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CY8C6136BZI-F34

Infineon Technologies

CY8C6136BZI-F34 by Infineon Technologies

CY8C6136BZI-F34 by Infineon is a 124-terminal, programmable SoC with CMOS technology. It operates b/w -40 to 85 °C and has a supply voltage range of 1.7V to 3.6V. With a very thin profile and fine pitch, it's ideal for applications requiring high-performance microcontrollers in compact spaces.

Median Price

$8.440

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 55 parts In-Stock

1+ parts

$6.500

100+ parts

$4.310

1k+ parts

-

10k+ parts

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55

$6.500

$4.310

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Element14

Singapore . 60 parts In-Stock

1+ parts

$8.070

100+ parts

-

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60

$8.070

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Verical

USA . 30 parts In-Stock

1+ parts

$8.440

100+ parts

-

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30

$8.440

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-

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Chip1Stop

Japan . 30 parts In-Stock

1+ parts

$9.570

100+ parts

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30

$9.570

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DigiKey

USA . 1,924 parts In-Stock

1+ parts

$10.150

100+ parts

$6.673

1k+ parts

$6.186

10k+ parts

$6.039

1,924

$10.150

$6.673

$6.186

$6.039

Mouser Electronics

USA . 2,263 parts In-Stock

1+ parts

$11.120

100+ parts

$7.110

1k+ parts

$5.600

10k+ parts

-

2,263

$11.120

$7.110

$5.600

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RS (Exports)

UK . 259 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$5.863

10k+ parts

-

259

-

-

$5.863

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 735 parts In-Stock

1+ parts

$5.576

100+ parts

-

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735

$5.576

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Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$6.211

100+ parts

-

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300

$6.211

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-

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Vyrian

USA . 30 parts In-Stock

1+ parts

-

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30

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 285 parts In-Stock

1+ parts

$4.490

100+ parts

$4.378

1k+ parts

$4.355

10k+ parts

-

285

$4.490

$4.378

$4.355

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Corphita

USA . 484 parts In-Stock

1+ parts

$5.283

100+ parts

-

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484

$5.283

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Continental Prestige Electronics

USA . 1,017 parts In-Stock

1+ parts

$6.211

100+ parts

-

1k+ parts

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10k+ parts

$6.087

1,017

$6.211

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-

$6.087

Ampacity Inc.

Singapore . 143 parts In-Stock

1+ parts

$9.770

100+ parts

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143

$9.770

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Microchip USA

USA . 424 parts In-Stock

1+ parts

$25.396

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424

$25.396

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Aztec Data Supply Inc.

USA . 1,293 parts In-Stock

1+ parts

$27.635

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1,293

$27.635

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Modulus Dynamics

Lithuania . 351 parts In-Stock

1+ parts

$37.676

100+ parts

$36.169

1k+ parts

$34.662

10k+ parts

-

351

$37.676

$36.169

$34.662

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Corohmni

South Africa . 5,239 parts In-Stock

1+ parts

$51.522

100+ parts

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5,239

$51.522

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QUARKTWIN TECHNOLOGY LTD

USA . 15,032 parts In-Stock

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15,032

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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10,000

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Perfect Parts

USA . 4,480 parts In-Stock

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4,480

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Argo Parts USA

USA . 2,784 parts In-Stock

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2,784

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Infinite Electronics LLP (Excess)

. 2,610 parts In-Stock

1+ parts

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100+ parts

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2,610

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Overview

Unlock the full potential of your projects with the CY8C6136BZI-F34 by Infineon Technologies. As a leading manufacturer in the industry, Infineon delivers unparalleled quality and reliability in their products. This versatile Programmable SoC is perfect for a wide range of applications, offering flexibility and customization to suit your needs. Experience the benefits of this product's advanced technology, efficient design, and high performance. Upgrade your projects today with the CY8C6136BZI-F34 and see the difference it can make!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and heat resistance, making it suitable for a wide range of applications.

Surface Mount: YES

Surface mount technology allows for efficient PCB assembly, saving space and reducing overall production costs.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, this product can handle a wide range of power requirements.

Package Shape: SQUARE

The square shape makes it easy to integrate into designs and ensures efficient use of space.

No. of Terminals: 124

With a large number of terminals, this product offers ample connectivity options for complex circuitry.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

This package style offers high performance and reliability in a compact form factor.

Minimum Supply Voltage: 1.7 V

The low minimum supply voltage allows for flexibility in power sources and energy-efficient operation.

Maximum Operating Temperature: 85 °C

This high operating temperature range ensures reliable performance in various environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for use in extreme cold environments without sacrificing performance.

Terminal Finish: TIN SILVER COPPER

This terminal finish provides excellent conductivity and corrosion resistance, extending the product's lifespan.

Terminal Position: BOTTOM

The terminal position makes it easy to connect the product to a PCB and ensures a secure electrical connection.

Maximum Seated Height: 1 mm

The low seated height allows for a compact design and efficient use of space in electronic devices.

Width: 9 mm

The narrow width of the product makes it suitable for applications where space is limited.

Length: 9 mm

The short length of the product ensures a small footprint, ideal for compact electronic designs.

Peripheral IC Type: PROGRAMMABLE SoC

The programmable System on Chip design offers flexibility and customization options for specific applications.

Technology: CMOS

The CMOS technology used in this product provides low power consumption and high speed operation.

Terminal Form: BALL

The ball terminal form ensures reliable connections and easy soldering during assembly.

Nominal Supply Voltage: 1.8 V

The nominal supply voltage provides stable power delivery for consistent performance.

Terminal Pitch: 0.65 mm

With a narrow terminal pitch, this product offers high-density connectivity for complex circuit designs.

Moisture Sensitivity Level (MSL): 3

The MSL rating of 3 indicates that this product is resistant to moisture, ensuring long-term reliability in various environments.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs CY8C6136BZI-F34 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Infineon Technologies

Specs

JESD-30 Code:

S-PBGA-B124

JESD-609 Code:

e1

Length:

9 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

124

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA124,13X13,25

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.7 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Width:

9 mm

Peripheral IC Type:

Trade Compliance

CY8C6136BZI-F34 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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