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CY8C3866AXI-039T

Infineon Technologies

CY8C3866AXI-039T by Infineon Technologies

CY8C3866AXI-039T by Infineon is a 100-terminal, low-profile, fine-pitch FLATPACK IC with a CMOS technology and 524288 ROM bits. Operating at -40 to 85 °C, it has a supply voltage range of 1.71V to 5.5V making it ideal for industrial applications requiring a programmable SoC solution.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 750 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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750

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Digiode

USA . 418 parts In-Stock

1+ parts

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100+ parts

-

1k+ parts

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418

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Vyrian

USA . 379 parts In-Stock

1+ parts

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100+ parts

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379

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 1,466 parts In-Stock

1+ parts

$6.000

100+ parts

$5.850

1k+ parts

$5.820

10k+ parts

-

1,466

$6.000

$5.850

$5.820

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AZTECH Wire

Italy . 480 parts In-Stock

1+ parts

$6.534

100+ parts

-

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480

$6.534

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Ampacity Inc.

Singapore . 408 parts In-Stock

1+ parts

$19.000

100+ parts

-

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408

$19.000

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Advanced Electronics

New Zealand . 700 parts In-Stock

1+ parts

$46.226

100+ parts

$43.915

1k+ parts

$43.915

10k+ parts

-

700

$46.226

$43.915

$43.915

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Microchip USA

USA . 913 parts In-Stock

1+ parts

$46.374

100+ parts

-

1k+ parts

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10k+ parts

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913

$46.374

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Aztec Data Supply Inc.

USA . 499 parts In-Stock

1+ parts

$47.953

100+ parts

-

1k+ parts

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10k+ parts

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499

$47.953

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Modulus Dynamics

Lithuania . 1,144 parts In-Stock

1+ parts

$67.257

100+ parts

$64.567

1k+ parts

$61.876

10k+ parts

-

1,144

$67.257

$64.567

$61.876

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Corohmni

South Africa . 3,153 parts In-Stock

1+ parts

$67.772

100+ parts

-

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3,153

$67.772

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Component Stockers USA

USA . 531 parts In-Stock

1+ parts

$195.980

100+ parts

-

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10k+ parts

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531

$195.980

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QUARKTWIN TECHNOLOGY LTD

USA . 8,443 parts In-Stock

1+ parts

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100+ parts

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8,443

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Continental Prestige Electronics

USA . 2,294 parts In-Stock

1+ parts

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2,294

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Argo Parts USA

USA . 1,228 parts In-Stock

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1,228

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Corphita

USA . 172 parts In-Stock

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172

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Robosynatics

Brazil . 100 parts In-Stock

1+ parts

-

100+ parts

$140.311

1k+ parts

$140.311

10k+ parts

$140.311

100

-

$140.311

$140.311

$140.311

Lucentia Tech

USA . 100 parts In-Stock

1+ parts

-

100+ parts

$140.311

1k+ parts

$140.311

10k+ parts

$140.311

100

-

$140.311

$140.311

$140.311

Bastille Electronics

Australia . 10 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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10

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Overview

Unlock endless possibilities with the CY8C3866AXI-039T by Infineon Technologies. Crafted with precision and expertise, this programmable SoC offers unparalleled performance and reliability for a wide range of applications. From IoT devices to industrial automation, this versatile IC empowers you to bring your ideas to life with ease. Experience the next level of innovation with the CY8C3866AXI-039T and revolutionize your projects today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used for electronic components due to its durability and resistance to heat and chemicals.

Surface Mount: YES

Surface mount technology allows for smaller and lighter components, making this product suitable for compact and portable devices.

Maximum Supply Voltage: 5.5 V

Having a high maximum supply voltage provides flexibility and compatibility with a wide range of power sources.

Package Shape: SQUARE

A square package shape is space-efficient and allows for easy placement on a circuit board.

Power Supplies (V): 2/5

The availability of multiple power supply options allows for flexibility in design and energy efficiency.

No. of Terminals: 100

Having a high number of terminals enables connectivity with various other components and peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This package style offers a compact and low-profile design, making it suitable for space-constrained applications.

Minimum Supply Voltage: 1.71 V

The low minimum supply voltage ensures efficient power consumption and compatibility with lower power sources.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product is suitable for industrial applications where high temperatures may be encountered.

Minimum Operating Temperature: -40 °C

The wide operating temperature range ensures reliable performance even in extreme cold conditions.

Terminal Finish: PURE TIN

Pure tin terminal finish provides good conductivity and solderability, ensuring reliable connections.

Ultraviolet Erasable: N

Not being ultraviolet erasable indicates that programming or configuration of this product is permanent and secure.

Terminal Position: QUAD

Quad terminal positioning allows for consistent and secure connections, enhancing the reliability of the product.

Maximum Seated Height: 1.6 mm

The low seated height of this product is beneficial for applications where space constraints are a concern.

Width: 14 mm

The compact width of this product enables efficient use of PCB real estate.

Length: 14 mm

The compact length of this product contributes to a space-efficient design.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperature environments makes this product suitable for rugged and demanding applications.

Peripheral IC Type: PROGRAMMABLE SoC

The programmable System-on-Chip (SoC) nature of this product allows for customization and flexibility in system design.

ROM Bits Size: 524288 Bits

The large ROM size provides ample storage capacity for program code and data, enabling complex functions to be performed.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this product energy-efficient and reliable.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy soldering and robust connection, ensuring reliability in operation.

Nominal Supply Voltage: 3.3 V

Having a stable nominal supply voltage helps in ensuring consistent and reliable performance of the product.

Terminal Pitch: 0.5 mm

The fine terminal pitch allows for high-density mounting, making this product suitable for compact and miniaturized devices.

Moisture Sensitivity Level (MSL): 3

Having a moderate moisture sensitivity level indicates that this product can withstand moderate exposure to moisture during assembly and operation.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs CY8C3866AXI-039T attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Infineon Technologies

Specs

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Power Supplies (V):

2/5

Qualification:

Not Qualified

ROM Bits Size:

524288 Bits

Maximum Seated Height:

1.6 mm

Sub-Category:

Other uPs/uCs/Peripheral ICs

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

PURE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Ultraviolet Erasable:

N

Width:

14 mm

Peripheral IC Type:

Trade Compliance

CY8C3866AXI-039T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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