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FT245BL-T/R

FTDI

FT245BL-T/R by FTDI

FT245BL-T/R by FTDI is a 32-terminal peripheral IC with a supply voltage range of 4.35V to 5.25V. It operates in temperatures from 0°C to 70°C, making it suitable for commercial applications requiring a microprocessor circuit with CMOS technology. The package style is flatpack, low profile, and it features gull wing terminal form for easy surface mounting at a compact size of 7mm x 7mm.

Median Price

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Nova Conductors

Japan . 300 parts In-Stock

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Vyrian

USA . 206 parts In-Stock

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AZTECH Wire

Italy . 888 parts In-Stock

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$7.465

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Corohmni

South Africa . 1,182 parts In-Stock

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$29.709

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Aztec Data Supply Inc.

USA . 109 parts In-Stock

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$30.280

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Continental Prestige Electronics

USA . 6,368 parts In-Stock

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Argo Parts USA

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Perfect Parts

USA . 112 parts In-Stock

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Bastille Electronics

Australia . 100 parts In-Stock

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GreenTree Electronics

Israel . 100 parts In-Stock

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Overview

Unleash the power of seamless connectivity with the FT245BL-T/R by FTDI. Crafted by industry-leading manufacturer FTDI, this versatile peripheral IC is designed to elevate your projects to new heights. With a focus on quality and reliability, this product offers unparalleled value and benefits for a wide range of applications. Say goodbye to connectivity issues and hello to seamless performance with the FT245BL-T/R. Elevate your projects with ease and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes it lightweight and durable, ensuring long-term reliability.

Surface Mount: YES

Being surface mountable makes it easier to integrate into PCB designs, saving space and simplifying assembly processes.

Maximum Supply Voltage: 5.25 V

The high maximum supply voltage allows for flexibility in power source selection, accommodating various system requirements.

Package Shape: SQUARE

The square shape of the package provides a uniform footprint for consistent and easy placement on the PCB.

No. of Terminals: 32

With a good number of terminals, this product offers a wide range of connectivity options for interfacing with other components.

Minimum Supply Voltage: 4.35 V

The low minimum supply voltage ensures compatibility with a range of power sources, improving versatility in design.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature allows for reliable performance in demanding environments with elevated temperatures.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures that the product can function effectively even in cold conditions.

Terminal Finish: MATTE TIN

The matte tin finish on the terminals provides good solderability, enhancing the ease of assembly and ensuring a strong electrical connection.

Terminal Position: QUAD

The quad-terminal position offers a stable and secure connection, reducing the risk of signal loss or interference.

Width: 7 mm

The compact width of 7 mm allows for efficient space utilization on the PCB, enabling a more streamlined and compact design.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature of 30 seconds helps prevent overheating during assembly, ensuring the integrity of the component.

Temperature Grade: COMMERCIAL

Being rated for commercial temperature ranges means this product is suitable for standard operating conditions commonly found in commercial applications.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Having a microprocessor circuit as a peripheral IC type indicates high processing capabilities, ideal for advanced applications that require complex computations.

Technology: CMOS

The CMOS technology used in this product offers low power consumption and high noise immunity, contributing to energy efficiency and reliable operation.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical strength and makes soldering easier, enhancing the overall durability and manufacturability of the product.

Nominal Supply Voltage: 5 V

The 5V nominal supply voltage ensures compatibility with standard power sources, simplifying system integration and reducing the need for additional voltage regulation.

Terminal Pitch: 0.8 mm

The fine terminal pitch of 0.8 mm allows for densely packed terminals, increasing connectivity options and enabling high-density PCB designs.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, this product is less prone to moisture-related damage during assembly and storage, ensuring long-term reliability.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs FT245BL-T/R attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from FTDI

Specs

JESD-30 Code:

S-PQFP-G32

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

32

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.35 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Trade Compliance

FT245BL-T/R Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

FTDI

FTDI Chip is a fab-less semiconductor company established in 1992, partnered with the world’s leading foundries. The headquarter is located in Glasgow, UK and is supported with research and development facilities in Glasgow, Singapore and Taipei (Taiwan) plus regional sales and technical support sites in Glasgow, Taipei, Tigard (Oregon, USA) and Shanghai (China). FTDI Chip develops innovative silicon solutions that enhance interaction with the latest in global technology. The major objective from the company is to ‘bridge technologies’ in order to support engineers with highly sophisticated, feature-rich, robust and simple-to-use product platforms. FTDI Chip continues its philosophy of Design Made Easy, where it strives to incorporate device and system features in its chips that enable the designer to quickly and easily create and implement designs. We supplement this strategy, with WW regional support and a “total” solutions mindset to provide reduced development and debug costs and a fast time to market.

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