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AX8052F131-2-TB05

Onsemi

AX8052F131-2-TB05 by Onsemi

AX8052F131-2-TB05 by Onsemi is a System on Chip (SoC) with a max supply voltage of 3.6V and a min supply voltage of 2.2V. It is used in industrial applications and has a package style of CHIP CARRIER, VERY THIN PROFILE, HEAT SINK/SLUG.

Median Price

$1.240

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 494 parts In-Stock

1+ parts

$0.691

100+ parts

$0.647

1k+ parts

$0.637

10k+ parts

-

494

$0.691

$0.647

$0.637

-

Chip1Stop

Japan . 494 parts In-Stock

1+ parts

$1.050

100+ parts

$0.664

1k+ parts

-

10k+ parts

-

494

$1.050

$0.664

-

-

Rochester

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

$1.240

1k+ parts

$1.110

10k+ parts

$1.040

1,000

-

$1.240

$1.110

$1.040

DigiKey

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.440

10k+ parts

-

1,000

-

-

$1.440

-

Verical

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.387

10k+ parts

$1.300

1,000

-

-

$1.387

$1.300

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 655 parts In-Stock

1+ parts

$0.656

100+ parts

-

1k+ parts

-

10k+ parts

-

655

$0.656

-

-

-

Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$1.320

100+ parts

-

1k+ parts

-

10k+ parts

-

300

$1.320

-

-

-

VNN

France . 2,722 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,722

-

-

-

-

Vyrian

USA . 2,377 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,377

-

-

-

-

Bristol Electronics

USA . 497 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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497

-

-

-

-

Dan-Mar Components

USA . 497 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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497

-

-

-

-

Ashlea Components Ltd

UK . 265 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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265

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 626 parts In-Stock

1+ parts

$0.550

100+ parts

$0.536

1k+ parts

$0.534

10k+ parts

-

626

$0.550

$0.536

$0.534

-

Ampacity Inc.

Singapore . 323 parts In-Stock

1+ parts

$0.550

100+ parts

-

1k+ parts

-

10k+ parts

-

323

$0.550

-

-

-

Corphita

USA . 2,209 parts In-Stock

1+ parts

$0.622

100+ parts

-

1k+ parts

-

10k+ parts

-

2,209

$0.622

-

-

-

Corohmni

South Africa . 394 parts In-Stock

1+ parts

$0.647

100+ parts

-

1k+ parts

-

10k+ parts

-

394

$0.647

-

-

-

Bastille Electronics

Australia . 256 parts In-Stock

1+ parts

$1.320

100+ parts

$1.254

1k+ parts

$1.191

10k+ parts

$1.175

256

$1.320

$1.254

$1.191

$1.175

Argo Parts USA

USA . 1,731 parts In-Stock

1+ parts

$1.320

100+ parts

-

1k+ parts

-

10k+ parts

-

1,731

$1.320

-

-

-

Advanced Electronics

New Zealand . 10 parts In-Stock

1+ parts

$10.554

100+ parts

$9.604

1k+ parts

$8.654

10k+ parts

-

10

$10.554

$9.604

$8.654

-

Aztec Data Supply Inc.

USA . 2,024 parts In-Stock

1+ parts

$17.580

100+ parts

-

1k+ parts

-

10k+ parts

-

2,024

$17.580

-

-

-

SupplyDigital Components

Austria . 5,885 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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5,885

-

-

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Kulean Microsystems

USA . 4,302 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,302

-

-

-

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Continental Prestige Electronics

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

$1.050

1k+ parts

-

10k+ parts

-

1,000

-

$1.050

-

-

TANS Electronics

Latvia . 908 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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908

-

-

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Problanco Electronics

Mexico . 655 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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655

-

-

-

-

UHIMA Technologies

Türkiye . 24 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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24

-

-

-

-

Overview

Upgrade your electronic devices with the AX8052F131-2-TB05 by Onsemi, a high-quality and versatile System on Chip. Onsemi, a trusted manufacturer, brings you cutting-edge technology that delivers exceptional performance. With its compact design and wide temperature range, this chip is perfect for various applications. Enjoy the benefits of seamless integration, superior reliability, and efficient power management. Whether you're working on IoT devices or industrial automation, the AX8052F131-2-TB05 offers unmatched value, allowing you to stay ahead in today's competitive market. Experience innovation like never before with Onsemi's AX8052F131-2-TB05.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides durability and protection to the product, making it a suitable choice for various applications.

Surface Mount: YES

With the surface mount feature, this product offers ease of installation, making it convenient for circuit board assembly and minimizing the overall size of the system.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage capability of this product allows it to handle a wide range of power requirements, ensuring compatibility with different systems and providing flexibility in design.

Package Shape: SQUARE

The square package shape of this product offers efficient use of space, enabling compact designs and allowing for higher integration in electronic systems.

No. of Terminals: 28

With 28 terminals available, this product provides ample connectivity options, enabling connectivity to various external devices and supporting versatile system configurations.

Package Style (Meter): CHIP CARRIER, VERY THIN PROFILE, HEAT SINK/SLUG

The chip carrier package style with a very thin profile and heat sink/slug capability enhances thermal management, ensuring proper heat dissipation and maintaining optimal performance even in demanding conditions.

Minimum Supply Voltage: 2.2 V

The low minimum supply voltage required by this product allows for efficient power usage and extends battery life in portable devices, making it an energy-efficient solution.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand elevated temperatures, offering reliability and suitability for industrial applications that involve challenging environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature tolerance enables this product to function in extreme cold environments, making it appropriate for various outdoor and industrial applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The use of high-quality terminal finish materials such as nickel/palladium/gold ensures excellent electrical conductivity, corrosion resistance, and longevity, resulting in a reliable and long-lasting product.

Terminal Position: QUAD

The quad terminal position allows for easy and secure connections, enhancing the overall stability and durability of the product in various system setups.

Maximum Seated Height: 1 mm

The low maximum seated height facilitates space-saving designs, enabling the product to be integrated into compact electronic systems with minimal impact on overall dimensions.

Width: 5 mm

The narrow width of this product contributes to its compact form factor, making it suitable for space-constrained applications and enabling efficient use of board space.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance of this product ensures reliable solder joints during assembly processes, ensuring proper connection and robustness of the product.

Length: 7 mm

With a moderate length, this product offers a balanced size that fits well into various system designs, allowing for integration in a wide range of applications.

Temperature Grade: INDUSTRIAL

The industrial temperature grade rating certifies the product's ability to operate consistently and reliably in harsh industrial environments, making it suitable for demanding applications.

Peripheral IC Type: SYSTEM ON CHIP

The system-on-chip peripheral IC type integrates multiple functions into a single chip, providing enhanced functionality, reducing system complexity, and enabling efficient use of resources.

Technology: CMOS

The use of CMOS technology in this product ensures low power consumption, high noise immunity, and compatibility with a wide range of digital systems, making it an energy-efficient and versatile choice.

Terminal Form: NO LEAD

The no-lead terminal form eliminates the use of lead, making the product environmentally friendly, conforming to RoHS regulations, and reducing potential health hazards associated with leaded components.

Nominal Supply Voltage: 3 V

With a fixed nominal supply voltage of 3 V, this product offers compatibility and easy integration into systems designed specifically for this voltage, simplifying power management and reducing system complexity.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5 mm allows for higher density connections on circuit boards, facilitating miniaturization and enabling the creation of compact electronic devices.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs AX8052F131-2-TB05 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Onsemi

Specs

JESD-30 Code:

S-PQCC-N28

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC28,.35X.55

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE, HEAT SINK/SLUG

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.2 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

5 mm

Peripheral IC Type:

Trade Compliance

AX8052F131-2-TB05 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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