Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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Featured manufacturers
ST33HTPH2032AHD1 by STMicroelectronics is a 32-terminal chip carrier with cryptographic authenticator technology. Operating b/w -40 to 105°C, it has a terminal pitch of 0.5mm and nominal voltage of 1.8V. Ideal for secure applications requiring compact design and high performance in a square package shape.
Median Price
$3.146
Lifecycle Status
Suppliers In-Stock
9
In-Stock Inventory
1k+
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1+ parts
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100+ parts
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$2.300
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$1.810
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$2.400
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$2.352
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$2.509
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$3.861
IDEA Electronic Components Group
$14.735
$13.261
Microchip USA
$15.600
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$15.460
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Corohmni
$18.260
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$27.708
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$34.000
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$34.010
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$17.618
Surface mount technology allows for easy and efficient mounting onto circuit boards, saving time and space in the manufacturing process.
The square package shape provides a compact footprint, ideal for applications where space is limited.
Having 32 terminals allows for various connections and functionalities, making the product versatile and suitable for complex applications.
The combination of chip carrier, heat sink/slug, and very thin profile package styles ensures efficient heat dissipation and space-saving design.
The high maximum operating temperature of 105°C ensures the reliability and durability of the product in various operating conditions.
The low minimum operating temperature of -40°C allows the product to function in a wide range of environments, including extreme cold conditions.
The terminal finish of nickel palladium gold provides excellent conductivity and corrosion resistance, enhancing the product's reliability and longevity.
The quad terminal position allows for stability and secure connections, making the product suitable for demanding applications.
With a low maximum seated height of 1 mm, the product can be easily integrated into compact designs and applications.
The 5 mm width offers a slim profile, ideal for space-constrained applications where size is a critical factor.
The maximum time of 30 seconds at peak reflow temperature ensures proper soldering and reflow processes, leading to reliable connections.
The peak reflow temperature of 260°C enables efficient soldering and assembly processes for the product.
The 5 mm length offers a compact design, suitable for applications where space is limited.
The cryptographic authenticator type of peripheral IC provides secure authentication and data protection features, making the product ideal for secure communication and data transfer applications.
The CMOS technology used in the product ensures low power consumption and high-speed performance, making it energy-efficient and reliable.
The no-lead terminal form offers improved solder joint reliability and environmental sustainability, making it a desirable choice for eco-friendly applications.
The nominal supply voltage of 1.8 V provides compatibility with a wide range of systems and devices, making the product versatile and easily integrable.
The small terminal pitch of 0.5 mm allows for high-density mounting and connectivity, making the product suitable for compact and high-performance applications.
Other Function uPs,uCs & Peripheral ICs ST33HTPH2032AHD1 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from STMicroelectronics
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JESD-609 Code:
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ST33HTPH2032AHD1 Peripheral ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.31.00.01
SB
8542.31.00.00
PCN Design/Specification - ST33TPH 05-May-2022 ST33HTPH 11/Oct/2022
STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.
President, CEO
Jean-Marc Chery
President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience
Lorenzo Grandi
President, Sales & Marketing
Jerome Roux
Castelletto
Fabrication
Fab Initiation
1968
Italy
Wafer Capacity
SGFAB AMK 6
2000
Singapore
29,000
AG200
Agrate Brianza
14,000
RST 8
France
Rousset
35,000
Crolles 1
1993
Crolles
30,000
Crolles 2-ext. mod 5
Crolles 2-ext. mod 2
2022
Crolles 2-ext. mod 3
2023
Crolles 2
2004
28,000
1985
SiC Fab
2006
Sweden
Norrköping
10,000
Fab 3
2005
Tours
2,000
Fab 1 & Fab 2
1978
55,000
Fab 2
1997
Catania
SGFAB-AMK 6E
2003
145,000
SGFAB-AMJ 9
1984
152,000
AG300 (R3)
1980
25,000
1987
34,000
AG300
2024
Crolles 2-ext. mod 1
2020
Fab 1 6-inch fab
2013
11,000
SiC 6-inch line
2021
2,500
200mm GaN
2018
SGFAB-AMK 8
2001
Crolles 2- JV Fab
SGFAB-AMK 6
2016
38,125
SGFAB-AMK 2E
2010
20,000
Silicon Carbide A.B.
SiC wafer/EPI Fab
SiC Device Fab
2025
BAV99
Frontier Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
FDC5614P
Onsemi
FDC5614P by Onsemi is a P-CHANNEL Power FET with 60V DS Breakdown Voltage, ideal for SWITCHING applications. It features 20A Max IDM and 0.105 ohm RDS(ON), operating in ENHANCEMENT MODE at -55 to 150 °C. This SMALL OUTLINE transistor has a built-in diode, GULL WING terminals, and METAL-OXIDE SEMICONDUCTOR technology.
SMBJ18CA
Zowie Technology
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
FDN5618P
Fairchild Semiconductor
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .5 W; Transistor Element Material: SILICON; Moisture Sensitivity Level (MSL): 1;
SS14
Rugao Dachang Electronic
RECTIFIER DIODE; Surface Mount: YES; Maximum Repetitive Peak Reverse Voltage: 40 V; Maximum Forward Voltage (VF): .55 V; No. of Elements: 1; Technology: SCHOTTKY;
ULN2803A
STMicroelectronics
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; No. of Elements: 8; Minimum DC Current Gain (hFE): 1000;
DS18B20U+
Maxim Integrated
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Shape or Style: SQUARE; Housing: PLASTIC; Minimum Supply Voltage: 3 V;
EU2B-YS303C
Idec
ROTARY SWITCH;
Daco Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
NDT2955
NDT2955 by Onsemi is a P-CHANNEL FET with 60V DS Breakdown Voltage, ideal for SWITCHING applications. It features a max IDM of 15A and EAS of 174mJ, suitable for ENHANCEMENT MODE operation. With a compact SMALL OUTLINE package and -55 to 150 °C operating range, it offers efficient power dissipation up to 3W.
BSS138
North American Philips Discrete Products Div
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; No. of Elements: 1; Maximum Drain Current (Abs) (ID): .2 A;
OPA2227UA
Texas Instruments
OPA2227UA by Texas Instruments is a dual operational amplifier with low-offset voltage of 200 uV and bias current of 0.01 uA. It operates at temperatures ranging from -40 to 85 °C, making it suitable for industrial applications requiring precise signal amplification. With a unity gain bandwidth of 8000 kHz, this op amp is ideal for high-frequency circuit designs.
LIS2DH12TR
LIS2DH12TR by STMicroelectronics is a 3-axis accelerometer with digital voltage output. It operates b/w -40 to 85°C, with supply voltage range of 1.71-3.6V. Ideal for applications requiring precise motion sensing in compact spaces like wearables and IoT devices.
M39029/58360
Esterline Technologies
CONNECTOR ACCESSORY; Terminal Type: CRIMP; Removal Tools: M81969/14-01; Associated Military - Specifications: MIL-DTL-38999; IEC Conformity: NO; MIL-Connector Accessory Name: CONTACT;
LL4148
Sinyork
RECTIFIER DIODE; Surface Mount: YES; Config: SINGLE; No. of Phases: 1; No. of Elements: 1; Maximum Repetitive Peak Reverse Voltage: 100 V;
OPA2277UA/2K5
Burr-Brown Corporation
OPERATIONAL AMPLIFIER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
BSS138BKW,115
Nexperia
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Terminal Finish: TIN; No. of Terminals: 3; Additional Features: LOGIC LEVEL COMPATIBLE;
Changzhou Starsea Electronics
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
Vishay Intertechnology
Vishay Intertechnology's BAV99 diode features a max forward voltage of 1.3V and a max output current of 0.15A, making it ideal for rectification applications. With a small outline package style and dual terminal position, this series-connected diode is designed for surface mount usage in various electronic circuits with an operating temperature range from -55°C to 150°C.
1N4148
Vishay Telefunken
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
MCIMX287CVM4B
NXP Semiconductors
MCIMX287CVM4B by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 85 °C and has a supply voltage range of 1.35V to 1.55V. With a grid array package style, it's ideal for industrial applications requiring low profile and fine pitch components.
EFR32BG24A010F1024IM40-B
Silicon Labs
EFR32BG24A010F1024IM40-B by Silicon Labs is a 40-terminal SoC with CMOS technology. It operates b/w -40 to 125 °C, with supply voltage range of 1.71V to 3.8V. Ideal for applications requiring low-profile, surface-mount chips in various electronic devices.
CY8C3866AXI-040T
Infineon Technologies
CY8C3866AXI-040T by Infineon Technologies is a 100-terminal, square-shaped IC with a supply voltage range of 1.71V to 5.5V. It operates in industrial temperatures from -40°C to 85°C and features a ROM size of 65536 bits. This programmable SoC is ideal for applications requiring low-profile, fine-pitch packages in various industries.
AM4372BZDNA80
AM4372BZDNA80 by Texas Instruments is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 105 °C and has a supply voltage range of 1.21V to 1.326V. This low profile, fine pitch GRID ARRAY package with 491 terminals is ideal for industrial applications requiring high performance and reliability.
ATMXT224S-MAUR036
Microchip Technology
Microchip's ATMXT224S-MAUR036 is a 56-terminal IC with max supply voltage of 3.47V, ideal for capacitive touch screen control apps. Operating b/w -40 to 85°C, it features a square package style and quad terminal position, making it suitable for surface mount applications. With a nominal voltage of 3.3V and CMOS technology, this chip carrier is compact at 6x6mm in size.
MCIMX515DJM8CR2
Freescale Semiconductor
SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 529; Package Code: LFBGA; Package Shape: SQUARE; Maximum Supply Voltage: 1.15 V;
LC7981
Emerging Display Technologies
Other uPs/uCs/Peripheral ICs;
TMS320DM368ZCEF
TMS320DM368ZCEF by Texas Instruments is a 32-bit microprocessor with 8192 RAM words, operating b/w 0-85 °C. It supports I2C, SPI, UART, USB buses and has a terminal pitch of 0.65 mm. Ideal for applications requiring low profile, fine pitch package style in CMOS technology.
MCIMX6S5EVM10AB
SoC; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE; Qualification: Not Qualified;
TMS320DM368ZCED48F
TMS320DM368ZCED48F by Texas Instruments is a 32-bit microprocessor with 338 terminals, operating at -40 to 85°C. It features a max supply voltage of 1.42V and supports I2C, SPI, UART, and USB buses. Ideal for industrial applications requiring a low-profile package with fine pitch grid array style.
MCIMX6G2CVK05AB
MCIMX6G2CVK05AB by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 105 °C, with supply voltage range of 1.15V to 1.3V. This IC has 272 terminals and is ideal for industrial applications requiring low profile, fine pitch components.
MCIMX6Y2DVM09AA
MCIMX6Y2DVM09AA by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w 0-95 °C, with supply voltage range of 1.375-1.5 V. This IC has 289 terminals in a GRID ARRAY package, suitable for various uP and uC applications.
MSP430F6779IPEUR
MSP430F6779IPEUR by Texas Instruments is a 16-bit microprocessor with 128 terminals, operating at a max frequency of 25 MHz. Ideal for industrial applications, it features 32KB RAM, 524288 ROM words, and supports I2C, SPI, UART bus compatibility.
MIMXRT1175CVM8A
The NXP MIMXRT1175CVM8A is a SoC peripheral IC with CMOS technology. It operates b/w -40 to 105 °C, with supply voltage range of 1.1-1.15 V. Its grid array package has 289 terminals and measures 14x14 mm, making it suitable for various embedded applications.
EFR32MG24B010F1536IM40-B
EFR32MG24B010F1536IM40-B by Silicon Labs is a 40-terminal SoC with CMOS technology. It operates b/w -40 to 125 °C, with supply voltage range of 1.71V to 3.8V. Ideal for applications requiring compact design and high performance in IoT devices.
MCIMX6U5DVM10AB
MCIMX6U5DVM10AB by NXP Semiconductors is a System on Chip with 624 terminals, operating at -40 to +95°C. It has a supply voltage range of 1.35V to 1.5V and uses CMOS technology. Ideal for applications requiring low profile, fine pitch packages in surface mount configurations.
NRF52810-QCAA-R7
Nordic Semiconductor Asa
NRF52810-QCAA-R7 by Nordic Semiconductor Asa is a 32-terminal microprocessor circuit with CMOS technology. It operates b/w -40 to 85 °C and has a supply voltage range of 1.7V to 3.6V, making it ideal for industrial applications requiring low power consumption and compact design.
SCANSTA112VSX/NOPB
SCANSTA112VSX/NOPB by Texas Instruments is a CMOS microprocessor circuit with 100 terminals in a square package. It operates b/w -40 to 85 °C, with a supply voltage of 3.3 V and terminal pitch of 0.5 mm. Ideal for industrial applications requiring precise temperature control and compact design.
MCIMX7D3DVK10SC
MCIMX7D3DVK10SC by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w 0-95 °C, with supply voltage ranging from 1.045-1.25 V. With 488 terminals in a GRID ARRAY package, it's ideal for various uPs and uCs applications.
MCIMX6U7CVM08AC
MCIMX6U7CVM08AC by NXP Semiconductors is a System on Chip with 624 terminals, operating temperature range of -40 to 105 °C. It features a low profile grid array package style and uses CMOS technology. Ideal for industrial applications requiring high performance in compact form factor.
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ST33HTPH2X32AHD8
CRYPTOGRAPHIC AUTHENTICATOR; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE; Package Equivalence Code: LCC32,.2SQ,20;
ST33HTPH2X32AHD4
CRYPTOGRAPHIC AUTHENTICATOR; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE; JESD-30 Code: S-XQCC-N32;
ST33HTPH2X32AHD5
CRYPTOGRAPHIC AUTHENTICATOR; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE; Terminal Position: QUAD;
ST33HTPH2032AAF3
ST33HTPH2032AAF3 by STMicroelectronics is a 32-terminal IC with CMOS technology, operating from -40 to 105°C. It's a cryptographic authenticator with 1.8V supply voltage, suitable for industrial applications requiring secure data processing in compact spaces.
ST33HTPH2E28AAF0
CRYPTOGRAPHIC AUTHENTICATOR; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: TSSOP; Package Shape: RECTANGULAR;
ST33HTPH2E28AHD0
ST33HTPH2E28AHD0 by STMicroelectronics is a 28-terminal IC with CMOS technology, operating b/w -40 to 105°C. It's a cryptographic authenticator with 1.8V supply voltage, suitable for secure applications requiring compact design and surface mount compatibility.
ST33HTPH2E32AHD0
CRYPTOGRAPHIC AUTHENTICATOR; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE; Nominal Supply Voltage: 1.8 V;
ST33HTPH2028AHD1
CRYPTOGRAPHIC AUTHENTICATOR; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: TSSOP; Package Shape: RECTANGULAR; Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH;
ST33HTPH2E28AAF1
ST33GTPMA020FAE5
CRYPTOGRAPHIC AUTHENTICATOR; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: TSSOP; Package Shape: RECTANGULAR;
ST33HTPH2X32AHC5
ST33HTPH2X32AHC5 by STMicroelectronics is a 32-terminal, surface mount cryptographic authenticator with a package shape of square and dimensions of 5mm x 5mm. It operates at temperatures ranging from -40 to 105 °C and has a nominal voltage of 1.8V.
ST33GTPMA020FAE6
ST33GTPMII2C
MICROPROCESSOR CIRCUIT;
ST33HTPH2028AHC9
CRYPTOGRAPHIC AUTHENTICATOR; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: TSSOP; Package Shape: RECTANGULAR; Maximum Seated Height: 1.2 mm;
ST33HTPH2E28AHB3
CRYPTOGRAPHIC AUTHENTICATOR; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: TSSOP; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;
ST33GTPMISPI
ST33HTPH2E28AHB4
CRYPTOGRAPHIC AUTHENTICATOR; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: TSSOP; Package Shape: RECTANGULAR; Surface Mount: YES;
ST33HTPH2E28AHB7
ST33HTPH2E28AHB8
CRYPTOGRAPHIC AUTHENTICATOR; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: TSSOP; Package Shape: RECTANGULAR; JESD-30 Code: R-PDSO-G28;
Supply Digital Components
$106.00
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12,000 In-Stock
Total price ≈ $80,197.29
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