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LS1023AXE7MQB

NXP Semiconductors

LS1023AXE7MQB by NXP Semiconductors

SoC; Terminal Form: BALL; No. of Terminals: 621; Package Shape: SQUARE; Terminal Finish: TIN SILVER COPPER; Maximum Operating Temperature: 105 Cel;

Median Price

$63.914

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 9,960 parts In-Stock

1+ parts

-

100+ parts

$63.914

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$63.914

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Flip Electronics (Authorized)

USA . 40 parts In-Stock

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40

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Distributors (In-Stock)

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Vyrian

USA . 7,290 parts In-Stock

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7,290

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Digiode

USA . 3,683 parts In-Stock

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3,683

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Anansix

USA . 1,271 parts In-Stock

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1,271

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Flip Electronics

USA . 87 parts In-Stock

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87

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Distributors (Availability)

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AZTECH Wire

Italy . 271 parts In-Stock

1+ parts

$13.660

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271

$13.660

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Vigor

Singapore . 1,568 parts In-Stock

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$89.155

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1,568

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Microchip USA

USA . 1,745 parts In-Stock

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$164.230

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1,745

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UNI Independent Distributors

Spain . 4,710 parts In-Stock

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4,710

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Corphita

USA . 2,160 parts In-Stock

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Technical Specifications

Other Function uPs,uCs & Peripheral ICs LS1023AXE7MQB attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PBGA-B621

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

621

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Peak Reflow Temperature (C):

250

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

SoC

Trade Compliance

LS1023AXE7MQB Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.1

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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