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CC3220MODSF12MOBR

Texas Instruments

CC3220MODSF12MOBR by Texas Instruments

The Texas Instruments CC3220MODSF12MOBR is a Cortex-M4 microprocessor with 256 RAM words and 1024000 ROM words. It features 4-Ch 12-Bit ADC channels, TIMER(4), WDT peripherals, and I2C, I2S, SD, SPI, UART connectivity. Ideal for industrial applications requiring low power consumption and fixed-point format processing.

Median Price

$25.880

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 17,128 parts In-Stock

1+ parts

$16.208

100+ parts

$14.158

1k+ parts

$9.764

10k+ parts

-

17,128

$16.208

$14.158

$9.764

-

Mouser Electronics

USA . 786 parts In-Stock

1+ parts

$25.880

100+ parts

$19.180

1k+ parts

$17.670

10k+ parts

-

786

$25.880

$19.180

$17.670

-

DigiKey

USA . 566 parts In-Stock

1+ parts

$25.880

100+ parts

$19.871

1k+ parts

$18.933

10k+ parts

-

566

$25.880

$19.871

$18.933

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 200 parts In-Stock

1+ parts

$12.735

100+ parts

-

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-

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200

$12.735

-

-

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Digiode

USA . 4,813 parts In-Stock

1+ parts

$15.398

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-

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4,813

$15.398

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Vyrian

USA . 5,768 parts In-Stock

1+ parts

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5,768

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-

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TME

Poland . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

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$10.290

10k+ parts

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3,000

-

-

$10.290

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RLX Solution Inc.

Canada . 113 parts In-Stock

1+ parts

-

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113

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Netroflash

USA . 500 parts In-Stock

1+ parts

$12.735

100+ parts

-

1k+ parts

-

10k+ parts

-

500

$12.735

-

-

-

Continental Prestige Electronics

USA . 489 parts In-Stock

1+ parts

$12.735

100+ parts

-

1k+ parts

-

10k+ parts

$12.480

489

$12.735

-

-

$12.480

Ampacity Inc.

Singapore . 5,729 parts In-Stock

1+ parts

$13.410

100+ parts

-

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-

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5,729

$13.410

-

-

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Corphita

USA . 1,187 parts In-Stock

1+ parts

$14.587

100+ parts

-

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-

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1,187

$14.587

-

-

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Advanced Electronics

New Zealand . 76 parts In-Stock

1+ parts

$26.774

100+ parts

$25.435

1k+ parts

$25.435

10k+ parts

-

76

$26.774

$25.435

$25.435

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Semicontronic

India . 6,159 parts In-Stock

1+ parts

$29.190

100+ parts

$28.460

1k+ parts

$28.314

10k+ parts

-

6,159

$29.190

$28.460

$28.314

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Corohmni

South Africa . 2,057 parts In-Stock

1+ parts

$35.132

100+ parts

-

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2,057

$35.132

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Parana Technologies

USA . 499 parts In-Stock

1+ parts

$58.271

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499

$58.271

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DigiPath Technology Company

USA . 1,555 parts In-Stock

1+ parts

$64.164

100+ parts

$59.030

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-

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1,555

$64.164

$59.030

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IDEA Electronic Components Group

UK . 930 parts In-Stock

1+ parts

$65.473

100+ parts

$62.199

1k+ parts

$58.926

10k+ parts

-

930

$65.473

$62.199

$58.926

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ChromeModa Solutions

Germany . 586 parts In-Stock

1+ parts

$65.473

100+ parts

$53.688

1k+ parts

-

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586

$65.473

$53.688

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QUARKTWIN TECHNOLOGY LTD

USA . 27,718 parts In-Stock

1+ parts

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27,718

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Lixinc

USA . 11,151 parts In-Stock

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11,151

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Argo Parts USA

USA . 484 parts In-Stock

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484

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Overview

Elevate your projects with the CC3220MODSF12MOBR by Texas Instruments, a premium quality microprocessor circuit that offers unparalleled connectivity and high-performance capabilities. With cutting-edge technology and a wide range of peripherals including timers and watchdog timers, this chip carrier package provides customers with endless possibilities for their designs. Ideal for industrial applications, the CC3220MODSF12MOBR ensures low power consumption and seamless integration thanks to its advanced features. Trust Texas Instruments to deliver top-notch solutions for your next project.

Feature Benefit Bullets

Surface Mount: YES

Ease of assembly onto PCBs, saves space and provides better reliability in high vibration environments.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power supply options and compatibility with various voltage levels.

On Chip Data RAM Width: 8

Efficient data processing and storage capabilities for applications requiring fast access to data.

Package Shape: RECTANGULAR

Standard shape for easy integration into existing designs and assembly processes.

No. of Terminals: 63

Sufficient number of terminals for connecting to peripherals and external components.

Package Style (Meter): CHIP CARRIER

Compact and durable package style suitable for space-constrained applications.

Minimum Supply Voltage: 2.3 V

Wide operating voltage range for versatility in power supply options.

Maximum Operating Temperature: 85 °C

Suitable for industrial environments with varying temperature conditions.

CPU Family: CORTEX-M4

Advanced CPU architecture offering high performance and efficiency for complex applications.

Minimum Operating Temperature: -40 °C

Operational in extreme cold environments without compromising performance.

Terminal Finish: NICKEL GOLD

Durable terminal finish for reliable connections and long-term performance.

ADC Channels: YES

Integrated analog-to-digital converters for sensor interfacing and data acquisition.

Terminal Position: BOTTOM

Easy accessibility for soldering and connection to external components.

ROM Words: 1024000

Large on-chip memory for storing program instructions and data.

Maximum Seated Height: 2.45 mm

Low-profile design suitable for compact electronic devices.

RAM Words: 256

Sufficient on-chip RAM for temporary data storage and manipulation.

Width: 17.5 mm

Compact form factor for space-constrained applications.

Boundary Scan: YES

Built-in boundary scan capability for testing and debugging during production.

Peripherals: TIMER(4), WDT

Integrated timers and watchdog timer for precise timing and system monitoring.

Maximum Time At Peak Reflow Temperature (s): 30

Optimal reflow profile for ensuring solder joint reliability during assembly.

Peak Reflow Temperature °C: 260

High reflow temperature capability for lead-free soldering processes.

Length: 20.5 mm

Compact form factor suitable for small electronic devices and PCB layouts.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh industrial environments with high reliability.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Integrated peripherals for enhanced functionality and system control.

No. of Timers: 4

Multiple timers for accurate timekeeping and event scheduling.

RAM Bytes: 262144

Large on-chip RAM capacity for data storage and processing.

Technology: CMOS

Low power consumption and high noise immunity for efficient operation.

Terminal Form: BUTT

Secure terminal design for reliable connections and signal integrity.

Analog To Digital Convertors: 4-Ch 12-Bit

Multiple high-resolution ADCs for accurate analog signal conversion.

Nominal Supply Voltage: 3.3 V

Standard supply voltage for compatibility with common power sources.

No. of DMA Channels: 2

Direct Memory Access channels for efficient data transfer and processing.

No. of Serial I/Os: 2

Serial communication interfaces for data exchange with external devices.

Connectivity: I2C, I2S, SD, SPI, UART

Multiple communication interfaces for connectivity with various peripherals.

ROM Programmability: FLASH

Flexible ROM programming option for easy firmware updates and modifications.

Terminal Pitch: 1.27 mm

Standard terminal pitch for compatibility with common PCB layouts and connectors.

Format: FIXED POINT

Fixed-point data format for efficient mathematical operations and numerical calculations.

Moisture Sensitivity Level (MSL): 3

Suitable for reflow soldering processes with moderate moisture sensitivity.

Speed: 2400 rpm

Operating speed suitable for real-time data processing and control applications.

Low Power Mode: YES

Power-saving mode for energy-efficient operation and extended battery life.

On Chip Program ROM Width: 8

Efficient program storage for quick access and execution of instructions.

No. of I/O Lines: 25

Sufficient I/O lines for interfacing with external sensors, actuators, and peripherals.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs CC3220MODSF12MOBR attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Boundary Scan:

YES

CPU Family:

CORTEX-M4

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-XBCC-B63

JESD-609 Code:

e4

Length:

20.5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

2

No. of External Interrupts:

0

No. of I/O Lines:

25

No. of Serial I/Os:

2

No. of Terminals:

63

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

UNSPECIFIED

Package Code:

BCC

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

RAM Bytes:

262144

RAM Words:

256

ROM Words:

1024000

ROM Programmability:

FLASH

Maximum Seated Height:

2.45 mm

Speed:

2400 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

17.5 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, I2S, SD, SPI, UART

Peripherals:

TIMER(4), WDT

Analog To Digital Convertors:

4-Ch 12-Bit

Trade Compliance

CC3220MODSF12MOBR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

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