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TMS320DM365ZCE30

Texas Instruments

TMS320DM365ZCE30 by Texas Instruments

TMS320DM365ZCE30 by Texas Instruments is a 32-bit microprocessor circuit with a max supply voltage of 1.42V. It is used in industrial applications and supports I2C, SPI, UART, and USB bus compatibility.

Median Price

$22.620

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 735 parts In-Stock

1+ parts

$21.752

100+ parts

$19.335

1k+ parts

$14.217

10k+ parts

-

735

$21.752

$19.335

$14.217

-

DigiKey

USA . 189 parts In-Stock

1+ parts

$39.690

100+ parts

$30.525

1k+ parts

$27.335

10k+ parts

-

189

$39.690

$30.525

$27.335

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Rochester

USA . 35 parts In-Stock

1+ parts

-

100+ parts

$22.620

1k+ parts

$20.240

10k+ parts

$19.050

35

-

$22.620

$20.240

$19.050

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Tomark Electronics Ltd

UK . 74 parts In-Stock

1+ parts

$9.440

100+ parts

-

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-

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74

$9.440

-

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Digiode

USA . 4,363 parts In-Stock

1+ parts

$19.361

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-

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4,363

$19.361

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Nova Conductors

Japan . 49 parts In-Stock

1+ parts

$21.118

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-

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49

$21.118

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-

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DF Sales Co.

USA . 57 parts In-Stock

1+ parts

$23.437

100+ parts

-

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-

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57

$23.437

-

-

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DF Sales Co.

USA . 57 parts In-Stock

1+ parts

$23.437

100+ parts

-

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-

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57

$23.437

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-

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Vyrian

USA . 3,833 parts In-Stock

1+ parts

-

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3,833

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-

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Chip Stock

USA . 3,500 parts In-Stock

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3,500

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Cyclops Electronics Ltd

UK . 3,010 parts In-Stock

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3,010

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Elcom Components

USA . 85 parts In-Stock

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85

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DigiKey Marketplace

USA . 35 parts In-Stock

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35

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 452 parts In-Stock

1+ parts

$18.342

100+ parts

-

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452

$18.342

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-

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Ampacity Inc.

Singapore . 295 parts In-Stock

1+ parts

$18.490

100+ parts

-

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295

$18.490

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Continental Prestige Electronics

USA . 1,866 parts In-Stock

1+ parts

$21.118

100+ parts

-

1k+ parts

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10k+ parts

$20.696

1,866

$21.118

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-

$20.696

Netroflash

USA . 100 parts In-Stock

1+ parts

$21.118

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100

$21.118

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Corohmni

South Africa . 519 parts In-Stock

1+ parts

$21.552

100+ parts

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519

$21.552

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Parana Technologies

USA . 1,927 parts In-Stock

1+ parts

$29.818

100+ parts

-

1k+ parts

$63.621

10k+ parts

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1,927

$29.818

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$63.621

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DigiPath Technology Company

USA . 1,763 parts In-Stock

1+ parts

$32.833

100+ parts

-

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1,763

$32.833

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ChromeModa Solutions

Germany . 5,908 parts In-Stock

1+ parts

$33.503

100+ parts

$27.472

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-

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5,908

$33.503

$27.472

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IDEA Electronic Components Group

UK . 520 parts In-Stock

1+ parts

$33.503

100+ parts

$31.828

1k+ parts

$30.153

10k+ parts

-

520

$33.503

$31.828

$30.153

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Microchip USA

USA . 2,520 parts In-Stock

1+ parts

$48.440

100+ parts

$47.600

1k+ parts

$47.170

10k+ parts

$46.750

2,520

$48.440

$47.600

$47.170

$46.750

iodParts Technologies Inc.

India . 50,000 parts In-Stock

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Lixinc

USA . 16,599 parts In-Stock

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16,599

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A-Z Elektronik GmbH

Germany . 6,072 parts In-Stock

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Futuretech Components

Singapore . 3,200 parts In-Stock

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Perfect Parts

USA . 1,776 parts In-Stock

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1,776

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Argo Parts USA

USA . 1,370 parts In-Stock

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1,370

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Kepictronics

USA . 988 parts In-Stock

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988

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Authorized Procurement Solutions

USA . 308 parts In-Stock

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308

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ChipstoGo Electronic ltd

UK . 172 parts In-Stock

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172

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Overview

Discover the TMS320DM365ZCE30 by Texas Instruments, a high-quality and reliable product in the category of Other Function uPs,uCs & Peripheral ICs. Texas Instruments is known for its exceptional manufacturing standards, and this product is no exception. With its advanced technology and innovative features, it brings numerous advantages to customers. From its wide range of applications to its versatile compatibility with I2C, SPI, UART, and USB, this product offers unmatched value and benefits. Experience the power and efficiency that the TMS320DM365ZCE30 provides and take your projects to new heights.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This material provides durability and protection for the product's internal components, making it a reliable choice for various applications.

Surface Mount:

YES - The surface mount feature allows for easy integration and installation onto circuit boards, saving time and effort during production.

Maximum Supply Voltage:

1.42 V - With a high maximum supply voltage, this product can handle a wide range of power inputs, enhancing its versatility in various power supply environments.

Package Shape:

SQUARE - The square package shape provides efficient use of space, enabling compact designs and optimizing board utilization.

Bit Size:

32 - With a 32-bit size, this product can process and handle large amounts of data quickly and efficiently, making it suitable for high-performance applications.

Power Supplies (V):

1.35, 1.8, 3.3 - This product supports multiple power supply voltages, allowing flexibility and compatibility with different power sources, ensuring seamless integration into diverse systems.

No. of Terminals:

338 - Having a high number of terminals enables connectivity with a wide range of external devices and peripherals, expanding the versatility of the product.

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH - The combination of a grid array, low profile, and fine pitch package style offers excellent electrical performance, precise connections, and efficient use of board space.

Minimum Supply Voltage:

1.28 V - The low minimum supply voltage ensures the product operates efficiently even in low power situations, making it suitable for battery-powered applications.

Maximum Operating Temperature:

85 °C - With a high maximum operating temperature, this product can withstand demanding conditions, making it reliable in industrial environments.

Minimum Operating Temperature:

40 °C - The product's ability to operate at extremely low temperatures makes it suitable for use in harsh cold environments, expanding its range of applications.

Terminal Finish:

TIN SILVER COPPER - The terminal finish of tin silver copper enhances conductivity and minimizes corrosion, ensuring reliable signal transmission and long-term performance.

Terminal Position:

BOTTOM - The terminal position at the bottom of the package simplifies PCB layout and facilitates efficient routing of traces, enabling easier integration into system designs.

Maximum Seated Height:

1.3 mm - The low maximum seated height allows for slim and compact designs, enabling space-saving solutions in tight applications.

RAM Words:

8192 - With a large RAM capacity of 8192 words, this product can handle extensive data storage and processing requirements, making it ideal for memory-intensive applications.

Width:

13 mm - The compact width of 13 mm provides flexibility in board layout and enables the product to fit into space-constrained designs, enhancing overall system integration.

External Data Bus Width:

32 - With a wide external data bus width of 32 bits, this product facilitates fast and parallel data transfers between the microprocessor and external devices, resulting in efficient data processing capabilities.

Maximum Time At Peak Reflow Temperature (s):

30 - The product's ability to withstand prolonged exposure to peak reflow temperatures for up to 30 seconds ensures reliable soldering during the manufacturing process, improving product quality and reliability.

Peak Reflow Temperature °C:

260 - The high peak reflow temperature of 260°C ensures effective soldering and strong bonds during the manufacturing process, contributing to the product's overall reliability.

Length:

13 mm - The compact length of 13 mm allows for space-saving designs and offers versatility in various applications, particularly those with limited board space.

Temperature Grade:

INDUSTRIAL - With an industrial temperature grade, this product can operate reliably in demanding and potentially harsh environments, making it suitable for industrial applications.

Peripheral IC Type:

MICROPROCESSOR CIRCUIT - As a microprocessor circuit, this product provides advanced processing capabilities, making it suitable for complex tasks and high-performance applications.

Technology:

CMOS - The use of CMOS technology allows for low power consumption, high-speed performance, and integration of various functions, making this product energy-efficient and versatile.

Terminal Form:

BALL - The ball terminal form provides robust electrical connectivity, ensuring reliable signal transmission and secure connections, contributing to the product's overall performance and durability.

Nominal Supply Voltage:

1.35 V - The nominal supply voltage of 1.35 V allows for reliable and stable operation, making it compatible with various power sources and reducing the risk of voltage fluctuations impacting performance.

Bus Compatibility:

I2C; SPI; UART; USB - The product's compatibility with multiple bus standards such as I2C, SPI, UART, and USB allows for seamless communication between the microprocessor and external devices, enhancing its connectivity and interoperability.

Terminal Pitch:

0.65 mm - With a narrow terminal pitch of 0.65 mm, this product enables precise connections and allows for efficient use of PCB space, facilitating compact and dense circuit board layouts.

Format:

FIXED POINT - The fixed-point format offers precise and efficient numerical representation and calculations, making this product suitable for applications requiring high accuracy and consistency.

Moisture Sensitivity Level (MSL):

3 - The moisture sensitivity level 3 indicates that this product requires normal precautions against moisture during handling and assembly, ensuring its reliability and longevity.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs TMS320DM365ZCE30 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Bit Size:

32

Bus Compatibility:

I2C; SPI; UART; USB

External Data Bus Width:

32

Format:

FIXED POINT

JESD-30 Code:

S-PBGA-B338

JESD-609 Code:

e1

Length:

13 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

338

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA338,19X19,25

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.35,1.8,3.3

Qualification:

Not Qualified

RAM Words:

8192

Maximum Seated Height:

1.3 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.42 V

Minimum Supply Voltage:

1.28 V

Nominal Supply Voltage:

1.35 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

13 mm

Peripheral IC Type:

Trade Compliance

TMS320DM365ZCE30 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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