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TMS320DM355DZCEA13

Texas Instruments

TMS320DM355DZCEA13 by Texas Instruments

TMS320DM355DZCEA13 by Texas Instruments is a 32-bit microprocessor with 8192 RAM words. It operates at supply voltages of 1.3V, 1.8V, and 3.3V, making it suitable for various applications requiring a low-profile grid array package style with fine pitch terminals. This CMOS technology-based peripheral IC is ideal for compact devices needing high processing power in a small form factor.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,238 parts In-Stock

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Digiode

USA . 544 parts In-Stock

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544

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Distributors (Availability)

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One Stop Electronics

USA . 1,133 parts In-Stock

1+ parts

$3.000

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1,133

$3.000

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AZTECH Wire

Italy . 393 parts In-Stock

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$9.653

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393

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Parana Technologies

USA . 849 parts In-Stock

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$37.068

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849

$37.068

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DigiPath Technology Company

USA . 379 parts In-Stock

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$40.817

100+ parts

$37.552

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379

$40.817

$37.552

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ChromeModa Solutions

Germany . 5,650 parts In-Stock

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$41.650

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$34.153

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5,650

$41.650

$34.153

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IDEA Electronic Components Group

UK . 346 parts In-Stock

1+ parts

$41.650

100+ parts

$39.568

1k+ parts

$37.485

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346

$41.650

$39.568

$37.485

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Corohmni

South Africa . 2,882 parts In-Stock

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$80.415

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Microchip USA

USA . 2,416 parts In-Stock

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Corphita

USA . 1,380 parts In-Stock

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Overview

Experience superior performance and reliability with the TMS320DM355DZCEA13 by Texas Instruments. As a leader in semiconductor manufacturing, Texas Instruments offers cutting-edge solutions for a variety of applications in the Other Function uPs,uCs & Peripheral ICs category. This product provides unmatched value, benefits, and advantages to customers looking for high-quality microprocessor circuits. Trust in Texas Instruments for innovative technology that delivers exceptional results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable.

Surface Mount: YES

Being surface mountable allows for easy installation and space-saving on the PCB.

Maximum Supply Voltage: 1.365 V

The maximum supply voltage of 1.365V ensures efficient power usage and prevents damage due to overvoltage.

Package Shape: SQUARE

The square package shape makes it easy to handle and integrate into the circuit design.

Bit Size: 32

Having a 32-bit size allows for efficient processing and handling of data.

Power Supplies (V): 1.3, 1.8, 3.3

Multiple power supply options make the product versatile and compatible with various systems.

No. of Terminals: 337

The high number of terminals allows for a wide range of connectivity options and functionality.

Terminal Finish: TIN SILVER COPPER

The use of tin-silver-copper as terminal finish ensures good conductivity and corrosion resistance.

Terminal Position: BOTTOM

Bottom terminal position allows for easy and secure connections on the PCB.

Maximum Seated Height: 1.3 mm

Low seated height of 1.3mm saves space and enables compact designs.

RAM Words: 8192

Having 8192 RAM words allows for efficient data storage and processing.

Width: 13 mm

With a width of 13mm, the product can fit into compact spaces and circuit layouts.

Maximum Time At Peak Reflow Temperature (s): 30

The short reflow time of 30 seconds ensures quick and efficient soldering during assembly.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C ensures proper soldering and reliability of the product.

Length: 13 mm

The 13mm length provides a balanced form factor for easy integration and handling.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Being a microprocessor circuit, it offers advanced processing capabilities and functionality.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity for efficient operation.

Terminal Form: BALL

The use of ball terminals enables reliable and secure connections on the PCB.

Nominal Supply Voltage: 1.3 V

Having a nominal supply voltage of 1.3V ensures stability and compatibility with various systems.

Terminal Pitch: 0.65 mm

The small terminal pitch of 0.65mm allows for high-density mounting and space-saving on the PCB.

Format: FIXED POINT

The fixed-point format is suitable for precise mathematical calculations and data processing.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates that the product has moderate sensitivity to moisture, suitable for standard operating conditions.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs TMS320DM355DZCEA13 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Additional Features:

IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O

Bit Size:

32

Format:

FIXED POINT

JESD-30 Code:

S-PBGA-B337

JESD-609 Code:

e1

Length:

13 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

337

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA337,19X19,25

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.3,1.8,3.3

Qualification:

Not Qualified

RAM Words:

8192

Maximum Seated Height:

1.3 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.365 V

Minimum Supply Voltage:

1.235 V

Nominal Supply Voltage:

1.3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

13 mm

Peripheral IC Type:

Trade Compliance

TMS320DM355DZCEA13 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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