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AM6421BSDGHAALV

Texas Instruments

AM6421BSDGHAALV by Texas Instruments

AM6421BSDGHAALV by Texas Instruments is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 105 °C, with supply voltage range of 0.715V to 0.79V. This GRID ARRAY IC in PLASTIC/EPOXY package is ideal for applications requiring high performance and compact design.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,474 parts In-Stock

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Digiode

USA . 2,900 parts In-Stock

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VNN

France . 1,383 parts In-Stock

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Nova Conductors

Japan . 300 parts In-Stock

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300

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Semicontronic

India . 1,484 parts In-Stock

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$1.000

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$0.975

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$0.970

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1,484

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One Stop Electronics

USA . 933 parts In-Stock

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$3.000

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933

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Corohmni

South Africa . 388 parts In-Stock

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$6.490

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388

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AZTECH Wire

Italy . 549 parts In-Stock

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$18.821

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Ampacity Inc.

Singapore . 432 parts In-Stock

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$27.000

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Continental Prestige Electronics

USA . 5,404 parts In-Stock

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Corphita

USA . 2,873 parts In-Stock

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Argo Parts USA

USA . 1,241 parts In-Stock

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Robosynatics

Brazil . 900 parts In-Stock

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900

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Lucentia Tech

USA . 900 parts In-Stock

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900

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Bastille Electronics

Australia . 300 parts In-Stock

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Overview

Experience unparalleled performance and reliability with the Texas Instruments AM6421BSDGHAALV. As a leading manufacturer in the industry, Texas Instruments delivers cutting-edge technology that exceeds expectations. Ideal for a wide range of applications, this product offers unmatched value and benefits to customers. Say goodbye to compromise and hello to quality with the AM6421BSDGHAALV. Elevate your projects with confidence and trust in a product that delivers results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and reliability to the product.

Surface Mount: YES

Allows for easy and efficient installation of the product on a circuit board.

Maximum Supply Voltage: 0.79 V

Operates efficiently within a safe voltage range to prevent damage.

Package Shape: SQUARE

Square shape is compact and space-saving, ideal for densely populated circuit boards.

No. of Terminals: 441

Having a high number of terminals allows for connectivity with various components, enhancing functionality.

Package Style (Meter): GRID ARRAY, FINE PITCH

Grid array with fine pitch design provides a high level of integration and performance.

Minimum Supply Voltage: 0.715 V

Allows the product to function efficiently even at lower voltage levels.

Maximum Operating Temperature: 105 °C

Capable of operating at high temperatures without compromising performance.

Minimum Operating Temperature: -40 °C

Can withstand extremely low temperatures, ensuring reliability in various environments.

Terminal Position: BOTTOM

Bottom terminal position offers easy access and connectivity for smooth installation.

Maximum Seated Height: 2.652 mm

Low seated height allows for slim and compact product design.

Width: 17.2 mm

Compact width makes the product suitable for applications with space constraints.

Length: 17.2 mm

Short length adds to the product's compact and space-saving design.

Peripheral IC Type: SYSTEM ON CHIP

System-on-chip integration provides all essential functions within a single IC, simplifying design and reducing component count.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, resulting in efficient performance.

Terminal Form: BALL

Ball terminal form facilitates easy soldering and connection, ensuring reliable electrical contacts.

Nominal Supply Voltage: 0.75 V

Optimal supply voltage level for efficient and stable operation of the product.

Terminal Pitch: 0.8 mm

Fine terminal pitch enables high-density packaging and precise connections for enhanced performance.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs AM6421BSDGHAALV attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 0.85V NOMINAL SUPPLY

JESD-30 Code:

S-PBGA-B441

Length:

17.2 mm

No. of Terminals:

441

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA441,21X21,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Maximum Seated Height:

2.652 mm

Maximum Supply Voltage:

.79 V

Minimum Supply Voltage:

.715 V

Nominal Supply Voltage:

.75 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

17.2 mm

Peripheral IC Type:

Trade Compliance

AM6421BSDGHAALV Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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