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XC7Z030-1FBG676I

Xilinx

XC7Z030-1FBG676I by Xilinx

The Xilinx XC7Z030-1FBG676I is a System on Chip with CMOS technology. It operates b/w -40 to 100°C, with supply voltage ranging from 0.95V to 1.05V. With 676 terminals in a square grid array package, it's ideal for various applications requiring high-performance computing and peripheral integration.

Median Price

$401.450

Lifecycle Status

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9

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Mouser Electronics

USA . 23 parts In-Stock

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DigiKey

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Digiode

USA . 299 parts In-Stock

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VNN

France . 753 parts In-Stock

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Nova Conductors

Japan . 450 parts In-Stock

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Vyrian

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USBid, Inc.

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Touchstone Systems

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AZTECH Wire

Italy . 474 parts In-Stock

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$11.104

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Corohmni

South Africa . 438 parts In-Stock

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Aztec Data Supply Inc.

USA . 158 parts In-Stock

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Modulus Dynamics

Lithuania . 544 parts In-Stock

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Texas Native Microelectronics

USA . 50 parts In-Stock

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$166.510

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Advanced Electronics

New Zealand . 580 parts In-Stock

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Kenton Components

USA . 260 parts In-Stock

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$185.825

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Vigor

Singapore . 10 parts In-Stock

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Ampacity Inc.

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Semicontronic

India . 101 parts In-Stock

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Corphita

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Aranea Global

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Microchip USA

USA . 2,958 parts In-Stock

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$370.660

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Continental Prestige Electronics

USA . 6,152 parts In-Stock

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$374.805

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Argo Parts USA

USA . 1,174 parts In-Stock

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Qasali Group International

UK . 524 parts In-Stock

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Lixinc

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A-Z Elektronik GmbH

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Perfect Parts

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Supply Digital

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MARBEL Systems

Belgium . 347 parts In-Stock

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Futuretech Components

Singapore . 231 parts In-Stock

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RC Electronics

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Overview

Unlock a world of endless possibilities with the XC7Z030-1FBG676I by Xilinx! As a leading manufacturer in the industry, Xilinx delivers top-notch quality and reliability. This versatile System on Chip is perfect for a wide range of applications in Other Function uPs,uCs & Peripheral ICs. With its cutting-edge technology and superior performance, this product offers unmatched value and benefits to customers. Experience seamless integration and innovation like never before with the XC7Z030-1FBG676I!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and reliable material for packaging, ensuring the safety and longevity of the product.

Surface Mount: YES

Allows for easy and convenient installation on PCBs, saving time and effort during assembly.

Maximum Supply Voltage: 1.05 V

Supports a relatively high supply voltage, providing flexibility in power options.

Package Shape: SQUARE

Square shape allows for efficient use of space on PCBs, optimizing layout and design.

No. of Terminals: 676

High number of terminals accommodate a wide range of connections and functionalities.

Package Style (Meter): GRID ARRAY

Grid array package style offers good thermal performance and electrical characteristics.

Minimum Supply Voltage: 0.95 V

Low minimum supply voltage helps in reducing power consumption, enhancing energy efficiency.

Maximum Operating Temperature: 100 °C

High maximum operating temperature ensures stable performance even in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

Wide range of operating temperature makes the product suitable for various applications and environments.

Terminal Position: BOTTOM

Bottom terminal position offers easy access for soldering and maintenance.

Maximum Seated Height: 2.54 mm

Low seated height allows for a compact design, saving space in electronic devices.

Width: 27 mm

Optimal width for fitting into standard PCB designs, ensuring compatibility and ease of integration.

Length: 27 mm

Compact length contributes to space-saving and efficient layout on PCBs.

Peripheral IC Type: SYSTEM ON CHIP

Integration of multiple functions into a single chip simplifies circuit design and reduces component count.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with various digital systems.

Terminal Form: BALL

Ball terminal form provides reliable electrical connections and easy assembly on PCBs.

Nominal Supply Voltage: 1 V

Standard nominal supply voltage for compatibility with a wide range of power sources.

Terminal Pitch: 1 mm

Compact terminal pitch allows for dense integration of components on the PCB, maximizing functionality in limited space.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XC7Z030-1FBG676I attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

S-PBGA-B676

Length:

27 mm

No. of Terminals:

676

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA676,26X26,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Maximum Seated Height:

2.54 mm

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

27 mm

Peripheral IC Type:

Trade Compliance

XC7Z030-1FBG676I Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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