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AX8052F131-2-TX30

Onsemi

AX8052F131-2-TX30 by Onsemi

AX8052F131-2-TX30 by Onsemi is a System on Chip with 40 terminals, operating at -40 to 85 °C. It features a supply voltage range of 2.2V to 3.6V and uses CMOS technology. Ideal for industrial applications requiring a compact chip carrier package with very thin profile and heat sink/slug design.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 6,590 parts In-Stock

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Digiode

USA . 635 parts In-Stock

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AZTECH Wire

Italy . 178 parts In-Stock

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$17.490

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Component Stockers USA

USA . 280 parts In-Stock

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$99.990

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TANS Electronics

Latvia . 7,633 parts In-Stock

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SupplyDigital Components

Austria . 5,401 parts In-Stock

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Problanco Electronics

Mexico . 1,913 parts In-Stock

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Kulean Microsystems

USA . 787 parts In-Stock

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Native Components

USA . 630 parts In-Stock

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Northwest PG Solutions

USA . 538 parts In-Stock

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Corohmni

South Africa . 365 parts In-Stock

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UHIMA Technologies

Türkiye . 319 parts In-Stock

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Corphita

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Overview

Discover the cutting-edge AX8052F131-2-TX30 by Onsemi, a top-tier manufacturer known for their superior quality and innovative technology. This versatile chip carrier, very thin profile, heat sink/slug package offers unparalleled performance in various industrial applications. With a wide supply voltage range and high operating temperature, this system-on-chip peripheral IC is a game-changer for your projects. Experience seamless integration and reliable functionality with the AX8052F131-2-TX30, delivering exceptional value and unmatched benefits to customers looking for top-notch solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and protection for the components inside, ensuring a longer lifespan for the product.

Surface Mount: YES

Being surface mountable makes it easier to integrate this product into electronic assemblies, saving space and simplifying the manufacturing process.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, this product can handle a wide range of power inputs, making it versatile for different applications.

Package Shape: RECTANGULAR

The rectangular shape allows for easy placement and routing on circuit boards, optimizing space and design efficiency.

No. of Terminals: 40

Having a high number of terminals provides more connectivity options and functionalities, offering flexibility in designing and implementing circuits.

Minimum Operating Temperature: -40 °C

The ability to operate at extremely low temperatures makes this product suitable for use in diverse environmental conditions, enhancing its reliability.

Technology: CMOS

CMOS technology enables low power consumption and high speed performance, making this product efficient and responsive in operation.

Terminal Form: NO LEAD

The absence of lead in the terminal form improves environmental sustainability and complies with regulations on hazardous substances, promoting eco-friendly practices.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs AX8052F131-2-TX30 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Onsemi

Specs

JESD-30 Code:

R-PQCC-N40

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

40

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC40,.2X.28,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE, HEAT SINK/SLUG

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.2 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

5 mm

Peripheral IC Type:

Trade Compliance

AX8052F131-2-TX30 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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