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CY8C4248LQI-BL483

Infineon Technologies

CY8C4248LQI-BL483 by Infineon Technologies

CY8C4248LQI-BL483 by Infineon Technologies is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 85 °C and supports supply voltage range of 1.71V to 5.5V, making it ideal for INDUSTRIAL applications requiring high performance in a compact SQUARE package style.

Median Price

$4.950

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 43 parts In-Stock

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$4.950

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$4.430

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$4.170

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$4.430

$4.170

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Digiode

USA . 242 parts In-Stock

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$5.234

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Chip Stock

USA . 10,900 parts In-Stock

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K-1 Technologies

USA . 1,932 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 914 parts In-Stock

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Goldney Electronics S.L.

Spain . 154 parts In-Stock

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Holdelec - ElecDif-Pro

France . 106 parts In-Stock

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Prism Electronics

USA . 60 parts In-Stock

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Vyrian

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 37 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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Ampacity Inc.

Singapore . 43 parts In-Stock

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$4.680

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Corphita

USA . 721 parts In-Stock

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$4.959

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Component Stockers USA

USA . 55 parts In-Stock

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$5.650

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Semicontronic

India . 43 parts In-Stock

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$10.190

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$9.935

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$9.884

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AZTECH Wire

Italy . 448 parts In-Stock

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$15.285

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Modulus Dynamics

Lithuania . 908 parts In-Stock

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$30.134

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$28.929

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$27.723

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$30.134

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$27.723

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Aztec Data Supply Inc.

USA . 386 parts In-Stock

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$31.208

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Corohmni

South Africa . 80 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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A-Z Elektronik GmbH

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Microchip USA

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Alle Elektronik GmbH

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Argo Parts USA

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Bastille Electronics

Australia . 800 parts In-Stock

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Continental Prestige Electronics

USA . 742 parts In-Stock

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Perfect Parts

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Kepictronics

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Computer Components Inc. - USA

USA . 23 parts In-Stock

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Overview

Discover the innovative CY8C4248LQI-BL483 by Infineon Technologies, a cutting-edge solution in the category of Other Function uPs,uCs & Peripheral ICs. With Infineon's reputation for quality and reliability, this product offers unmatched performance and versatility. Ideal for a wide range of applications, from industrial automation to consumer electronics, this microprocessor circuit is designed to meet the demands of today's technology-driven world. Experience the value and benefits of Infineon's CY8C4248LQI-BL483 and unlock endless possibilities for your projects.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, saving space and reducing assembly costs.

Maximum Supply Voltage: 5.5 V

Can handle higher supply voltages which provides flexibility in power supply options.

Package Shape: SQUARE

Square packages are easier to handle and provide a more uniform footprint on circuit boards.

No. of Terminals: 56

Having a higher number of terminals allows for more connectivity options and functionality.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile design helps in efficient heat dissipation and space-saving on the PCB.

Minimum Supply Voltage: 1.71 V

Can operate at low supply voltages which is useful for energy-efficient applications.

Maximum Operating Temperature: 85 °C

Can operate reliably at high temperatures, suitable for industrial environments.

Minimum Operating Temperature: -40 °C

Can operate in extremely low temperatures, ideal for harsh outdoor or industrial settings.

Terminal Position: QUAD

Quad terminal position allows for easy connection and fitting on the PCB.

Maximum Seated Height: 0.6 mm

Low profile design saves space and allows for compact circuit board layouts.

Width: 7 mm

Compact width allows for efficient use of space on the circuit board.

Length: 7 mm

Compact length saves space and allows for compact circuit board designs.

Temperature Grade: INDUSTRIAL

Suitable for industrial applications where temperature fluctuations are common.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Microprocessor circuit provides advanced processing capabilities for the device.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Terminal Form: NO LEAD

No lead terminals reduce the risk of damage during installation and improve reliability.

Nominal Supply Voltage: 3.3 V

Operates at a common nominal supply voltage, making it compatible with many power sources.

Terminal Pitch: 0.4 mm

Fine terminal pitch allows for high-density mounting and saves space on the PCB.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs CY8C4248LQI-BL483 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Infineon Technologies

Specs

JESD-30 Code:

S-XQCC-N56

Length:

7 mm

No. of Terminals:

56

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

.6 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Width:

7 mm

Peripheral IC Type:

Trade Compliance

CY8C4248LQI-BL483 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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