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LS1021ASN7KQB

NXP Semiconductors

LS1021ASN7KQB by NXP Semiconductors

LS1021ASN7KQB by NXP Semiconductors is a MICROPROCESSOR CIRCUIT with 525 terminals in a GRID ARRAY package. It operates at 0.97-1.03 V and features TIN SILVER COPPER terminal finish. Ideal for applications requiring high performance in a compact form factor.

Median Price

$39.718

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

LS1021ASN7KQB by NXP Semiconductors
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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 138 parts In-Stock

1+ parts

$62.000

100+ parts

$45.771

1k+ parts

$44.609

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138

$62.000

$45.771

$44.609

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Verical

USA . 168 parts In-Stock

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$39.718

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168

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$39.718

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Rochester

USA . 43 parts In-Stock

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$38.260

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$34.230

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$32.220

43

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$38.260

$34.230

$32.220

Distributors (In-Stock)

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Digiode

USA . 2,474 parts In-Stock

1+ parts

$40.384

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2,474

$40.384

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Nova Conductors

Japan . 68 parts In-Stock

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$50.810

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68

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Flip Electronics

USA . 11,923 parts In-Stock

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Vyrian

USA . 6,607 parts In-Stock

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Chip Stock

USA . 4,300 parts In-Stock

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Anansix

USA . 1,251 parts In-Stock

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TME

Poland . 168 parts In-Stock

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$40.230

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168

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$40.230

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Bristol Electronics

USA . 59 parts In-Stock

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Goldney Electronics S.L.

Spain . 1 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 381 parts In-Stock

1+ parts

$7.832

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381

$7.832

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Ampacity Inc.

Singapore . 103 parts In-Stock

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$36.130

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103

$36.130

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Semicontronic

India . 73 parts In-Stock

1+ parts

$36.130

100+ parts

$35.227

1k+ parts

$35.046

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73

$36.130

$35.227

$35.046

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Corphita

USA . 2,589 parts In-Stock

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$38.259

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2,589

$38.259

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Aranea Global

USA . 2,000 parts In-Stock

1+ parts

$49.794

100+ parts

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$47.802

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2,000

$49.794

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$47.802

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Continental Prestige Electronics

USA . 1,326 parts In-Stock

1+ parts

$50.810

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$49.794

1,326

$50.810

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$49.794

Corohmni

South Africa . 2,081 parts In-Stock

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$53.240

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2,081

$53.240

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Vigor

Singapore . 2,895 parts In-Stock

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$61.000

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$61.000

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Aztec Data Supply Inc.

USA . 34,929 parts In-Stock

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$67.019

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Microchip USA

USA . 2,036 parts In-Stock

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$140.254

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iodParts Technologies Inc.

India . 14,218 parts In-Stock

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Lixinc

USA . 13,285 parts In-Stock

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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Perfect Parts

USA . 7,829 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,395 parts In-Stock

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7,395

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UNI Independent Distributors

Spain . 4,925 parts In-Stock

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Argo Parts USA

USA . 3,598 parts In-Stock

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Kepictronics

USA . 2,200 parts In-Stock

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Alle Elektronik GmbH

Germany . 1,100 parts In-Stock

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Overview

Experience the unmatched quality and performance of the LS1021ASN7KQB by NXP Semiconductors, a leading manufacturer in the industry. This versatile microprocessor circuit is perfect for a wide range of applications, offering exceptional value and benefits to customers. With its advanced technology and reliable design, this product provides unparalleled advantages in the field of Other Function uPs,uCs & Peripheral ICs. Trust NXP Semiconductors to deliver top-notch solutions for your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and cost-effective.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on PCBs, saving space and reducing assembly time.

Maximum Supply Voltage: 1.03 V

The high maximum supply voltage ensures stable and reliable operation under varying input conditions.

Package Shape: SQUARE

The square package shape helps in easy orientation and alignment during installation and circuit design.

No. of Terminals: 525

The high number of terminals allow for multiple connections and functionalities, making the product versatile.

Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG

The grid array style with heat sink/slug enhances thermal performance and overall reliability of the product.

Minimum Supply Voltage: 0.97 V

The low minimum supply voltage ensures compatibility with various power sources and energy-efficient operation.

Terminal Finish: TIN SILVER COPPER

The terminal finish with tin, silver, and copper provides good conductivity, corrosion resistance, and reliability.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy mounting and soldering onto the PCB, ensuring a secure connection.

Maximum Seated Height: 2.07 mm

The low maximum seated height allows for compact design and integration into tight spaces or slim devices.

Width: 19 mm

The moderate width provides a balance between space efficiency and accessibility for connecting peripheral components.

Maximum Time At Peak Reflow Temperature (s): 40

The specified time at peak reflow temperature ensures proper soldering and reliability during manufacturing processes.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance allows for robust solder joints and withstands harsh environmental conditions.

Length: 19 mm

The matching length with width indicates a square shape, providing symmetry and ease of integration in PCB layouts.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

The use of a microprocessor circuit as a peripheral IC enhances processing capabilities and performance of the device.

Technology: CMOS

The CMOS technology offers low power consumption, high speed, and compatibility with various digital systems and applications.

Terminal Form: BALL

The ball terminal form simplifies soldering and connection while ensuring good electrical contact and mechanical strength.

Nominal Supply Voltage: 1 V

The nominal supply voltage of 1V provides a standard operating range for efficient power management and stability.

Terminal Pitch: 0.8 mm

The small terminal pitch enables high-density mounting and compact PCB designs for space-limited applications.

Moisture Sensitivity Level (MSL): 3

The MSL level of 3 indicates moderate sensitivity to moisture, requiring standard handling and storage precautions for reliability.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs LS1021ASN7KQB attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PBGA-B525

JESD-609 Code:

e1

Length:

19 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

525

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, HEAT SINK/SLUG

Peak Reflow Temperature (C):

260

Maximum Seated Height:

2.07 mm

Maximum Supply Voltage:

1.03 V

Minimum Supply Voltage:

.97 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

19 mm

Peripheral IC Type:

Trade Compliance

LS1021ASN7KQB Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.1

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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