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ST33HTPH2028AHC9

STMicroelectronics

ST33HTPH2028AHC9 by STMicroelectronics

ST33HTPH2028AHC9 by STMicroelectronics is a cryptographic authenticator in a compact 28-terminal SOIC package. It operates b/w -40 °C to 105 °C, with a nominal voltage of 1.8V. Ideal for secure applications, it ensures robust data protection in embedded systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,687 parts In-Stock

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3,687

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Vyrian

USA . 1,558 parts In-Stock

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1,558

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Anansix

USA . 472 parts In-Stock

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472

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,438 parts In-Stock

1+ parts

$50.381

100+ parts

-

1k+ parts

$45.343

10k+ parts

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1,438

$50.381

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$45.343

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Corohmni

South Africa . 2,048 parts In-Stock

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$84.106

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2,048

$84.106

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MKK Technologies

India . 1,887 parts In-Stock

1+ parts

$94.738

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1,887

$94.738

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DigiPath Technology Company

USA . 1,887 parts In-Stock

1+ parts

$94.738

100+ parts

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1,887

$94.738

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Parana Technologies

USA . 1,620 parts In-Stock

1+ parts

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$60.238

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1,620

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$60.238

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Corphita

USA . 1,210 parts In-Stock

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1,210

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Overview

Unlock the future of secure connectivity with the ST33HTPH2028AHC9 from STMicroelectronics! Renowned for excellence, STMicroelectronics delivers unmatched reliability in cryptographic authenticators, ensuring your applications are fortified against threats. This compact powerhouse operates efficiently across a broad temperature range, making it ideal for diverse environments. Elevate your projects with trust and innovation—experience superior performance that stands the test of time!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material enhances the robustness and longevity of the component.

Surface Mount: YES

Surface mount technology allows for a compact design, making integration into smaller devices easier.

Package Shape: RECTANGULAR

A rectangular package shape supports efficient use of PCB space, optimizing layout for performance.

No. of Terminals: 28

With 28 terminals, this IC provides a sufficient number of connections for complex functionalities.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

This package style aids in miniaturization, ideal for modern electronics where space is at a premium.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature makes this component suitable for a wide range of applications in challenging environments.

Minimum Operating Temperature: -40 °C

The ability to function in extreme cold conditions expands its potential use in outdoor and harsh environments.

Terminal Position: DUAL

Dual terminal positioning enhances versatility in mounting and connection options on a circuit board.

Maximum Seated Height: 1.2 mm

A low seated height allows for slim profile applications, contributing to overall space savings.

Width: 4.4 mm

A compact width enables more efficient layout and design in tight spaces without sacrificing function.

Length: 9.7 mm

The short length of the IC further supports miniaturization and design flexibility.

Peripheral IC Type: CRYPTOGRAPHIC AUTHENTICATOR

As a cryptographic authenticator, this IC improves security for applications that require data protection.

Technology: CMOS

CMOS technology enhances power efficiency and allows for high performance in a compact footprint.

Terminal Form: GULL WING

Gull wing terminal form provides excellent solderability and mechanical stability during surface mounting.

Nominal Supply Voltage: 1.8 V

The low supply voltage of 1.8 V contributes to reduced power consumption, making it suitable for energy-efficient designs.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm supports higher density designs, allowing for more terminals in a smaller area.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs ST33HTPH2028AHC9 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from STMicroelectronics

Specs

Additional Features:

ALSO OPERATES AT 3.3V NOMINAL VOLATGE

JESD-30 Code:

R-PDSO-G28

Length:

9.7 mm

No. of Terminals:

28

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP28,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Maximum Seated Height:

1.2 mm

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Peripheral IC Type:

Trade Compliance

ST33HTPH2028AHC9 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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