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SLB9670XQ2.0

Infineon Technologies

SLB9670XQ2.0 by Infineon Technologies

SLB9670XQ2.0 by Infineon Technologies is a cryptographic authenticator IC with CMOS technology. It operates b/w -40 to 85 °C and has a supply voltage range of 1.65V to 1.95V, making it suitable for secure authentication applications in various electronic devices. This chip carrier package with 32 terminals is surface mountable and has a compact size of 5mm x 5mm x 0.9mm, ideal for space-constrained designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Chip Stock

USA . 4,525 parts In-Stock

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Vyrian

USA . 1,345 parts In-Stock

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Nova Conductors

Japan . 450 parts In-Stock

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450

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Digiode

USA . 279 parts In-Stock

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279

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AZTECH Wire

Italy . 563 parts In-Stock

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$8.418

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563

$8.418

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Modulus Dynamics

Lithuania . 2,283 parts In-Stock

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$22.352

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$21.458

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$20.564

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Ampacity Inc.

Singapore . 130 parts In-Stock

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$26.000

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130

$26.000

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Semicontronic

India . 872 parts In-Stock

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$32.000

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$31.200

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$31.040

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872

$32.000

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$31.040

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Aztec Data Supply Inc.

USA . 4,961 parts In-Stock

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$39.000

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Corohmni

South Africa . 875 parts In-Stock

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$61.601

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875

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Continental Prestige Electronics

USA . 3,216 parts In-Stock

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Argo Parts USA

USA . 1,411 parts In-Stock

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Corphita

USA . 365 parts In-Stock

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Bastille Electronics

Australia . 100 parts In-Stock

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Overview

The SLB9670XQ2.0 by Infineon Technologies is a cutting-edge cryptographic authenticator that offers unparalleled security and reliability. With a compact square chip carrier package and surface mount capabilities, this product is perfect for a wide range of applications. Infineon Technologies, known for their top-quality manufacturing, ensures that this peripheral IC meets the highest standards. Customers can trust in the value and benefits that the SLB9670XQ2.0 provides, from its low operating temperature to its maximum supply voltage of 1.95V. Discover the advantages of this innovative solution today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material helps in reducing cost of production and makes the product lightweight.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards.

Maximum Supply Voltage: 1.95 V

Higher maximum supply voltage allows for greater flexibility in power input.

Package Shape: SQUARE

Square shape makes the package easy to handle and install in compact spaces.

No. of Terminals: 32

Having 32 terminals provides ample connectivity options for interfacing with other components.

Package Style (Meter): CHIP CARRIER

Chip carrier style allows for efficient heat dissipation and protection of the integrated circuit.

Minimum Supply Voltage: 1.65 V

Lower minimum supply voltage ensures compatibility with a wide range of power sources.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliability in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for reliable performance in extreme cold environments.

Terminal Position: QUAD

Quad terminal position provides improved stability and connectivity compared to dual or single terminal positions.

Maximum Seated Height: 0.9 mm

Low maximum seated height allows for a compact and slim design.

Width: 5 mm

Compact width enables easy integration into tight spaces on circuit boards.

Length: 5 mm

Compact length ensures the product can fit into small form factor devices.

Peripheral IC Type: CRYPTOGRAPHIC AUTHENTICATOR

Being a cryptographic authenticator ensures data security and integrity in communication systems.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for efficient operation.

Terminal Form: NO LEAD

No lead terminal form reduces the risk of soldering issues and ensures reliable connections.

Nominal Supply Voltage: 1.8 V

Having a nominal supply voltage of 1.8V ensures compatibility with standard power sources.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm allows for high-density packing and optimal use of PCB space.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs SLB9670XQ2.0 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Infineon Technologies

Specs

JESD-30 Code:

S-PQCC-N32

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Maximum Seated Height:

.9 mm

Maximum Supply Voltage:

1.95 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

5 mm

Peripheral IC Type:

Trade Compliance

SLB9670XQ2.0 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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