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XC7Z045-1FBG676I

Xilinx

XC7Z045-1FBG676I by Xilinx

The Xilinx XC7Z045-1FBG676I is a System on Chip with CMOS technology. It operates b/w -40 to 100°C, with supply voltage ranging from 0.95V to 1.05V. With 676 terminals in a grid array package, it's ideal for applications requiring high-performance processing in compact spaces.

Median Price

$1,812.850

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

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Mouser Electronics

USA . 1 parts In-Stock

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$1,812.850

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Digiode

USA . 330 parts In-Stock

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$1,641.125

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$1,641.125

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Nova Conductors

Japan . 10 parts In-Stock

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$1,699.860

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$1,699.860

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VNN

France . 113 parts In-Stock

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$1,727.500

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Vyrian

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MARBEL Systems

Belgium . 300 parts In-Stock

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$18.782

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AZTECH Wire

Italy . 735 parts In-Stock

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$19.809

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Corohmni

South Africa . 14 parts In-Stock

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$20.409

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Texas Native Microelectronics

USA . 512 parts In-Stock

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$21.588

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$20.077

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$18.997

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$18.997

Kenton Components

USA . 4,088 parts In-Stock

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$25.906

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$22.797

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Aztec Data Supply Inc.

USA . 287 parts In-Stock

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$50.680

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Qasali Group International

UK . 2,350 parts In-Stock

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$58.288

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Modulus Dynamics

Lithuania . 1,534 parts In-Stock

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$117.809

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$117.809

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Advanced Electronics

New Zealand . 655 parts In-Stock

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$184.569

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$175.340

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$175.340

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Microchip USA

USA . 1,143 parts In-Stock

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$1,359.888

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One Stop Electronics

USA . 16 parts In-Stock

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$1,526.970

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Ampacity Inc.

Singapore . 16 parts In-Stock

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Semicontronic

India . 16 parts In-Stock

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$1,526.970

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$1,488.796

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$1,481.161

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Corphita

USA . 465 parts In-Stock

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$1,554.750

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Continental Prestige Electronics

USA . 4,376 parts In-Stock

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$1,699.860

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$1,665.863

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Argo Parts USA

USA . 1,695 parts In-Stock

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$1,699.860

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$1,682.861

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$1,665.863

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$1,648.864

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$1,699.860

$1,682.861

$1,665.863

$1,648.864

Netroflash

USA . 50 parts In-Stock

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$1,699.860

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$1,614.867

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$1,580.870

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$1,580.870

Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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Supply Digital

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Vigor

Singapore . 351 parts In-Stock

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Lucentia Tech

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Overview

Unlock the power of innovation with the XC7Z045-1FBG676I by Xilinx, a cutting-edge System on Chip designed to revolutionize the world of Other Function uPs, uCs & Peripheral ICs. With Xilinx's reputation for superior quality and reliability, this product offers unmatched value and benefits to customers looking to elevate their projects to new heights. Whether you're seeking to enhance performance, increase efficiency, or streamline operations, the XC7Z045-1FBG676I is the ultimate solution for all your needs. Experience the future of technology today with Xilinx.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material, suitable for various applications.

Surface Mount: YES

Easy to integrate into circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage: 1.05 V

Provides sufficient power for efficient operation.

Package Shape: SQUARE

Uniform shape for easy placement and soldering on boards.

No. of Terminals: 676

Plenty of connection options for interfacing with other components.

Package Style (Meter): GRID ARRAY

Grid array design for stable and secure mounting on PCBs.

Minimum Supply Voltage: 0.95 V

Allows for flexibility in power input, suitable for different voltage levels.

Maximum Operating Temperature: 100 °C

Can withstand high temperatures, ideal for demanding environments.

Minimum Operating Temperature: -40 °C

Operational in extremely cold conditions.

Terminal Position: BOTTOM

Bottom terminal positioning for organized and convenient connections.

Maximum Seated Height: 2.54 mm

Low profile design for compact applications.

Width: 27 mm

Optimal width for fitting into standard size circuit layouts.

Length: 27 mm

Ideal length for maintaining overall product dimensions.

Peripheral IC Type: SYSTEM ON CHIP

All-in-one solution for various functions, streamlining system design.

Technology: CMOS

Low power consumption and high noise immunity for efficient operation.

Terminal Form: BALL

Ball terminal form for reliable connections and easy soldering.

Nominal Supply Voltage: 1 V

Stable supply voltage for consistent performance.

Terminal Pitch: 1 mm

Close terminal pitch for space-efficient layout on PCB.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XC7Z045-1FBG676I attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

S-PBGA-B676

Length:

27 mm

No. of Terminals:

676

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA676,26X26,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Maximum Seated Height:

2.54 mm

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

27 mm

Peripheral IC Type:

Trade Compliance

XC7Z045-1FBG676I Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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