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XCZU2CG-1SFVC784I

Xilinx

XCZU2CG-1SFVC784I by Xilinx

XCZU2CG-1SFVC784I by Xilinx is a CMOS microprocessor circuit with 784 terminals in a square grid array package. Operating b/w -40 to 100 °C, it has a peak reflow temp of 250C. Ideal for industrial applications requiring low voltage supply and high processing power.

Median Price

$393.780

Lifecycle Status

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Newark

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Mouser Electronics

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DigiKey

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VNN

France . 794 parts In-Stock

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Nova Conductors

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AZTECH Wire

Italy . 604 parts In-Stock

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$12.661

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Aztec Data Supply Inc.

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MARBEL Systems

Belgium . 30,503 parts In-Stock

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Texas Native Microelectronics

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Kenton Components

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$60.756

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Corohmni

South Africa . 1,224 parts In-Stock

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Modulus Dynamics

Lithuania . 178 parts In-Stock

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Qasali Group International

UK . 3,884 parts In-Stock

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$136.701

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Vigor

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One Stop Electronics

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Ampacity Inc.

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Microchip USA

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Continental Prestige Electronics

USA . 5,276 parts In-Stock

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Argo Parts USA

USA . 3,828 parts In-Stock

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$365.690

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iBuyXS LLC

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Semicontronic

India . 25 parts In-Stock

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Overview

Discover the cutting-edge XCZU2CG-1SFVC784I by Xilinx, a top-tier manufacturer in the realm of Other Function uPs, uCs & Peripheral ICs. This innovative product boasts superior quality and reliability, offering customers unparalleled value and benefits. With applications ranging from microprocessor circuits to industrial-grade technology, this versatile device is sure to meet all your needs. Upgrade your projects with the XCZU2CG-1SFVC784I and experience the advantages of Xilinx's industry-leading solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material ensures durability and reliability in various environmental conditions.

Surface Mount: YES

The surface mount feature allows for easy installation and space-saving on PCBs.

Package Shape: SQUARE

The square shape of the package provides efficient use of board space and easy alignment during assembly.

No. of Terminals: 784

With a high number of terminals, this product offers versatile connectivity options for complex electronic systems.

Package Style (Meter): GRID ARRAY

The grid array package style ensures secure connections and high performance in demanding applications.

Maximum Operating Temperature: 100 °C

The high maximum operating temperature allows for reliable operation in hot environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures functionality in extreme cold conditions.

Terminal Finish: Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

The terminal finish provides corrosion resistance and electrical conductivity for long-term performance.

Terminal Position: BOTTOM

The bottom terminal position facilitates easy soldering and connection to the PCB.

Maximum Time At Peak Reflow Temperature (s): 30

The short time at peak reflow temperature minimizes the risk of damage to sensitive components during assembly.

Peak Reflow Temperature °C: 250

The high peak reflow temperature ensures proper soldering and reliability of connections.

Temperature Grade: INDUSTRIAL

The industrial temperature grade guarantees operation in harsh industrial environments.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

The microprocessor circuit design enables advanced functionality and processing capabilities.

Technology: CMOS

The CMOS technology offers low power consumption and high-speed operation for efficient performance.

Terminal Form: BALL

The ball terminal form provides secure connections and efficient heat dissipation.

Nominal Supply Voltage: 0.85 V

The low nominal supply voltage saves power and reduces heat generation for energy-efficient operation.

Moisture Sensitivity Level (MSL): 4

The moisture sensitivity level of 4 ensures protection against moisture-related damage during storage and operation.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XCZU2CG-1SFVC784I attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

S-PBGA-B784

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

784

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

250

Nominal Supply Voltage:

.85 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

XCZU2CG-1SFVC784I Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.4

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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