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MIMX8MM6DVTLZAAR

NXP Semiconductors

MIMX8MM6DVTLZAAR by NXP Semiconductors

The NXP Semiconductors MIMX8MM6DVTLZAAR is a low-profile, fine-pitch SoC with 486 terminals. Operating b/w 0-95°C, it has a supply voltage range of 0.95-1.05V and uses CMOS technology. Ideal for applications requiring high processing power in compact spaces.

Median Price

$22.140

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 133 parts In-Stock

1+ parts

$36.110

100+ parts

$25.650

1k+ parts

$21.450

10k+ parts

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133

$36.110

$25.650

$21.450

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DigiKey

USA . 578 parts In-Stock

1+ parts

$38.310

100+ parts

$28.393

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578

$38.310

$28.393

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Verical

USA . 30,000 parts In-Stock

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$24.137

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$24.137

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Newark

USA . 1,000 parts In-Stock

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$21.030

10k+ parts

$19.250

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$21.030

$19.250

Arrow

USA . 1,000 parts In-Stock

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$22.140

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$22.140

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Chip1Stop

Japan . 1,000 parts In-Stock

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$22.140

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$22.140

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Farnell

UK . 1,000 parts In-Stock

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$16.230

10k+ parts

$15.910

1,000

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$16.230

$15.910

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$30.980

100+ parts

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300

$30.980

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Digiode

USA . 4,063 parts In-Stock

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$35.330

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4,063

$35.330

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Chip Stock

USA . 12,000 parts In-Stock

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Vyrian

USA . 5,741 parts In-Stock

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Anansix

USA . 2,451 parts In-Stock

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Distributors (Availability)

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Semicontronic

India . 5,732 parts In-Stock

1+ parts

$18.820

100+ parts

$18.350

1k+ parts

$18.255

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5,732

$18.820

$18.350

$18.255

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Ampacity Inc.

Singapore . 5,603 parts In-Stock

1+ parts

$18.820

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5,603

$18.820

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Aranea Global

USA . 1,000 parts In-Stock

1+ parts

$30.360

100+ parts

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$29.146

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1,000

$30.360

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$29.146

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Continental Prestige Electronics

USA . 1,713 parts In-Stock

1+ parts

$30.980

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$30.360

1,713

$30.980

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$30.360

Corphita

USA . 1,488 parts In-Stock

1+ parts

$33.471

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1,488

$33.471

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$43.960

100+ parts

$41.762

1k+ parts

$41.762

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1,000

$43.960

$41.762

$41.762

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Aztec Data Supply Inc.

USA . 451 parts In-Stock

1+ parts

$55.650

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451

$55.650

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Corohmni

South Africa . 739 parts In-Stock

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$61.798

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739

$61.798

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Microchip USA

USA . 2,098 parts In-Stock

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$67.001

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2,098

$67.001

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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XScomponents

USA . 6,000 parts In-Stock

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$15.680

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UNI Independent Distributors

Spain . 4,893 parts In-Stock

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Lixinc

USA . 2,906 parts In-Stock

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Argo Parts USA

USA . 2,110 parts In-Stock

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Robosynatics

Brazil . 2,000 parts In-Stock

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Lucentia Tech

USA . 2,000 parts In-Stock

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$137.780

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$137.780

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$137.780

2,000

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$137.780

$137.780

$137.780

Overview

Discover the cutting-edge MIMX8MM6DVTLZAAR by NXP Semiconductors, a revolutionary piece in the world of Other Function uPs, uCs & Peripheral ICs. With a commitment to quality and innovation, NXP Semiconductors has crafted a product that offers unparalleled value and benefits to customers. This versatile device boasts a wide range of applications, making it an essential component for any tech enthusiast or professional looking to elevate their projects to the next level. Choose the MIMX8MM6DVTLZAAR and experience the superior performance and reliability that only NXP Semiconductors can deliver.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Surface Mount: YES

Allows for easy and efficient mounting on circuit boards, saving time during assembly.

Maximum Supply Voltage: 1.05 V

Offers a high maximum supply voltage, allowing for flexibility in power requirements.

Package Shape: SQUARE

Square shape provides a compact design, saving space on circuit boards.

No. of Terminals: 486

High number of terminals provide connectivity for various components, enhancing functionality.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Grid array style with low profile and fine pitch offers high density and improves signal integrity.

Minimum Supply Voltage: 0.95 V

Low minimum supply voltage allows for efficient power consumption and operation.

Maximum Operating Temperature: 95 °C

High maximum operating temperature ensures stable performance even in challenging environments.

Minimum Operating Temperature: 0 °C

Wide range of minimum operating temperature allows for use in various conditions.

Terminal Finish: TIN SILVER

Provides excellent conductivity and corrosion resistance for reliable connections.

Terminal Position: BOTTOM

Bottom terminal position enables easy and secure connection to other components.

Maximum Seated Height: 1.25 mm

Low seated height allows for a slim design and reduces the overall profile of the product.

Width: 14 mm

Compact width enables efficient use of space on circuit boards.

Maximum Time At Peak Reflow Temperature (s): 40

40 seconds at peak reflow temperature ensures proper soldering and component attachment.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures secure solder joints for reliable performance.

Length: 14 mm

Compact length contributes to a space-saving design.

Peripheral IC Type: SoC

System-on-Chip integration provides a compact solution with multiple functions in a single package.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for efficient operation.

Terminal Form: BALL

Ball terminal form ensures reliable connections and simplifies the assembly process.

Nominal Supply Voltage: 1 V

Stable nominal supply voltage ensures consistent performance and reliability.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density mounting, saving space on circuit boards.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level 3 indicates that the product is moderately sensitive to moisture, requiring proper handling and storage.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MIMX8MM6DVTLZAAR attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PBGA-B486

JESD-609 Code:

e2

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

486

Maximum Operating Temperature:

95 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA486,27X27,20

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.25 mm

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

14 mm

Peripheral IC Type:

SoC

Trade Compliance

MIMX8MM6DVTLZAAR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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