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ST33HTPH2E28AHB7

STMicroelectronics

ST33HTPH2E28AHB7 by STMicroelectronics

ST33HTPH2E28AHB7 by STMicroelectronics is a cryptographic authenticator in a compact 28-terminal package, ideal for secure applications. It operates b/w -40 °C to 105 °C and requires a nominal voltage of 1.8V. Its thin profile and gull-wing terminals facilitate easy surface mounting.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,318 parts In-Stock

1+ parts

-

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3,318

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Anansix

USA . 2,720 parts In-Stock

1+ parts

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2,720

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Vyrian

USA . 207 parts In-Stock

1+ parts

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207

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 5,237 parts In-Stock

1+ parts

$53.356

100+ parts

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1k+ parts

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10k+ parts

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5,237

$53.356

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IDEA Electronic Components Group

UK . 1,425 parts In-Stock

1+ parts

$60.509

100+ parts

-

1k+ parts

$54.458

10k+ parts

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1,425

$60.509

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$54.458

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MKK Technologies

India . 1,636 parts In-Stock

1+ parts

$113.784

100+ parts

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1,636

$113.784

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DigiPath Technology Company

USA . 1,636 parts In-Stock

1+ parts

$113.784

100+ parts

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10k+ parts

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1,636

$113.784

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Corphita

USA . 2,915 parts In-Stock

1+ parts

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2,915

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Parana Technologies

USA . 1,652 parts In-Stock

1+ parts

-

100+ parts

$72.348

1k+ parts

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10k+ parts

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1,652

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$72.348

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Overview

Unlock unparalleled security and performance with the ST33HTPH2E28AHB7 from STMicroelectronics. Renowned for their cutting-edge technology and commitment to quality, STMicroelectronics offers this compact cryptographic authenticator ideal for IoT devices and secure transactions. Its robust design ensures reliable operation in extreme temperatures, empowering your applications with enhanced security while saving space and energy. Elevate your projects with a trusted partner!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials enhances durability and resistance to environmental factors, making this product reliable in various applications.

Surface Mount: YES

Surface mount capability allows for high-density PCB layouts, making the product suitable for modern, compact electronic designs.

Package Shape: RECTANGULAR

The rectangular package shape optimizes space utilization on the PCB, assisting in efficient layout and design.

No. of Terminals: 28

With 28 terminals, this IC offers a multitude of connection options, facilitating complex circuit designs and extensive functionality.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile are ideal for space-constrained applications, ensuring minimal board real estate is used while maintaining performance.

Maximum Operating Temperature: 105 °C

A maximum operating temperature of 105 °C allows for versatile use in higher-temperature environments, ensuring reliable performance under stress.

Minimum Operating Temperature: -40 °C

The wide temperature range (-40 °C to 105 °C) makes it suitable for harsh conditions, ensuring operability in diverse climatic settings.

Terminal Position: DUAL

Dual terminal positioning allows for greater flexibility in PCB design and promotes ease of assembly, leading to lower manufacturing costs.

Maximum Seated Height: 1.2 mm

With a maximum seated height of just 1.2 mm, this IC is well-suited for slim form-factor devices, promoting compact designs.

Width: 4.4 mm

A width of 4.4 mm enables integration into narrow spaces, making the product an excellent choice for portable and embedded systems.

Length: 9.7 mm

The 9.7 mm length strikes a balance between performance and compactness, ensuring effective use of space in circuit designs.

Peripheral IC Type: CRYPTOGRAPHIC AUTHENTICATOR

As a cryptographic authenticator, this IC provides essential security features for protecting against unauthorized access and data breaches.

Technology: CMOS

CMOS technology offers low power consumption while maintaining high-speed operation, making it advantageous for battery-operated devices.

Terminal Form: GULL WING

The gull wing terminal form enhances soldering efficiency and robustness in PCB mounting, ensuring reliable electrical connections.

Nominal Supply Voltage: 1.8 V

Operating at a nominal supply voltage of 1.8 V supports low-power applications, ideal for energy-efficient designs in portable electronics.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm allows for high packing density on PCBs while ensuring manageable soldering and assembly processes.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs ST33HTPH2E28AHB7 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from STMicroelectronics

Specs

Additional Features:

ALSO OPERATES AT 3.3V NOMINAL VOLATGE

JESD-30 Code:

R-PDSO-G28

Length:

9.7 mm

No. of Terminals:

28

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP28,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Maximum Seated Height:

1.2 mm

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Peripheral IC Type:

Trade Compliance

ST33HTPH2E28AHB7 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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