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CY8C3866AXI-039

Infineon Technologies

CY8C3866AXI-039 by Infineon Technologies

CY8C3866AXI-039 by Infineon: 100-terminal IC with 3.3V supply, 65536 ROM bits, and CMOS technology. Ideal for industrial applications requiring a programmable SoC in a compact, low-profile package. Operates b/w -40 to 85 °C with peak reflow temp of 260 C.

Median Price

$18.475

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 293 parts In-Stock

1+ parts

$24.590

100+ parts

$17.303

1k+ parts

$16.167

10k+ parts

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293

$24.590

$17.303

$16.167

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Rochester

USA . 50 parts In-Stock

1+ parts

-

100+ parts

$14.780

1k+ parts

$13.230

10k+ parts

$12.450

50

-

$14.780

$13.230

$12.450

Verical

USA . 50 parts In-Stock

1+ parts

-

100+ parts

$18.475

1k+ parts

$16.538

10k+ parts

$15.563

50

-

$18.475

$16.538

$15.563

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 24 parts In-Stock

1+ parts

$15.456

100+ parts

-

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24

$15.456

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Nova Conductors

Japan . 50 parts In-Stock

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$19.830

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50

$19.830

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Chip Stock

USA . 1,025 parts In-Stock

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1,025

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TME

Poland . 350 parts In-Stock

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$23.218

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350

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$23.218

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Vyrian

USA . 246 parts In-Stock

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246

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LWI Electronics Inc

India . 5 parts In-Stock

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Distributors (Availability)

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Continental Prestige Electronics

USA . 4,540 parts In-Stock

1+ parts

$4.980

100+ parts

-

1k+ parts

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10k+ parts

$4.880

4,540

$4.980

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-

$4.880

AZTECH Wire

Italy . 467 parts In-Stock

1+ parts

$11.524

100+ parts

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467

$11.524

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Semicontronic

India . 194 parts In-Stock

1+ parts

$13.890

100+ parts

$13.543

1k+ parts

$13.473

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194

$13.890

$13.543

$13.473

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Corphita

USA . 840 parts In-Stock

1+ parts

$14.643

100+ parts

-

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840

$14.643

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Component Stockers USA

USA . 389 parts In-Stock

1+ parts

$16.690

100+ parts

$17.570

1k+ parts

-

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389

$16.690

$17.570

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Bastille Electronics

Australia . 10 parts In-Stock

1+ parts

$19.830

100+ parts

$18.838

1k+ parts

-

10k+ parts

$17.649

10

$19.830

$18.838

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$17.649

Aztec Data Supply Inc.

USA . 4,840 parts In-Stock

1+ parts

$25.818

100+ parts

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4,840

$25.818

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Ampacity Inc.

Singapore . 118 parts In-Stock

1+ parts

$30.190

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$30.190

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Microchip USA

USA . 2,215 parts In-Stock

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$55.131

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$55.131

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Corohmni

South Africa . 584 parts In-Stock

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$56.324

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584

$56.324

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Modulus Dynamics

Lithuania . 4,309 parts In-Stock

1+ parts

$62.611

100+ parts

$60.107

1k+ parts

$57.602

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4,309

$62.611

$60.107

$57.602

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

1+ parts

$75.150

100+ parts

$71.392

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$71.392

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$75.150

$71.392

$71.392

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QUARKTWIN TECHNOLOGY LTD

USA . 26,506 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,205 parts In-Stock

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Infinite Electronics LLP (Excess)

. 4,519 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,470 parts In-Stock

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Argo Parts USA

USA . 3,084 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Perfect Parts

USA . 596 parts In-Stock

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Kepictronics

USA . 90 parts In-Stock

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Lucentia Tech

USA . 20 parts In-Stock

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$1.837

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$1.837

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$1.837

20

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$1.837

$1.837

$1.837

Overview

Unlock the power of innovation with the CY8C3866AXI-039 by Infineon Technologies. Designed to meet the highest quality standards, this programmable SoC offers endless possibilities for various applications in the industrial sector. With its superior technology and reliable performance, customers can trust in the seamless integration and enhanced functionality that this product provides. Experience the value and benefits of Infineon Technologies' cutting-edge solutions today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the components inside the package.

Surface Mount: YES

Allows for easy and efficient installation onto circuit boards.

Maximum Supply Voltage: 5.5 V

Can handle higher voltage inputs, providing versatility in different applications.

Package Shape: SQUARE

Optimizes space utilization on the circuit board.

Power Supplies (V): 2/5

Supports different power supply options, offering flexibility in power management.

No. of Terminals: 100

Provides robust connectivity for various external components.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Enhances ease of assembly and promotes efficient heat dissipation.

Minimum Supply Voltage: 1.71 V

Supports lower voltage applications, ensuring compatibility across a wide range of devices.

Maximum Operating Temperature: 85 °C

Can operate effectively in high-temperature environments, improving overall reliability.

Minimum Operating Temperature: -40 °C

Maintains functionality in extreme cold conditions, expanding the product's application range.

Terminal Finish: NICKEL PALLADIUM GOLD

Improves conductivity and corrosion resistance for long-lasting performance.

Ultraviolet Erasable: N

Not being ultraviolet erasable indicates the permanent nature of the data stored in this product.

Terminal Position: QUAD

Enables easy connection to multiple external components simultaneously.

Maximum Seated Height: 1.6 mm

Low profile design helps in compact device builds and reduces overall height.

Width: 14 mm

Optimal width measurement for PCB layout and integration.

Maximum Time At Peak Reflow Temperature (s): 40

Ensures reliable soldering during the assembly process.

Peak Reflow Temperature °C: 260

Soldering at high temperatures promotes strong and durable connections.

Length: 14 mm

Proper length dimension for compact circuit board designs.

Temperature Grade: INDUSTRIAL

Suitable for use in industrial environments, meeting specific performance requirements.

Peripheral IC Type: PROGRAMMABLE SoC

Integration of programmable System-on-Chip enhances product versatility and customization options.

ROM Bits Size: 65536 Bits

Large ROM capacity for storing data and program codes for the device.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity for efficient performance.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy soldering and reliable connections.

Nominal Supply Voltage: 3.3 V

Standard supply voltage suitable for various electronic applications.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density mounting on the circuit board.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates the package can withstand moderate exposure to moisture during storage and handling.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs CY8C3866AXI-039 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Infineon Technologies

Specs

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5

Qualification:

Not Qualified

ROM Bits Size:

65536 Bits

Maximum Seated Height:

1.6 mm

Sub-Category:

Other uPs/uCs/Peripheral ICs

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Ultraviolet Erasable:

N

Width:

14 mm

Peripheral IC Type:

Trade Compliance

CY8C3866AXI-039 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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