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SLB9670VQ12FW643XUMA2

Infineon Technologies

SLB9670VQ12FW643XUMA2 by Infineon Technologies

SLB9670VQ12FW643XUMA2 by Infineon: 32-terminal chip carrier with CMOS tech, operates at -20 to 85 °C. Ideal for cryptographic authentication apps due to low supply voltage range of 1.65-1.95 V and compact square package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Sensible Micro Corp

USA . 34,972 parts In-Stock

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Vyrian

USA . 606 parts In-Stock

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Nova Conductors

Japan . 100 parts In-Stock

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100

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Digiode

USA . 47 parts In-Stock

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47

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Ampacity Inc.

Singapore . 687 parts In-Stock

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$12.000

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687

$12.000

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AZTECH Wire

Italy . 723 parts In-Stock

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$13.314

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Semicontronic

India . 916 parts In-Stock

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$20.000

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$19.500

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$19.400

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916

$20.000

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$19.400

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Corohmni

South Africa . 2 parts In-Stock

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$29.021

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$29.021

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Modulus Dynamics

Lithuania . 2,016 parts In-Stock

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$32.444

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$31.146

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$29.848

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Aztec Data Supply Inc.

USA . 922 parts In-Stock

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$68.640

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Component Stockers USA

USA . 43,374 parts In-Stock

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$1.930

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$1.790

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$1.790

43,374

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$1.790

Continental Prestige Electronics

USA . 5,486 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Argo Parts USA

USA . 3,035 parts In-Stock

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Microchip USA

USA . 1,457 parts In-Stock

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Corphita

USA . 983 parts In-Stock

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Bastille Electronics

Australia . 500 parts In-Stock

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Overview

Discover the innovative SLB9670VQ12FW643XUMA2 by Infineon Technologies, a cutting-edge Peripheral IC that revolutionizes security and authentication processes. With Infineon's renowned reputation for excellence in manufacturing, this product guarantees reliability and performance. Ideal for a wide range of applications, this cryptographic authenticator offers unparalleled value and benefits to customers seeking top-notch security solutions. Upgrade your systems with the SLB9670VQ12FW643XUMA2 and experience the advantages of advanced technology at its finest.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the IC, ensuring reliable performance and longevity.

Surface Mount: YES

Allows for easy and convenient placement on a circuit board, saving space and making the assembly process more efficient.

Maximum Supply Voltage: 1.95 V

Supports a higher voltage input, making it compatible with a wider range of power sources.

Package Shape: SQUARE

Square shape provides a compact footprint, ideal for applications where space is limited.

No. of Terminals: 32

Offers a sufficient number of connection points for interfacing with other components and peripherals.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This combination of package styles ensures efficient heat dissipation and a low profile, suitable for small form factor designs.

Minimum Supply Voltage: 1.65 V

Supports a lower voltage input, allowing for energy efficiency and compatibility with various power sources.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, making it suitable for use in environments with elevated heat levels.

Minimum Operating Temperature: -20 °C

Capable of functioning in cold temperatures, providing versatility for different operating conditions.

Terminal Finish: NICKEL GOLD PALLADIUM SILVER

Durable and corrosion-resistant finish for the terminals, ensuring reliable connections and long-term performance.

Terminal Position: QUAD

Quad terminal position allows for more stable and secure connections, reducing the risk of signal loss or interference.

Maximum Seated Height: 0.9 mm

Low profile design minimizes the overall height of the IC, making it suitable for compact electronic devices.

Width: 5 mm

Compact width dimension for easy integration into circuit board layouts with limited space.

Length: 5 mm

Compact length dimension for efficient placement on the circuit board and overall space-saving design.

Peripheral IC Type: CRYPTOGRAPHIC AUTHENTICATOR

Enhanced security features for data authentication and encryption, making it suitable for secure communication applications.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high-speed performance, ideal for energy-efficient devices.

Terminal Form: NO LEAD

Lead-free terminal form for environmentally-friendly and RoHS compliant manufacturing processes.

Nominal Supply Voltage: 1.8 V

Standard voltage level for compatibility with a wide range of electronic devices and power sources.

Terminal Pitch: 0.5 mm

Fine pitch terminals for precise and secure connections, suitable for high-density circuit board designs.

Moisture Sensitivity Level (MSL): 3

Moisture-resistant design with MSL level 3, ensuring reliability in humid or harsh environmental conditions.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs SLB9670VQ12FW643XUMA2 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Infineon Technologies

Specs

Additional Features:

ALSO OPERATES WITH 3.3V NOM SUPPLY

JESD-30 Code:

S-PQCC-N32

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

.9 mm

Maximum Supply Voltage:

1.95 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

NICKEL GOLD PALLADIUM SILVER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

5 mm

Peripheral IC Type:

Trade Compliance

SLB9670VQ12FW643XUMA2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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