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ST33HTPH2E28AHB4

STMicroelectronics

ST33HTPH2E28AHB4 by STMicroelectronics

ST33HTPH2E28AHB4 by STMicroelectronics is a cryptographic authenticator in a compact 28-terminal package. It operates b/w -40 °C to 105 °C, with a nominal voltage of 1.8V and features a thin profile design for space-constrained applications. Ideal for secure authentication in IoT devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,751 parts In-Stock

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2,751

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Anansix

USA . 1,739 parts In-Stock

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1,739

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Digiode

USA . 1,278 parts In-Stock

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1,278

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 606 parts In-Stock

1+ parts

$15.549

100+ parts

-

1k+ parts

$13.994

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606

$15.549

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$13.994

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MKK Technologies

India . 2,107 parts In-Stock

1+ parts

$29.239

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2,107

$29.239

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DigiPath Technology Company

USA . 2,107 parts In-Stock

1+ parts

$29.239

100+ parts

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2,107

$29.239

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Corohmni

South Africa . 1,022 parts In-Stock

1+ parts

$74.357

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1,022

$74.357

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Parana Technologies

USA . 1,670 parts In-Stock

1+ parts

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100+ parts

$18.591

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1,670

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$18.591

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Corphita

USA . 134 parts In-Stock

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134

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Overview

Unlock unparalleled security and efficiency with the ST33HTPH2E28AHB4 from STMicroelectronics. Renowned for their commitment to quality and innovation, STMicroelectronics delivers a cryptographic authenticator that ensures your applications are fortified against threats. Its compact design is perfect for space-constrained environments, making it ideal for IoT devices, automotive systems, and smart appliances. Experience peace of mind and cutting-edge performance—choose STMicroelectronics to elevate your projects!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy enhances durability and resistance to environmental factors, making it a reliable choice for various applications.

Surface Mount: YES

Surface mount technology optimizes space on PCB and allows for automated assembly, leading to reduced manufacturing costs.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of space on circuit boards, facilitating denser designs.

No. of Terminals: 28

A higher number of terminals provides more connectivity options, enhancing flexibility for different circuit requirements.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

This slim profile allows for compact designs, fitting well in size-constrained applications.

Maximum Operating Temperature: 105 °C

A maximum operating temperature of 105 °C ensures reliable performance in high-temperature environments.

Minimum Operating Temperature: -40 °C

The ability to function at -40 °C makes this product ideal for use in extreme temperature conditions, such as automotive or industrial applications.

Terminal Position: DUAL

Dual terminal positioning provides versatility in device layouts, enhancing installation options.

Maximum Seated Height: 1.2 mm

A low maximum seated height allows for low-profile designs, suitable for applications where space is at a premium.

Width: 4.4 mm

A compact width enables efficient spacing on PCBs while maintaining a solid electrical connection.

Length: 9.7 mm

This length supports high density in component placement, facilitating modern electronic designs.

Peripheral IC Type: CRYPTOGRAPHIC AUTHENTICATOR

As a cryptographic authenticator, this IC enhances security in digital communications, protecting against unauthorized access.

Technology: CMOS

CMOS technology offers low power consumption and high efficiency, making it suitable for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminal form ensures easy soldering and reliable connections during the assembly process.

Nominal Supply Voltage: 1.8 V

A low nominal supply voltage contributes to energy efficiency, extending battery life in portable applications.

Terminal Pitch: 0.65 mm

A 0.65 mm terminal pitch is conducive to compact PCB layouts while ensuring reliable electrical performance.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs ST33HTPH2E28AHB4 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from STMicroelectronics

Specs

Additional Features:

ALSO OPERATES AT 3.3V NOMINAL VOLATGE

JESD-30 Code:

R-PDSO-G28

Length:

9.7 mm

No. of Terminals:

28

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP28,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Maximum Seated Height:

1.2 mm

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Peripheral IC Type:

Trade Compliance

ST33HTPH2E28AHB4 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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