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ST33HTPH2032AHD1

STMicroelectronics

ST33HTPH2032AHD1 by STMicroelectronics

ST33HTPH2032AHD1 by STMicroelectronics is a 32-terminal chip carrier with cryptographic authenticator technology. Operating b/w -40 to 105°C, it has a terminal pitch of 0.5mm and nominal voltage of 1.8V. Ideal for secure applications requiring compact design and high performance in a square package shape.

Median Price

$3.072

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 3,995 parts In-Stock

1+ parts

$4.010

100+ parts

$2.520

1k+ parts

$2.250

10k+ parts

$2.160

3,995

$4.010

$2.520

$2.250

$2.160

DigiKey

USA . 3,083 parts In-Stock

1+ parts

$4.010

100+ parts

$2.516

1k+ parts

$2.247

10k+ parts

$2.169

3,083

$4.010

$2.516

$2.247

$2.169

Arrow

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$2.133

3,000

-

-

-

$2.133

Verical

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$2.133

3,000

-

-

-

$2.133

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 39 parts In-Stock

1+ parts

$2.560

100+ parts

-

1k+ parts

-

10k+ parts

-

39

$2.560

-

-

-

Digiode

USA . 4,719 parts In-Stock

1+ parts

$4.076

100+ parts

-

1k+ parts

-

10k+ parts

-

4,719

$4.076

-

-

-

Chip Stock

USA . 33,440 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

33,440

-

-

-

-

Vyrian

USA . 3,166 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,166

-

-

-

-

Anansix

USA . 2,819 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,819

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 3,645 parts In-Stock

1+ parts

$1.810

100+ parts

-

1k+ parts

-

10k+ parts

-

3,645

$1.810

-

-

-

Argo Parts USA

USA . 3,962 parts In-Stock

1+ parts

$2.400

100+ parts

-

1k+ parts

-

10k+ parts

-

3,962

$2.400

-

-

-

Continental Prestige Electronics

USA . 1,514 parts In-Stock

1+ parts

$2.400

100+ parts

-

1k+ parts

-

10k+ parts

$2.352

1,514

$2.400

-

-

$2.352

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$2.560

100+ parts

$2.509

1k+ parts

-

10k+ parts

-

2,000

$2.560

$2.509

-

-

Corphita

USA . 107 parts In-Stock

1+ parts

$3.861

100+ parts

-

1k+ parts

-

10k+ parts

-

107

$3.861

-

-

-

IDEA Electronic Components Group

UK . 1,935 parts In-Stock

1+ parts

$14.735

100+ parts

-

1k+ parts

$13.261

10k+ parts

-

1,935

$14.735

-

$13.261

-

Microchip USA

USA . 4,550 parts In-Stock

1+ parts

$15.600

100+ parts

$15.500

1k+ parts

$15.460

10k+ parts

$15.410

4,550

$15.600

$15.500

$15.460

$15.410

Corohmni

South Africa . 27 parts In-Stock

1+ parts

$18.260

100+ parts

-

1k+ parts

-

10k+ parts

-

27

$18.260

-

-

-

MKK Technologies

India . 1,495 parts In-Stock

1+ parts

$27.708

100+ parts

-

1k+ parts

-

10k+ parts

-

1,495

$27.708

-

-

-

DigiPath Technology Company

USA . 1,495 parts In-Stock

1+ parts

$27.708

100+ parts

-

1k+ parts

-

10k+ parts

-

1,495

$27.708

-

-

-

Vigor

Singapore . 1,100 parts In-Stock

1+ parts

$34.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,100

$34.000

-

-

-

Aztec Data Supply Inc.

USA . 712 parts In-Stock

1+ parts

$34.010

100+ parts

-

1k+ parts

-

10k+ parts

-

712

$34.010

-

-

-

Parana Technologies

USA . 1,483 parts In-Stock

1+ parts

-

100+ parts

$17.618

1k+ parts

-

10k+ parts

-

1,483

-

$17.618

-

-

Overview

Unleash the power of cutting-edge technology with the ST33HTPH2032AHD1 by STMicroelectronics. This innovative cryptographic authenticator offers unparalleled security and reliability, making it the ideal solution for a wide range of applications. With a sleek square package design and advanced CMOS technology, this product delivers top-notch performance in a compact form factor. Trust in STMicroelectronics' reputation for excellence and elevate your projects to new heights with the ST33HTPH2032AHD1. Experience the difference that quality and precision can make in your designs today.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient mounting onto circuit boards, saving time and space in the manufacturing process.

Package Shape: SQUARE

The square package shape provides a compact footprint, ideal for applications where space is limited.

No. of Terminals: 32

Having 32 terminals allows for various connections and functionalities, making the product versatile and suitable for complex applications.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package styles ensures efficient heat dissipation and space-saving design.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature of 105°C ensures the reliability and durability of the product in various operating conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C allows the product to function in a wide range of environments, including extreme cold conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The terminal finish of nickel palladium gold provides excellent conductivity and corrosion resistance, enhancing the product's reliability and longevity.

Terminal Position: QUAD

The quad terminal position allows for stability and secure connections, making the product suitable for demanding applications.

Maximum Seated Height: 1 mm

With a low maximum seated height of 1 mm, the product can be easily integrated into compact designs and applications.

Width: 5 mm

The 5 mm width offers a slim profile, ideal for space-constrained applications where size is a critical factor.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time of 30 seconds at peak reflow temperature ensures proper soldering and reflow processes, leading to reliable connections.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C enables efficient soldering and assembly processes for the product.

Length: 5 mm

The 5 mm length offers a compact design, suitable for applications where space is limited.

Peripheral IC Type: CRYPTOGRAPHIC AUTHENTICATOR

The cryptographic authenticator type of peripheral IC provides secure authentication and data protection features, making the product ideal for secure communication and data transfer applications.

Technology: CMOS

The CMOS technology used in the product ensures low power consumption and high-speed performance, making it energy-efficient and reliable.

Terminal Form: NO LEAD

The no-lead terminal form offers improved solder joint reliability and environmental sustainability, making it a desirable choice for eco-friendly applications.

Nominal Supply Voltage: 1.8 V

The nominal supply voltage of 1.8 V provides compatibility with a wide range of systems and devices, making the product versatile and easily integrable.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5 mm allows for high-density mounting and connectivity, making the product suitable for compact and high-performance applications.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs ST33HTPH2032AHD1 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from STMicroelectronics

Specs

Additional Features:

ALSO OPERATES AT 3.3V NOMINAL VOLATGE

JESD-30 Code:

S-XQCC-N32

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

32

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Peripheral IC Type:

Trade Compliance

ST33HTPH2032AHD1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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