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XCZU4EV-1SFVC784E

Xilinx

XCZU4EV-1SFVC784E by Xilinx

XCZU4EV-1SFVC784E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100 °C and has 784 terminals in a GRID ARRAY package style. Suitable for applications requiring high performance uPs/uCs & Peripheral ICs.

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$1,359.645

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Overview

Enhance your electronic projects with the XCZU4EV-1SFVC784E by Xilinx. Known for its top-notch quality and reliability, Xilinx is a trusted manufacturer in the industry. This versatile microprocessor circuit offers numerous applications in various fields. With a wide range of features and benefits, this product provides exceptional value to customers looking for high-performance solutions. Upgrade your designs with the XCZU4EV-1SFVC784E and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and robustness, making this product suitable for rugged environments.

Surface Mount: YES

Surface mount technology allows for easy and compact integration onto circuit boards, saving space and reducing assembly time.

Maximum Supply Voltage: 0.876 V

The high maximum supply voltage allows for flexibility in power input, accommodating a wide range of applications.

Package Shape: RECTANGULAR

The rectangular shape provides easy alignment and placement on PCBs, enhancing assembly efficiency.

No. of Terminals: 784

The high number of terminals allows for multiple connections and functions, increasing the versatility of the product.

Package Style (Meter): GRID ARRAY

The grid array package style offers a compact and organized layout of terminals, facilitating efficient routing of signals.

Minimum Supply Voltage: 0.825 V

The low minimum supply voltage ensures efficient power consumption and operation, making the product energy-efficient.

Maximum Operating Temperature: 100 °C

The high maximum operating temperature allows for reliable performance in high-temperature environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product ideal for battery-powered devices.

Terminal Form: BALL

The ball terminal form provides reliable connections and minimizes soldering defects during assembly.

Nominal Supply Voltage: 0.85 V

The nominal supply voltage ensures stable and consistent operation, enhancing the reliability of the product.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XCZU4EV-1SFVC784E attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

R-PBGA-B784

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

784

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

250

Maximum Supply Voltage:

.876 V

Minimum Supply Voltage:

.825 V

Nominal Supply Voltage:

.85 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

XCZU4EV-1SFVC784E Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.4

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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