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ST33HTPH2E28AAF0

STMicroelectronics

ST33HTPH2E28AAF0 by STMicroelectronics

ST33HTPH2E28AAF0 by STMicroelectronics is a 28-terminal IC with CMOS technology, operating b/w -40 to 105°C. It features a cryptographic authenticator for industrial applications. The small outline package has a thin profile and gull wing terminals, suitable for surface mount assembly at 0.65mm pitch.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,501 parts In-Stock

1+ parts

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2,501

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Vyrian

USA . 2,316 parts In-Stock

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2,316

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Nova Conductors

Japan . 870 parts In-Stock

1+ parts

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870

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Anansix

USA . 504 parts In-Stock

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504

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 1,138 parts In-Stock

1+ parts

$2.600

100+ parts

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1,138

$2.600

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Ampacity Inc.

Singapore . 375 parts In-Stock

1+ parts

$13.000

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375

$13.000

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AZTECH Wire

Italy . 281 parts In-Stock

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$14.979

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281

$14.979

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Microchip USA

USA . 1,996 parts In-Stock

1+ parts

$37.166

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1,996

$37.166

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Corohmni

South Africa . 11 parts In-Stock

1+ parts

$59.343

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11

$59.343

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IDEA Electronic Components Group

UK . 122 parts In-Stock

1+ parts

$70.466

100+ parts

-

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$63.419

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122

$70.466

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$63.419

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MKK Technologies

India . 1,444 parts In-Stock

1+ parts

$132.506

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1,444

$132.506

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DigiPath Technology Company

USA . 1,444 parts In-Stock

1+ parts

$132.506

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1,444

$132.506

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Continental Prestige Electronics

USA . 4,232 parts In-Stock

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4,232

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Parana Technologies

USA . 1,575 parts In-Stock

1+ parts

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$84.252

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1,575

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$84.252

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Argo Parts USA

USA . 1,261 parts In-Stock

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1,261

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Corphita

USA . 193 parts In-Stock

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193

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Bastille Electronics

Australia . 120 parts In-Stock

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120

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Overview

Unlock the power of secure authentication with the ST33HTPH2E28AAF0 by STMicroelectronics. Known for their high-quality products, STMicroelectronics brings you a cutting-edge cryptographic authenticator that ensures the utmost security for your applications. Whether you're looking to enhance the security of IoT devices, smart cards, or payment systems, this product offers unmatched value and reliability. Trust in STMicroelectronics to deliver top-notch solutions that meet your needs and exceed your expectations. Step into a world of secure possibilities with the ST33HTPH2E28AAF0.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good protection for the internal components of the IC, making it durable and long-lasting.

Surface Mount: YES

Surface mount design allows for easy and efficient PCB assembly, saving time and effort during manufacturing.

Package Shape: RECTANGULAR

Rectangular shape provides a compact and space-saving design, ideal for applications where space is limited.

No. of Terminals: 28

With 28 terminals, this IC can support a wide range of functions and connectivity options, making it versatile for various applications.

Maximum Operating Temperature: 105 °C

High maximum operating temperature ensures reliability and performance even in demanding industrial environments.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for use in a wide range of temperature conditions, making it suitable for diverse applications.

Terminal Position: DUAL

Dual terminal position provides flexibility in PCB design and layout, allowing for efficient routing and connections.

Nominal Supply Voltage: 1.8 V

Low nominal supply voltage helps in reducing power consumption, making it energy-efficient and cost-effective.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs ST33HTPH2E28AAF0 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from STMicroelectronics

Specs

Additional Features:

ALSO OPERATES AT 3.3V NOMINAL VOLATGE

JESD-30 Code:

R-PDSO-G28

Length:

9.7 mm

No. of Terminals:

28

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP28,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Maximum Seated Height:

1.2 mm

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Peripheral IC Type:

Trade Compliance

ST33HTPH2E28AAF0 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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