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SLB9670XQ20FW762XUMA1

Infineon Technologies

SLB9670XQ20FW762XUMA1 by Infineon Technologies

SLB9670XQ20FW762XUMA1 by Infineon Technologies is a cryptographic authenticator with CMOS technology. It has a package style of chip carrier, heat sink/slug, and very thin profile. With a max supply voltage of 1.95V, it is suitable for industrial applications requiring secure authentication.

Median Price

$4.850

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 3,752 parts In-Stock

1+ parts

$4.850

100+ parts

$4.270

1k+ parts

$3.250

10k+ parts

-

3,752

$4.850

$4.270

$3.250

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 953 parts In-Stock

1+ parts

$4.608

100+ parts

-

1k+ parts

-

10k+ parts

-

953

$4.608

-

-

-

Chip Stock

USA . 10,050 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10,050

-

-

-

-

Vyrian

USA . 3,527 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,527

-

-

-

-

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

100

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 3,554 parts In-Stock

1+ parts

$4.120

100+ parts

$4.017

1k+ parts

$3.996

10k+ parts

-

3,554

$4.120

$4.017

$3.996

-

Ampacity Inc.

Singapore . 3,328 parts In-Stock

1+ parts

$4.120

100+ parts

-

1k+ parts

-

10k+ parts

-

3,328

$4.120

-

-

-

Corphita

USA . 658 parts In-Stock

1+ parts

$4.365

100+ parts

-

1k+ parts

-

10k+ parts

-

658

$4.365

-

-

-

Corohmni

South Africa . 1,867 parts In-Stock

1+ parts

$30.336

100+ parts

-

1k+ parts

-

10k+ parts

-

1,867

$30.336

-

-

-

Aztec Data Supply Inc.

USA . 2,679 parts In-Stock

1+ parts

$31.200

100+ parts

-

1k+ parts

-

10k+ parts

-

2,679

$31.200

-

-

-

Modulus Dynamics

Lithuania . 2,034 parts In-Stock

1+ parts

$47.583

100+ parts

$45.680

1k+ parts

$43.776

10k+ parts

-

2,034

$47.583

$45.680

$43.776

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Perfect Parts

USA . 11,200 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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11,200

-

-

-

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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5,000

-

-

-

-

Continental Prestige Electronics

USA . 3,462 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

-

10k+ parts

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3,462

-

-

-

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Argo Parts USA

USA . 418 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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418

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Bastille Electronics

Australia . 23 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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23

-

-

-

-

Overview

Discover the SLB9670XQ20FW762XUMA1 by Infineon Technologies, a game-changing product in the category of Other Function uPs, uCs & Peripheral ICs. This cutting-edge chip offers unmatched quality and performance, backed by the reputable manufacturer, Infineon Technologies. With its compact size and versatile applications, it delivers incredible value to customers. Whether you need cryptographic authentication or secure data transfer, this product's advanced technology and industrial-grade temperature tolerance have got you covered. Experience the advantages and benefits of the SLB9670XQ20FW762XUMA1 today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides good durability and protection for the integrated circuit.

Surface Mount: YES

Surface mount technology allows for easy installation on circuit boards, saving space and making assembly more efficient.

Maximum Supply Voltage: 1.95 V

Operates at a maximum supply voltage of 1.95V, suitable for low power applications.

Package Shape: SQUARE

Square package shape is compact and ideal for space-constrained designs.

No. of Terminals: 32

32 terminals provide ample connectivity options for various system configurations.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The chip carrier style, along with heat sink/slug and very thin profile, aids in efficient heat dissipation and compact design.

Minimum Operating Temperature: -40 °C

Capable of operating at a minimum temperature of -40 °C, suitable for industrial environments with extreme conditions.

Maximum Operating Temperature: 85 °C

Can withstand maximum operating temperature of 85 °C, ensuring reliability in various environmental conditions.

Peripheral IC Type: CRYPTOGRAPHIC AUTHENTICATOR

Incorporates cryptographic authentication functionality, enhancing security features in the design.

Nominal Supply Voltage: 1.8 V

Operates at nominal supply voltage of 1.8V, compatible with standard power requirements.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs SLB9670XQ20FW762XUMA1 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Infineon Technologies

Specs

Additional Features:

ALSO AVAILABLE WITH 3.3V NOM SUPPLY

JESD-30 Code:

S-PQCC-N32

Length:

5 mm

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

.9 mm

Maximum Supply Voltage:

1.95 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

5 mm

Peripheral IC Type:

Trade Compliance

SLB9670XQ20FW762XUMA1 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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