Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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MPFS250TS-1FCVG484I by Microchip: 484-terminal SoC IC with CMOS tech. Operates b/w -40 to 100°C, voltage range of 0.97V to 1.03V. Ideal for applications requiring fine pitch grid array package style in plastic/epoxy material.
Median Price
$430.490
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4
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Microchip Technology
1+ parts
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$391.350
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DigiKey
Nova Conductors
$538.797
Vyrian
AZTECH Wire
$16.567
Ampacity Inc.
$489.100
Continental Prestige Electronics
$528.021
Argo Parts USA
$533.409
$522.633
Netroflash
Microchip USA
$632.962
Montano Global Distributors
LMD Electronica
LOOK Integrated Logistics
NIA Electronics
Ledger Components
The use of plastic/epoxy material for the package body provides durability and protection for the internal components of the product.
Being surface mountable allows for easy and efficient integration onto circuit boards, saving space and simplifying assembly.
The higher maximum supply voltage ensures reliable performance and stability under various operating conditions.
The square package shape allows for a compact design and efficient use of space on the board.
Having a high number of terminals enables connectivity to multiple external components and peripherals, increasing functionality.
The grid array, fine pitch package style provides high connectivity density and reliability for the product.
The lower minimum supply voltage ensures compatibility with various power sources and enables energy efficiency.
The high maximum operating temperature allows for reliable performance even in extreme environmental conditions.
The low minimum operating temperature ensures the product can function in cold environments without issues.
Having bottom terminal position simplifies the integration process and ensures easy access for connection.
The low maximum seated height allows for a thin profile design, making it suitable for compact applications.
The moderate width allows for easy integration into standard circuit board designs.
The moderate length complements the width for a balanced and space-efficient package design.
The System on Chip (SoC) design integrates multiple functions into a single IC, reducing the need for external components and improving efficiency.
Complementary Metal-Oxide-Semiconductor (CMOS) technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.
The ball terminal form enables reliable connections and ensures good electrical contact, enhancing overall performance.
The nominal supply voltage of 1V ensures compatibility with standard power sources and supports stable operation.
The small terminal pitch allows for high-density packaging and efficient use of space on the PCB, facilitating compact designs.
Other Function uPs,uCs & Peripheral ICs MPFS250TS-1FCVG484I attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Microchip Technology
Additional Features:
JESD-30 Code:
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MPFS250TS-1FCVG484I Peripheral ICs trade compliance attributes, and parameters.
HTS
8542.31.00.01
SB
8542.31.00.00
PCN Obsolescence/ EOL - Software 19/Apr/2023
PCN Design/Specification - MPFxxx/RTPF 10/May/2023 Software 19/Apr/2023
Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.
President and CEO
Ganesh Moorthy
Executive Chair
Steve Sanghi
CFO, Senior VP
J. Eric Bjornholt
Fab 5 - Colorado
Fabrication
Fab Initiation
1995
USA
Colorado Springs
Wafer Capacity
70,000
Santa Clara
1990
1,290
Lawrence
1989
5,000
Fab 4 - Gresham
1988
Gresham
50,000
Fab 2 - Tempe
1994
Tempe
30,000
Beverly
1985
2,000
Lowell
1986
15,000
Garden Grove
12,000
New Fab - Gresham
2024
L78L05ABZ-AP
STMicroelectronics
L78L05ABZ-AP by STMicroelectronics is a BIPOLAR fixed positive single output standard regulator with an operating temperature range of -40 to 125°C. It has a nominal output voltage of 5V, max load regulation of 0.06%, and can handle a max output current of 0.07A. Ideal for applications requiring stable voltage regulation in various electronic devices.
BAV99
Won-top Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
AT90CAN128-16AU
Atmel
MICROCONTROLLER, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: TQFP; Package Shape: SQUARE;
2N7002
Rectron
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Operating Mode: ENHANCEMENT MODE; Maximum Operating Temperature: 150 Cel; Terminal Form: GULL WING;
MBR1560CT
Yangzhou Yangjie Electronics
RECTIFIER DIODE; Surface Mount: NO; Maximum Operating Temperature: 150 Cel; Maximum Repetitive Peak Reverse Voltage: 60 V; Technology: SCHOTTKY; Maximum Non Repetitive Peak Forward Current: 150 A;
ISO1050DUBR
Texas Instruments
ISO1050DUBR by Texas Instruments is a network interface IC with 8 terminals, operating from -55 to 105°C. It features a small outline package, nickel palladium gold finish, and gull wing terminal form. Ideal for telecom applications requiring a 5V supply voltage and peak reflow temperature of 260°C.
Philips Semiconductors
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Moisture Sensitivity Level (MSL): 1; Maximum Operating Temperature: 150 Cel;
SMBJ18CA
Forward International Electronics
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Nominal Breakdown Voltage: 21.05 V; Maximum Clamping Voltage: 29.2 V; Maximum Repetitive Peak Reverse Voltage: 18 V; Polarity: BIDIRECTIONAL;
NXP Semiconductors
Micro Commercial Components
BSS138
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Operating Mode: ENHANCEMENT MODE; Maximum Operating Temperature: 150 Cel;
Eic Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Meritek Electronics
2N2222A
Motorola
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; Maximum Collector-Base Capacitance: 8 pF;
M24308/2-1F
Positronic Industries
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Mating Info.: MULTIPLE MATING PARTS AVAILABLE; Additional Features: STANDARD: MIL-DTL-24308, POLARIZED; Body or Shell Style: RECEPTACLE;
Taitron Components
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Drain-Source On Resistance: 3.5 ohm; Maximum Drain Current (ID): .2 A; Peak Reflow Temperature (C): NOT SPECIFIED;
LM555CM
Intersil
Analog Waveform Generation Functions; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
IRLML6402TRPBF
International Rectifier
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 1.3 W; Peak Reflow Temperature (C): 260; Package Style (Meter): SMALL OUTLINE;
Sangdest Microelectronics (Nanjing)
Inter F E T
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Maximum Drain-Source On Resistance: 7.5 ohm; Maximum Drain Current (Abs) (ID): .115 A;
EFR32MG24B010F1536IM40-B
Silicon Labs
EFR32MG24B010F1536IM40-B by Silicon Labs is a 40-terminal SoC with CMOS technology. It operates b/w -40 to 125 °C, with supply voltage range of 1.71V to 3.8V. Ideal for applications requiring compact design and high performance in IoT devices.
CY8C4247AZS-M485
Infineon Technologies
CY8C4247AZS-M485 by Infineon is a 64-terminal, programmable SoC with CMOS technology. It operates b/w -40 to 105 °C and has a supply voltage range of 1.71V to 1.89V. Ideal for applications requiring low-profile, fine-pitch ICs in automotive electronics meeting AEC-Q100 standards.
BGM13S32F512GA-V3
SoC;
MCIMX6Y2CVM08AB
MCIMX6Y2CVM08AB by NXP Semiconductors is a low-profile, fine-pitch grid array SoC with 289 terminals. It operates b/w -40 to 105°C and has a supply voltage range of 1.325V to 1.5V. Ideal for applications requiring high-performance computing in compact spaces.
STSPIN32F0
STSPIN32F0 by STMicroelectronics is a 48-terminal IC with a supply voltage range of 8-45V. This MICROPROCESSOR CIRCUIT operates in automotive-grade temperatures (-40 to 125°C) and features CMOS technology. Ideal for applications requiring high-performance motor control in compact spaces.
MCIMX286CVM4CR2
MCIMX286CVM4CR2 by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 85 °C, with supply voltage range of 1.35-1.55 V. This low profile, fine pitch IC is ideal for industrial applications requiring high performance in a compact form factor.
2545
Optical Electronics
Other uPs/uCs/Peripheral ICs;
MPFS250T-FCG1152E
MPFS250T-FCG1152E by Microchip: Programmable SoC with 1152 terminals, CMOS tech, 1V nominal supply. Square GRID ARRAY package for surface mount applications. Operates b/w 0-100°C, ideal for various uP & uC functions.
XCZU11EG-1FFVB1517E
Xilinx
XCZU11EG-1FFVB1517E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100 °C, with supply voltage range of 0.825-0.876 V. Suitable for applications requiring high-performance processing in compact form factors.
D2-92683-QR-T
Renesas Electronics
Renesas Electronics D2-92683-QR-T is a 72-terminal SoC IC with CMOS technology. It operates b/w -10 to 85 °C, with supply voltage range of 1.7V to 1.9V. This chip carrier has a square shape and is suitable for applications requiring very thin profiles and heat dissipation in plastic/epoxy packages.
TMS320F28PLC84PNT
TMS320F28PLC84PNT by Texas Instruments is an 80-terminal microprocessor circuit with CMOS technology. It operates b/w -40 to 105°C, suitable for industrial applications. With a supply voltage range of 2.97-3.63V, it is designed for surface mount assembly in compact spaces.
MCP25050-I/P
MCP25050-I/P by Microchip Tech: 8-bit microprocessor circuit with CMOS tech. Operates at -40 to 85°C, supply voltage of 2.7-5.5V. Ideal for industrial applications requiring TS16949 screening and dual-terminal finish in a rectangular package style.
MCIMX6Q5EYM10AD
MCIMX6Q5EYM10AD by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w -20 to 105 °C, with a supply voltage range of 1.35V to 1.5V. This IC has a grid array package style, 624 terminals, and is suitable for various uP and uC applications.
XC7Z045-3FFG676E
XC7Z045-3FFG676E by Xilinx is a CMOS system-on-chip with 676 terminals and a package size of 27mm x 27mm. It operates at a voltage range of 0.95V to 1.05V and has a max temperature rating of 100°C. This versatile IC is commonly used in various applications requiring high-performance processing capabilities.
FT220XS-T
FTDI
MICROPROCESSOR CIRCUIT; Technology: CMOS;
MIMXRT1021CAF4B
SoC; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 40;
MCIMX6U7CVM08AC
MCIMX6U7CVM08AC by NXP Semiconductors is a System on Chip with 624 terminals, operating temperature range of -40 to 105 °C. It features a low profile grid array package style and uses CMOS technology. Ideal for industrial applications requiring high performance in compact form factor.
XCZU5EV-2SFVC784I
XCZU5EV-2SFVC784I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C, with supply voltage range of 0.825V to 0.876V. This GRID ARRAY package is ideal for industrial applications requiring high performance and reliability.
ESP32-S3-WROOM-1U-N8R8
Espressif Systems (Shanghai)
ESP32-S3-WROOM-1U-N8R8 by Espressif Systems is a SoC with 41 terminals, operating at 3.3V. It has a rectangular shape, measures 18mm in width and 19.2mm in length. With a max supply voltage of 3.6V and operating temperature range from -40 to 65°C, it's ideal for IoT applications requiring compact design and low power consumption.
MCIMX280DVM4B
Freescale Semiconductor
SYSTEM ON CHIP; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
MPFS250TFCVG484I
SoC; Terminal Form: BALL; No. of Terminals: 484; Package Code: FBGA; Package Shape: SQUARE; Minimum Operating Temperature: -40 Cel;
MPFS250T-FCSG536I
PROGRAMMABLE SoC; Terminal Form: BALL; No. of Terminals: 536; Package Code: LFBGA; Package Shape: SQUARE; Maximum Supply Voltage: 1.03 V;
MPFS250T-1FCVG484E
SoC; Terminal Form: BALL; No. of Terminals: 484; Package Code: FBGA; Package Shape: SQUARE; Maximum Supply Voltage: 1.03 V;
PROGRAMMABLE SoC; Terminal Form: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Nominal Supply Voltage: 1 V;
MPFS250T-FCG1152I
MPFS250T-FCG1152I by Microchip Tech is a 1152-terminal programmable SoC with CMOS tech. Operates b/w -40 to 100 °C, with supply voltage range of 0.97V to 1.03V. Ideal for applications requiring high-density integration in compact spaces.
MPFS250T-1FCSG536E
PROGRAMMABLE SoC; Terminal Form: BALL; No. of Terminals: 536; Package Code: LFBGA; Package Shape: SQUARE; Width: 16 mm;
MPFS250T-1FCG1152E
Microchip Technology's MPFS250T-1FCG1152E is a programmable SoC with CMOS technology. It operates b/w 0-100°C, with supply voltage range of 0.97-1.03V. This square GRID ARRAY package has 1152 terminals and is suitable for various Other Function uPs,uCs applications.
MPFS250T-1FCG1152I
PROGRAMMABLE SoC; Terminal Form: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Package Equivalence Code: BGA1152,34X34,40;
MPFS250TS-FCG1152I
MPFS250TS-FCG1152I by Microchip Technology is a programmable SoC with a package style of grid array and 1152 terminals. It operates at a voltage range of 0.97V to 1.03V and has a max seated height of 2.99mm. This IC is commonly used in applications requiring other function uPs, uCs, and peripheral devices.
MPFS250T-1FCSG536I
PROGRAMMABLE SoC; Terminal Form: BALL; No. of Terminals: 536; Package Code: LFBGA; Package Shape: SQUARE; Terminal Pitch: .5 mm;
MPFS250T-1FCVG784I
PROGRAMMABLE SoC; Terminal Form: BALL; No. of Terminals: 784; Package Code: FBGA; Package Shape: SQUARE; Technology: CMOS;
MPFS250TFCVG484E
MPFS250TFCVG484E by Microchip Tech features 484 terminals, operates b/w 0-100°C, and has a supply voltage range of 0.97-1.03V. This SoC peripheral IC in a grid array package is ideal for applications requiring fine pitch technology and CMOS design.
MPFS095TLS-FCSG325I
MPFS095TLS-FCSG325I by Microchip Tech is a 325-terminal IC with CMOS tech. Operates b/w -40 to 100°C, voltage range of 0.97-1.03V. Ideal for SoC programming applications due to its rectangular shape and bottom terminal position.
MPFS095TLS-FCVG484I
PROGRAMMABLE SoC; Terminal Form: BALL; No. of Terminals: 484; Package Code: FBGA; Package Shape: SQUARE; Package Equivalence Code: BGA484,22X22,32;
MPFS095T-1FCVG784I
PROGRAMMABLE SoC; Terminal Form: BALL; No. of Terminals: 784; Package Code: FBGA; Package Shape: SQUARE; Terminal Position: BOTTOM;
MPFS025T-1FCSG325E
PROGRAMMABLE SoC; Terminal Form: BALL; No. of Terminals: 325; Package Shape: RECTANGULAR; Surface Mount: YES; Terminal Position: BOTTOM;
MPFS025T-1FCVG484E
MPFS025T-1FCVG484E by Microchip Tech is a 484-terminal IC with CMOS tech. Operates b/w 0-100°C, voltage range of 0.97-1.03V. Ideal for applications requiring a programmable SoC in a compact 19x19mm grid array package.
MPFS025T-1FCVG484I
Microchip Technology's MPFS025T-1FCVG484I is a 484-terminal, programmable SoC with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.97V to 1.03V. This square-shaped IC in grid array package is ideal for various applications requiring fine pitch surface mount technology.
MPFS025T-FCSG325E
PROGRAMMABLE SoC; Terminal Form: BALL; No. of Terminals: 325; Package Shape: RECTANGULAR; Surface Mount: YES; JESD-30 Code: R-PBGA-B325;
MPFS250TS-1FCVG784I
PROGRAMMABLE SoC; Terminal Form: BALL; No. of Terminals: 784; Package Code: FBGA; Package Shape: SQUARE; Maximum Seated Height: 2.92 mm;
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