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XC7Z030-2FBG676E

Xilinx

XC7Z030-2FBG676E by Xilinx

The Xilinx XC7Z030-2FBG676E is a System on Chip with CMOS technology. It operates b/w 0-100°C, with supply voltage range of 0.95-1.05V. With 676 terminals in a square grid array package, it's ideal for various applications requiring high-performance microprocessing capabilities.

Median Price

$431.580

Lifecycle Status

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5

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Digiode

USA . 488 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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VNN

France . 332 parts In-Stock

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Vyrian

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Infinite Electronics LLP

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AZTECH Wire

Italy . 617 parts In-Stock

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$15.781

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Aztec Data Supply Inc.

USA . 56 parts In-Stock

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Corohmni

South Africa . 383 parts In-Stock

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Modulus Dynamics

Lithuania . 106 parts In-Stock

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Advanced Electronics

New Zealand . 1,598 parts In-Stock

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$145.250

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$137.987

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Texas Native Microelectronics

USA . 800 parts In-Stock

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$171.374

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Kenton Components

USA . 833 parts In-Stock

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$205.649

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$197.423

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$180.971

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Vigor

Singapore . 921 parts In-Stock

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One Stop Electronics

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Ampacity Inc.

Singapore . 41 parts In-Stock

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Semicontronic

India . 2 parts In-Stock

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Corphita

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Argo Parts USA

USA . 1,966 parts In-Stock

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$422.948

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$418.633

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Continental Prestige Electronics

USA . 421 parts In-Stock

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Netroflash

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Qasali Group International

UK . 4,736 parts In-Stock

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Authorized Procurement Solutions

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A-Z Elektronik GmbH

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MARBEL Systems

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Lixinc

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Kepictronics

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Supply Digital

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Overview

Unlock the power of cutting-edge technology with the XC7Z030-2FBG676E by Xilinx. Designed with precision and expertise, this versatile System on Chip offers unmatched performance and reliability for a wide range of applications. From IoT devices to industrial automation, this product delivers seamless integration and efficiency, ensuring optimal results for all your projects. Experience the next level of innovation with Xilinx and elevate your designs to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the product, making it suitable for a wide range of applications.

Surface Mount: YES

This feature allows for easy and secure installation on circuit boards, saving time and effort during the manufacturing process.

Maximum Supply Voltage: 1.05 V

The high maximum supply voltage ensures compatibility with various power sources, adding versatility to the product.

Package Shape: SQUARE

The square shape helps optimize space utilization on circuit boards, making it an efficient choice for compact designs.

No. of Terminals: 676

With a high number of terminals, this product offers extensive connectivity options for complex electronic systems.

Package Style (Meter): GRID ARRAY

The grid array package style provides stability and reliability, ensuring consistent performance in demanding environments.

Minimum Supply Voltage: 0.95 V

The low minimum supply voltage allows for efficient power consumption, making this product energy-efficient.

Maximum Operating Temperature: 100 °C

The high maximum operating temperature ensures reliability in extreme conditions, enhancing the product's durability.

Minimum Operating Temperature: 0 °C

With a low minimum operating temperature, this product can function effectively in a wide range of environments.

Terminal Position: BOTTOM

The terminal position on the bottom simplifies installation and maintenance of the product, making it user-friendly.

Maximum Seated Height: 2.54 mm

The low maximum seated height minimizes the overall profile of the product, ideal for space-constrained applications.

Width: 27 mm

The width of 27mm is suitable for various mounting configurations, offering flexibility in design options.

Length: 27 mm

The length of 27mm ensures a compact form factor, making this product suitable for small electronic devices.

Peripheral IC Type: SYSTEM ON CHIP

This type of peripheral IC integrates multiple functions into a single chip, reducing system complexity and improving performance.

Technology: CMOS

The CMOS technology offers low power consumption and high noise immunity, making this product efficient and reliable.

Terminal Form: BALL

The ball terminal form provides secure connections and reliable performance, ensuring a stable operation of the product.

Nominal Supply Voltage: 1 V

The nominal supply voltage of 1V is ideal for compatibility with standard power sources, making this product easy to integrate into existing systems.

Terminal Pitch: 1 mm

With a terminal pitch of 1mm, this product offers precise and reliable connections, suitable for high-density circuit designs.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XC7Z030-2FBG676E attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

S-PBGA-B676

Length:

27 mm

No. of Terminals:

676

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA676,26X26,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Maximum Seated Height:

2.54 mm

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

27 mm

Peripheral IC Type:

Trade Compliance

XC7Z030-2FBG676E Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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