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TMS320DM335ZCE270

Texas Instruments

TMS320DM335ZCE270 by Texas Instruments

TMS320DM335ZCE270 by Texas Instruments is a 32-bit microprocessor with 337 terminals, operating at temperatures from 0 to 85°C. It supports I2C, SPI, UART, and USB buses and has a supply voltage range of 1.235V to 1.365V. Ideal for applications requiring high-performance computing in compact spaces.

Median Price

$21.476

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 44,612 parts In-Stock

1+ parts

-

100+ parts

$19.090

1k+ parts

$17.080

10k+ parts

$16.070

44,612

-

$19.090

$17.080

$16.070

Verical

USA . 36,324 parts In-Stock

1+ parts

-

100+ parts

$23.863

1k+ parts

$21.350

10k+ parts

$20.087

36,324

-

$23.863

$21.350

$20.087

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,046 parts In-Stock

1+ parts

$20.150

100+ parts

-

1k+ parts

-

10k+ parts

-

1,046

$20.150

-

-

-

DigiKey Marketplace

USA . 44,612 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

44,612

-

-

-

-

Vyrian

USA . 4,030 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,030

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,840 parts In-Stock

1+ parts

$19.089

100+ parts

-

1k+ parts

-

10k+ parts

-

4,840

$19.089

-

-

-

Corohmni

South Africa . 2,678 parts In-Stock

1+ parts

$24.429

100+ parts

-

1k+ parts

-

10k+ parts

-

2,678

$24.429

-

-

-

Parana Technologies

USA . 1,725 parts In-Stock

1+ parts

$26.614

100+ parts

-

1k+ parts

$27.176

10k+ parts

-

1,725

$26.614

-

$27.176

-

DigiPath Technology Company

USA . 978 parts In-Stock

1+ parts

$29.305

100+ parts

$26.961

1k+ parts

-

10k+ parts

-

978

$29.305

$26.961

-

-

ChromeModa Solutions

Germany . 6,786 parts In-Stock

1+ parts

$29.903

100+ parts

$24.520

1k+ parts

-

10k+ parts

-

6,786

$29.903

$24.520

-

-

IDEA Electronic Components Group

UK . 244 parts In-Stock

1+ parts

$29.903

100+ parts

$28.408

1k+ parts

$26.913

10k+ parts

-

244

$29.903

$28.408

$26.913

-

Microchip USA

USA . 1,386 parts In-Stock

1+ parts

$56.042

100+ parts

-

1k+ parts

-

10k+ parts

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1,386

$56.042

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Perfect Parts

USA . 289 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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289

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Overview

Experience the power of innovation with the TMS320DM335ZCE270 by Texas Instruments. This cutting-edge microprocessor circuit offers unparalleled performance and reliability for a wide range of applications. Whether you're looking to enhance your IoT devices, robotics, or industrial control systems, this product delivers superior quality and versatility. Trust in Texas Instruments' reputation for excellence and unlock the full potential of your projects with the TMS320DM335ZCE270. Elevate your designs today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides good durability and protection for the product, making it suitable for various environments.

Surface Mount: YES

Surface mount capability allows for easier and more efficient assembly of the product onto circuit boards.

Maximum Supply Voltage: 1.365 V

Higher maximum supply voltage provides flexibility and reliability in power management.

Package Shape: SQUARE

Square package shape helps in optimizing space on circuit boards and simplifies the overall design layout.

No. of Terminals: 337

Large number of terminals allow for versatile connectivity and functionality within the product.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Grid array package style with low profile and fine pitch design enables high density integration and efficient signal routing.

Minimum Supply Voltage: 1.235 V

Lower minimum supply voltage helps in power efficiency and extends the battery life of electronic devices.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures the product can reliably function in various temperature conditions without overheating.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature guarantees the product can operate in colder environments without performance issues.

Terminal Finish: TIN SILVER COPPER

Tin, silver, and copper terminal finish provides good conductivity and resistance to corrosion, ensuring long-term reliability of connections.

Terminal Position: BOTTOM

Bottom terminal position offers easier accessibility and maintenance during installation and troubleshooting processes.

Maximum Seated Height: 1.3 mm

Low maximum seated height contributes to the overall compactness and space-saving design of the product.

Width: 13 mm

Compact width dimension facilitates easy integration of the product into constrained spaces or layouts.

External Data Bus Width: 32

32-bit external data bus width allows for high-speed data processing and efficient communication within the product.

Maximum Time At Peak Reflow Temperature (s): 30

Short reflow time at peak temperature ensures quick and effective soldering during manufacturing processes.

Peak Reflow Temperature °C: 260

High peak reflow temperature capability ensures reliable soldering and assembly of components on the product.

Length: 13 mm

Compact length dimension contributes to space optimization and flexibility in product placement and layout.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Microprocessor circuit type enhances the processing capabilities and functionality of the product for advanced applications.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and compatibility with various digital systems, making the product energy-efficient and versatile.

Terminal Form: BALL

Ball terminal form provides good solderability and reliability in connecting the product to circuit boards or other components.

Nominal Supply Voltage: 1.3 V

Stable nominal supply voltage ensures consistent performance and reliability of the product in varying operating conditions.

Bus Compatibility: I2C; SPI; UART; USB

Multiple bus compatibility options enable seamless integration and communication with various devices and systems, enhancing the product's versatility and interoperability.

Terminal Pitch: 0.65 mm

Narrow terminal pitch allows for high pin density and compact layout design, improving connectivity and signal transmission efficiency.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate sensitivity to moisture, which is important for ensuring proper storage and handling of the product to prevent damage.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs TMS320DM335ZCE270 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Bus Compatibility:

I2C; SPI; UART; USB

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B337

JESD-609 Code:

e1

Length:

13 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

337

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.3 mm

Maximum Supply Voltage:

1.365 V

Minimum Supply Voltage:

1.235 V

Nominal Supply Voltage:

1.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

13 mm

Peripheral IC Type:

Trade Compliance

TMS320DM335ZCE270 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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