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TMS320DM368ZCE

Texas Instruments

TMS320DM368ZCE by Texas Instruments

TMS320DM368ZCE by Texas Instruments is a 32-bit microprocessor with 8192 RAM words, operating at temperatures from 0 to 85°C. It supports I2C, SPI, UART, and USB buses for various applications requiring low profile and fine pitch package style. The processor has a supply voltage range of 1.28-1.8V and features a grid array package with a terminal pitch of 0.65mm.

Median Price

$50.140

Lifecycle Status

Suppliers In-Stock

24

In-Stock Inventory

1k+

Distributors (Authorized)

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Texas Instruments

USA . 429 parts In-Stock

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$28.204

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$25.070

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$18.434

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429

$28.204

$25.070

$18.434

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DigiKey

USA . 239 parts In-Stock

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$50.140

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$38.925

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$35.822

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239

$50.140

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$35.822

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Mouser Electronics

USA . 93 parts In-Stock

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$50.140

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$35.830

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Distributors (In-Stock)

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Bristol Electronics

USA . 61 parts In-Stock

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$23.486

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$19.729

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61

$23.486

$19.729

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Digiode

USA . 1,194 parts In-Stock

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$26.794

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Nova Conductors

Japan . 27 parts In-Stock

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Maritex

Poland . 800 parts In-Stock

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$46.598

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$33.061

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Vyrian

USA . 7,120 parts In-Stock

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Quantum Digital Technology

USA . 4,436 parts In-Stock

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Cyclops Electronics Ltd

UK . 3,835 parts In-Stock

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Sensible Micro Corp

USA . 3,803 parts In-Stock

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Chip Stock

USA . 1,600 parts In-Stock

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Rebound Electronics

UK . 230 parts In-Stock

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Elcom Components

USA . 160 parts In-Stock

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EZ Electronic Parts

Israel . 85 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 61 parts In-Stock

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Dan-Mar Components

USA . 61 parts In-Stock

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ComSIT Distribution GmbH

Germany . 42 parts In-Stock

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PC Components Company LLC

USA . 40 parts In-Stock

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Connector Distribution Corp

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Right Parts Inc.

USA . 21 parts In-Stock

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Electronics Depot

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DF Sales Co.

USA . 1 parts In-Stock

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DF Sales Co.

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Distributors (Availability)

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AZTECH Wire

Italy . 342 parts In-Stock

1+ parts

$12.830

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342

$12.830

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Semicontronic

India . 230 parts In-Stock

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$23.970

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$23.371

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$23.251

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$23.970

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$23.251

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Ampacity Inc.

Singapore . 35 parts In-Stock

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$23.970

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Corphita

USA . 357 parts In-Stock

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$25.384

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Continental Prestige Electronics

USA . 438 parts In-Stock

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$29.402

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$28.814

438

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$28.814

Bastille Electronics

Australia . 38 parts In-Stock

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$33.620

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$31.939

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$29.922

38

$33.620

$31.939

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$29.922

Parana Technologies

USA . 1,625 parts In-Stock

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$42.046

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$3,904.634

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$37.842

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1,625

$42.046

$3,904.634

$37.842

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DigiPath Technology Company

USA . 2,370 parts In-Stock

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$46.298

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$42.594

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2,370

$46.298

$42.594

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IDEA Electronic Components Group

UK . 1,473 parts In-Stock

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$47.243

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$44.881

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$42.519

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1,473

$47.243

$44.881

$42.519

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ChromeModa Solutions

Germany . 326 parts In-Stock

1+ parts

$47.243

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$38.739

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326

$47.243

$38.739

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

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$50.208

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$49.706

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$47.698

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$50.208

$49.706

$47.698

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Corohmni

South Africa . 725 parts In-Stock

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$56.062

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Lixinc

USA . 17,645 parts In-Stock

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Perfect Parts

USA . 9,708 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,670 parts In-Stock

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4,670

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Epart123

USA . 1,920 parts In-Stock

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$36.500

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$36.500

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GlobX GmbH

Germany . 1,600 parts In-Stock

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Argo Parts USA

USA . 1,281 parts In-Stock

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S.R.D Solutions

India . 750 parts In-Stock

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750

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Technoshack Inc. (Excess)

Canada . 314 parts In-Stock

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314

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GreenTree Electronics

Israel . 301 parts In-Stock

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Authorized Procurement Solutions

USA . 301 parts In-Stock

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Kepictronics

USA . 193 parts In-Stock

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Emar International I/E

Canada . 158 parts In-Stock

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ChipstoGo Electronic ltd

UK . 56 parts In-Stock

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56

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Overview

Experience top-of-the-line performance with the TMS320DM368ZCE by Texas Instruments, a leading manufacturer known for cutting-edge technology. This versatile microprocessor circuit offers a wide range of applications in various industries, providing customers with unparalleled value and benefits. With a powerful 32-bit design and advanced features, this product ensures reliability and efficiency in every use. Upgrade your projects with the TMS320DM368ZCE and unlock endless possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection, making the product suitable for various environments.

Surface Mount: YES

Allows for easy and convenient installation on PCBs, saving space and reducing assembly time.

Maximum Supply Voltage: 1.42 V

Ensures stable operation within a safe voltage range, protecting the components from damage.

Package Shape: SQUARE

Square shape enables efficient use of board space and facilitates uniform heat dissipation.

Bit Size: 32

Higher bit size allows for processing larger chunks of data at a time, improving efficiency.

Power Supplies (V): 1.35, 1.8, 3.3

Multiple voltage options offer flexibility in power management and compatibility with different systems.

No. of Terminals: 338

Abundance of terminals enables connectivity with various external components for enhanced functionality.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Grid array and fine pitch design optimize signal integrity and thermal performance, suitable for high-speed applications.

Minimum Supply Voltage: 1.28 V

Low minimum supply voltage ensures energy efficiency and extends the product's operating range.

Maximum Operating Temperature: 85 °C

High operating temperature tolerance ensures reliable performance in challenging environments.

Minimum Operating Temperature: 0 °C

Wide temperature range support allows the product to function in both extreme cold and hot conditions.

Terminal Finish: TIN SILVER COPPER

These finishes provide superior conductivity and corrosion resistance for long-term reliability.

Terminal Position: BOTTOM

Bottom terminal position aids in proper heat dissipation and facilitates easier PCB layout.

Maximum Seated Height: 1.3 mm

Low profile design helps in compact device assembly and allows for thinner electronic products.

RAM Words: 8192

Ample RAM capacity enables efficient data storage and processing for complex applications.

Width: 13 mm

Compact width dimension allows for space-saving integration in various electronic designs.

External Data Bus Width: 32

Wide data bus width enhances data throughput and processing speed, improving overall performance.

Maximum Time At Peak Reflow Temperature (s): 30

Optimal reflow time ensures proper soldering and reliable connections during assembly.

Peak Reflow Temperature °C: 260

High reflow temperature capability supports lead-free soldering processes for environmental compliance.

Length: 13 mm

Compact length dimension contributes to space-efficient PCB layout and overall product miniaturization.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Incorporation of microprocessor circuit enhances processing capabilities and enables advanced functions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for efficient operation.

Terminal Form: BALL

Ball terminals provide reliable electrical connections and facilitate easy rework or component replacement.

Nominal Supply Voltage: 1.35 V

Stable nominal supply voltage ensures consistent performance and prolongs the product's lifespan.

Bus Compatibility: I2C; SPI; UART; USB

Wide bus compatibility allows for seamless integration with various communication protocols and peripherals.

Terminal Pitch: 0.65 mm

Fine terminal pitch enables high-density mounting and enhances signal transmission efficiency.

Format: FIXED POINT

Fixed-point format simplifies arithmetic operations and ensures accurate data processing.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates good moisture resistance, suitable for standard handling and storage conditions.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs TMS320DM368ZCE attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Bit Size:

32

Bus Compatibility:

I2C; SPI; UART; USB

External Data Bus Width:

32

Format:

FIXED POINT

JESD-30 Code:

S-PBGA-B338

JESD-609 Code:

e1

Length:

13 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

338

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA338,19X19,25

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.35,1.8,3.3

Qualification:

Not Qualified

RAM Words:

8192

Maximum Seated Height:

1.3 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.42 V

Minimum Supply Voltage:

1.28 V

Nominal Supply Voltage:

1.35 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

13 mm

Peripheral IC Type:

Trade Compliance

TMS320DM368ZCE Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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