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MCIMX6Y2CVM08AA

NXP Semiconductors

MCIMX6Y2CVM08AA by NXP Semiconductors

MCIMX6Y2CVM08AA by NXP Semiconductors is an industrial-grade SoC with CMOS technology. It operates b/w -40 to 105 °C and has a max supply voltage of 1.5 V. With 289 terminals in a square package, it's ideal for applications requiring low-profile, fine-pitch grid arrays.

Median Price

$11.078

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 500 parts In-Stock

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$10.347

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$10.347

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Bristol Electronics

USA . 500 parts In-Stock

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$11.808

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$7.085

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$6.790

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$11.808

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$6.790

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Digiode

USA . 4,382 parts In-Stock

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Vyrian

USA . 4,207 parts In-Stock

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Anansix

USA . 587 parts In-Stock

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Semtec, LLC

USA . 500 parts In-Stock

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Dan-Mar Components

USA . 500 parts In-Stock

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Flip Electronics

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ACDS - Activité Composants Distribution Service

France . 220 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 396 parts In-Stock

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$8.181

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Continental Prestige Electronics

USA . 449 parts In-Stock

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$10.347

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$10.140

449

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Bastille Electronics

Australia . 300 parts In-Stock

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$10.350

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$9.832

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$9.212

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$10.350

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$9.212

One Stop Electronics

USA . 1,311 parts In-Stock

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$19.000

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Ampacity Inc.

Singapore . 1,333 parts In-Stock

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$22.000

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Semicontronic

India . 686 parts In-Stock

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$26.000

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$25.350

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$25.220

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$26.000

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Microchip USA

USA . 3,266 parts In-Stock

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$34.463

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

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$55.088

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$50.130

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$45.172

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Corohmni

South Africa . 27 parts In-Stock

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$56.690

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Aztec Data Supply Inc.

USA . 1,030 parts In-Stock

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$74.020

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Lixinc

USA . 5,982 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Argo Parts USA

USA . 4,447 parts In-Stock

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Corphita

USA . 3,804 parts In-Stock

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UNI Independent Distributors

Spain . 2,101 parts In-Stock

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Overview

Experience unparalleled performance and reliability with the MCIMX6Y2CVM08AA from NXP Semiconductors. As a leader in semiconductor technology, NXP ensures that this product delivers top-notch quality and efficiency. Ideal for a wide range of applications in the Other Function uPs, uCs & Peripheral ICs category, this device offers unmatched value and benefits to customers. Trust NXP Semiconductors to provide you with cutting-edge solutions that meet your needs and exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, making it suitable for a wide range of applications.

Surface Mount: YES

Being surface mountable makes integration into circuit boards easier and more efficient, saving space and simplifying assembly.

Maximum Supply Voltage: 1.5 V

The high maximum supply voltage allows for flexibility in power input, accommodating a variety of voltage requirements.

Package Shape: SQUARE

The square package shape provides a compact footprint, optimizing space utilization on circuit boards.

No. of Terminals: 289

The high number of terminals offers extensive connectivity options, enabling versatile and complex circuit designs.

Minimum Operating Temperature: -40 °C

The wide range of minimum operating temperature ensures reliable performance in various environmental conditions, even in extreme cold.

Maximum Seated Height: 1.32 mm

The low profile design with a maximum seated height of 1.32 mm allows for a slim and compact form factor, suitable for applications with space constraints.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures the product can withstand harsh operating conditions in industrial environments, providing long-term reliability.

Peripheral IC Type: SoC

The System-on-Chip (SoC) design integrates multiple functionalities into a single IC, reducing the need for external components and simplifying system design.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor (CMOS) technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MCIMX6Y2CVM08AA attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PBGA-B289

Length:

14 mm

No. of Terminals:

289

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA289,17X17,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.32 mm

Maximum Supply Voltage:

1.5 V

Minimum Supply Voltage:

1.325 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

14 mm

Peripheral IC Type:

SoC

Trade Compliance

MCIMX6Y2CVM08AA Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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