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XCZU7EG-2FBVB900E

Xilinx

XCZU7EG-2FBVB900E by Xilinx

XCZU7EG-2FBVB900E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It features 900 terminals in a GRID ARRAY package style, with dimensions of 31mm x 31mm. Operating b/w 0 to 100 °C, it has a supply voltage range of 0.825V to 0.876V making it ideal for high-performance computing applications.

Median Price

$3,757.525

Lifecycle Status

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1k+

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Nova Conductors

Japan . 90 parts In-Stock

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Vyrian

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Ampacity Inc.

Singapore . 915 parts In-Stock

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$9.000

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AZTECH Wire

Italy . 613 parts In-Stock

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One Stop Electronics

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Semicontronic

India . 1,026 parts In-Stock

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$22.425

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$22.310

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MARBEL Systems

Belgium . 50 parts In-Stock

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$48.258

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$46.328

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Texas Native Microelectronics

USA . 25 parts In-Stock

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$55.469

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$53.250

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$51.586

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Kenton Components

USA . 983 parts In-Stock

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Corohmni

South Africa . 4,954 parts In-Stock

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Modulus Dynamics

Lithuania . 1,455 parts In-Stock

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Microchip USA

USA . 1,632 parts In-Stock

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Continental Prestige Electronics

USA . 6,221 parts In-Stock

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Argo Parts USA

USA . 1,164 parts In-Stock

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$3,719.950

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$3,682.374

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$3,644.799

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$3,644.799

Authorized Procurement Solutions

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Corphita

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Netroflash

USA . 100 parts In-Stock

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$3,569.649

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$3,494.498

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Qasali Group International

UK . 45 parts In-Stock

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$143.776

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$131.794

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Overview

Unleash the power of innovation with the XCZU7EG-2FBVB900E by Xilinx. As a leading manufacturer in the industry, Xilinx delivers top-quality products like this microprocessor circuit that are designed to revolutionize the way you work and play. With a wide range of applications, this cutting-edge technology offers unmatched value, benefits, and advantages to customers looking for superior performance and reliability. Elevate your projects to the next level with the XCZU7EG-2FBVB900E and experience the difference that Xilinx can make in your world.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable devices.

Surface Mount: YES

The surface mount feature enables easy and efficient assembly on circuit boards, saving space and reducing production costs.

Maximum Supply Voltage: 0.876 V

The high maximum supply voltage allows for stable and reliable operation of the product in various applications.

No. of Terminals: 900

With a large number of terminals, the product can support complex circuit connections and functionalities.

Maximum Operating Temperature: 100 °C

The high maximum operating temperature ensures the product's performance and reliability in extreme environmental conditions.

Terminal Finish: Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

The terminal finish provides good conductivity and solderability, enhancing the product's overall electrical performance.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

The microprocessor circuit allows for advanced processing capabilities, making the product suitable for complex computational tasks.

Technology: CMOS

The CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Terminal Pitch: 1 mm

The small terminal pitch enables compact design and space-saving layout on circuit boards.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XCZU7EG-2FBVB900E attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

R-PBGA-B900

JESD-609 Code:

e1

Length:

31 mm

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

900

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Maximum Seated Height:

2.97 mm

Maximum Supply Voltage:

.876 V

Minimum Supply Voltage:

.825 V

Nominal Supply Voltage:

.85 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

31 mm

Peripheral IC Type:

Trade Compliance

XCZU7EG-2FBVB900E Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.4

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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