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TMS320DM355DZCEA21

Texas Instruments

TMS320DM355DZCEA21 by Texas Instruments

TMS320DM355DZCEA21 by Texas Instruments is a 32-bit microprocessor with 8192 RAM words. It operates at temperatures from -40 to 100°C and supports I2C, SPI, UART, and USB buses. This industrial-grade IC has a package style of grid array with low profile and fine pitch for various applications.

Median Price

$38.737

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 34,409 parts In-Stock

1+ parts

$29.544

100+ parts

$26.262

1k+ parts

$19.310

10k+ parts

-

34,409

$29.544

$26.262

$19.310

-

DigiKey

USA . 160 parts In-Stock

1+ parts

$47.930

100+ parts

$37.618

1k+ parts

-

10k+ parts

-

160

$47.930

$37.618

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 237 parts In-Stock

1+ parts

$28.067

100+ parts

-

1k+ parts

-

10k+ parts

-

237

$28.067

-

-

-

Vyrian

USA . 4,312 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,312

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,042 parts In-Stock

1+ parts

$17.906

100+ parts

-

1k+ parts

$18.075

10k+ parts

-

2,042

$17.906

-

$18.075

-

ChromeModa Solutions

Germany . 4,253 parts In-Stock

1+ parts

$20.119

100+ parts

$16.498

1k+ parts

-

10k+ parts

-

4,253

$20.119

$16.498

-

-

IDEA Electronic Components Group

UK . 2,101 parts In-Stock

1+ parts

$20.119

100+ parts

$19.113

1k+ parts

$18.107

10k+ parts

-

2,101

$20.119

$19.113

$18.107

-

Ampacity Inc.

Singapore . 17,049 parts In-Stock

1+ parts

$25.110

100+ parts

-

1k+ parts

-

10k+ parts

-

17,049

$25.110

-

-

-

Corphita

USA . 1,663 parts In-Stock

1+ parts

$26.590

100+ parts

-

1k+ parts

-

10k+ parts

-

1,663

$26.590

-

-

-

Corohmni

South Africa . 141 parts In-Stock

1+ parts

$56.175

100+ parts

-

1k+ parts

-

10k+ parts

-

141

$56.175

-

-

-

Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,000

-

-

-

-

DigiPath Technology Company

USA . 1,681 parts In-Stock

1+ parts

-

100+ parts

$18.139

1k+ parts

-

10k+ parts

-

1,681

-

$18.139

-

-

Perfect Parts

USA . 560 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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560

-

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Overview

Elevate your projects with the TMS320DM355DZCEA21 from Texas Instruments. Known for their top-notch quality and innovative solutions, Texas Instruments delivers once again with this versatile microprocessor circuit. Ideal for a wide range of applications, this product offers customers unparalleled value and performance. Whether you're working on IoT devices, industrial control systems, or consumer electronics, the TMS320DM355DZCEA21 is sure to meet your needs with its advanced technology and reliable design. Choose Texas Instruments for cutting-edge solutions that bring your ideas to life.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy package body material makes this product lightweight and durable, ideal for portable and long-lasting applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly, saving time and cost during production.

Maximum Supply Voltage: 1.365 V

With a maximum supply voltage of 1.365 V, this product is suitable for low power applications, ensuring energy efficiency.

Package Shape: SQUARE

The square package shape provides uniformity and ease of mounting on the PCB, optimizing space utilization.

Bit Size: 32

With a 32-bit size, this product offers high computational power and can handle complex tasks efficiently.

Power Supplies (V): 1.3,1.8,3.3

Support for multiple power supply voltages enables flexibility in designing and integrating the product into various systems.

No. of Terminals: 337

Having 337 terminals allows for a wide range of connectivity options, making the product versatile and compatible with different interfaces.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array, low profile, and fine pitch package style makes the product suitable for high-density PCB layouts, improving overall system performance.

Minimum Supply Voltage: 1.235 V

The minimum supply voltage of 1.235 V ensures reliable operation even under low power conditions, enhancing system stability.

Maximum Operating Temperature: 100 °C

With a maximum operating temperature of 100°C, this product is designed to withstand high thermal conditions, ensuring long-term reliability.

Minimum Operating Temperature: -40 °C

The ability to operate at a minimum temperature of -40°C makes this product suitable for use in extreme environmental conditions.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin silver copper provides excellent conductivity and corrosion resistance, ensuring reliable connections for optimal performance.

Terminal Position: BOTTOM

Having terminals at the bottom enables easy and secure soldering during assembly, enhancing the overall durability of the product.

Maximum Seated Height: 1.3 mm

The maximum seated height of 1.3 mm allows for a compact design, saving space and enabling integration in space-constrained applications.

RAM Words: 8192

With 8192 RAM words, this product offers ample memory capacity for storage and processing of data, enhancing overall system performance.

Width: 13 mm

The width of 13 mm provides a balanced form factor, allowing for efficient placement on the PCB and optimal utilization of space.

External Data Bus Width: 32

With a 32-bit external data bus width, this product can transfer data quickly and efficiently, improving overall system throughput.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time of 30 seconds at peak reflow temperature ensures reliable soldering during assembly, maintaining the product's integrity.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C allows for secure and durable solder joints, enhancing the product's reliability.

Length: 13 mm

The length of 13 mm offers a compact and streamlined design, making the product suitable for smaller electronic devices and applications.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperature grades ensures that this product can operate reliably in harsh industrial environments, making it a robust choice for industrial applications.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

The use of a microprocessor circuit as the peripheral IC type allows for advanced processing capabilities and versatile functionality, making this product suitable for a wide range of applications.

Technology: CMOS

Utilizing CMOS technology provides low power consumption and high-speed operation, making this product energy-efficient and ideal for battery-powered devices.

Terminal Form: BALL

Having terminals in ball form facilitates secure and reliable solder joints, ensuring long-lasting connections and robust performance.

Nominal Supply Voltage: 1.3 V

The nominal supply voltage of 1.3 V ensures stable operation and compatibility with various voltage requirements, making the product versatile and reliable.

Bus Compatibility: I2C; SPI; UART; USB

Support for various bus protocols such as I2C, SPI, UART, and USB enhances connectivity options, enabling seamless integration with different systems and devices.

Terminal Pitch: 0.65 mm

With a terminal pitch of 0.65 mm, this product offers precise and secure connections, ensuring reliable performance and ease of assembly.

Format: FIXED POINT

The fixed-point format provides accurate and efficient data processing, making this product suitable for applications that require precise calculations and computations.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, this product is resistant to moisture and can withstand manufacturing and storage processes, ensuring long-term reliability and performance.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs TMS320DM355DZCEA21 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Additional Features:

IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O

Bit Size:

32

Bus Compatibility:

I2C; SPI; UART; USB

External Data Bus Width:

32

Format:

FIXED POINT

JESD-30 Code:

S-PBGA-B337

JESD-609 Code:

e1

Length:

13 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

337

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA337,19X19,25

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.3,1.8,3.3

Qualification:

Not Qualified

RAM Words:

8192

Maximum Seated Height:

1.3 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.365 V

Minimum Supply Voltage:

1.235 V

Nominal Supply Voltage:

1.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

13 mm

Peripheral IC Type:

Trade Compliance

TMS320DM355DZCEA21 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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