers with exceptional value, benefits, and advantages. Trust Texas Instruments to deliver innovation that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for various applications.

Surface Mount: YES

Being surface mountable allows for easier and more efficient assembly on circuit boards.

Maximum Supply Voltage: 0.79 V

With a high maximum supply voltage, the product can handle a certain level of power without getting damaged.

Package Shape: SQUARE

The square shape of the package provides a compact design, saving space on the circuit board.

No. of Terminals: 441

Having a high number of terminals allows for more connectivity options and functionality in the product.

Minimum Operating Temperature: -40 °C

The wide operating temperature range ensures the product can function effectively even in harsh environments.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs AM6442BSFGHAALV attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 0.85V NOMINAL SUPPLY

JESD-30 Code:

S-PBGA-B441

Length:

17.2 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

441

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA441,21X21,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

250

Maximum Seated Height:

2.652 mm

Speed:

1000 rpm

Maximum Supply Voltage:

.79 V

Minimum Supply Voltage:

.715 V

Nominal Supply Voltage:

.75 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

17.2 mm

Peripheral IC Type:

Trade Compliance

AM6442BSFGHAALV Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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