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ST33HTPH2E28AHB8

STMicroelectronics

ST33HTPH2E28AHB8 by STMicroelectronics

ST33HTPH2E28AHB8 by STMicroelectronics is a cryptographic authenticator in a compact 28-terminal package. It operates b/w -40 °C and 105 °C, with a nominal voltage of 1.8V. Ideal for secure applications, it features surface mount technology and a thin profile design.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,240 parts In-Stock

1+ parts

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3,240

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Vyrian

USA . 2,455 parts In-Stock

1+ parts

-

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2,455

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Anansix

USA . 1,664 parts In-Stock

1+ parts

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1,664

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,763 parts In-Stock

1+ parts

$16.958

100+ parts

-

1k+ parts

$15.263

10k+ parts

-

1,763

$16.958

-

$15.263

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MKK Technologies

India . 1,394 parts In-Stock

1+ parts

$31.889

100+ parts

-

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10k+ parts

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1,394

$31.889

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DigiPath Technology Company

USA . 1,394 parts In-Stock

1+ parts

$31.889

100+ parts

-

1k+ parts

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10k+ parts

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1,394

$31.889

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Corohmni

South Africa . 1,171 parts In-Stock

1+ parts

$43.054

100+ parts

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1,171

$43.054

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Parana Technologies

USA . 219 parts In-Stock

1+ parts

-

100+ parts

$20.276

1k+ parts

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219

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$20.276

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Corphita

USA . 188 parts In-Stock

1+ parts

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188

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Overview

Unlock unprecedented security and efficiency with the ST33HTPH2E28AHB8 from STMicroelectronics. This state-of-the-art cryptographic authenticator is crafted to elevate your application’s integrity while ensuring reliability in demanding environments. With a compact design and robust performance, it seamlessly integrates into various devices, making it ideal for IoT, automotive, and consumer electronics. Trust in STMicroelectronics’ legacy of innovation to enhance your projects with cutting-edge technology that drives success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the body material ensures durability and resistance to environmental factors, making it suitable for various applications.

Surface Mount: YES

Being a surface mount device allows for easier integration into compact circuit designs, facilitating efficient use of board space.

Package Shape: RECTANGULAR

The rectangular shape aids in versatile layout configurations and simplifies PCB design processes.

No. of Terminals: 28

With 28 terminals, this IC provides ample connectivity options, supporting a wide range of configurations and functionalities.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

This style allows for a thinner overall profile, ideal for modern electronic devices requiring miniaturization and lower weight.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature, this product can perform reliably in more demanding environments.

Minimum Operating Temperature: -40 °C

The ability to function at very low temperatures makes this product suitable for a range of extreme conditions.

Terminal Position: DUAL

Dual terminal positioning offers flexibility in layout and enhances the stability of connections on the PCB.

Maximum Seated Height: 1.2 mm

A low maximum seated height enables the component to fit in low-profile designs without compromising performance.

Width: 4.4 mm

The narrow width allows for denser packing of components, facilitating compact and high-performance electronic designs.

Length: 9.7 mm

Shorter lengths contribute to reduced signal trace lengths, which can enhance overall performance and signal integrity.

Peripheral IC Type: CRYPTOGRAPHIC AUTHENTICATOR

As a cryptographic authenticator, this IC provides essential security features, making it suitable for products requiring secure communication.

Technology: CMOS

CMOS technology ensures low power consumption, making this product energy-efficient and ideal for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals provide excellent solderability and mechanical stability, contributing to reliable performance in both assembly and operation.

Nominal Supply Voltage: 1.8 V

Low nominal supply voltage ensures compatibility with modern low-power electronic systems, extending battery life.

Terminal Pitch: 0.65 mm

A small terminal pitch allows for a tighter layout on PCBs, accommodating more integrations in a smaller space.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs ST33HTPH2E28AHB8 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from STMicroelectronics

Specs

Additional Features:

ALSO OPERATES AT 3.3V NOMINAL VOLATGE

JESD-30 Code:

R-PDSO-G28

Length:

9.7 mm

No. of Terminals:

28

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP28,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Maximum Seated Height:

1.2 mm

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Peripheral IC Type:

Trade Compliance

ST33HTPH2E28AHB8 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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