Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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AX8052F131-2-TX30 by Onsemi is a System on Chip with 40 terminals, operating at -40 to 85 °C. It features a supply voltage range of 2.2V to 3.6V and uses CMOS technology. Ideal for industrial applications requiring a compact chip carrier package with very thin profile and heat sink/slug design.
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AZTECH Wire
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$99.990
TANS Electronics
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Native Components
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Corohmni
UHIMA Technologies
Corphita
This material provides good durability and protection for the components inside, ensuring a longer lifespan for the product.
Being surface mountable makes it easier to integrate this product into electronic assemblies, saving space and simplifying the manufacturing process.
With a high maximum supply voltage, this product can handle a wide range of power inputs, making it versatile for different applications.
The rectangular shape allows for easy placement and routing on circuit boards, optimizing space and design efficiency.
Having a high number of terminals provides more connectivity options and functionalities, offering flexibility in designing and implementing circuits.
The ability to operate at extremely low temperatures makes this product suitable for use in diverse environmental conditions, enhancing its reliability.
CMOS technology enables low power consumption and high speed performance, making this product efficient and responsive in operation.
The absence of lead in the terminal form improves environmental sustainability and complies with regulations on hazardous substances, promoting eco-friendly practices.
Other Function uPs,uCs & Peripheral ICs AX8052F131-2-TX30 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Onsemi
JESD-30 Code:
JESD-609 Code:
Length:
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Maximum Operating Temperature:
Minimum Operating Temperature:
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Technology:
Temperature Grade:
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AX8052F131-2-TX30 Peripheral ICs trade compliance attributes, and parameters.
HTS
8542.31.00.01
SB
8542.31.00.00
PCN Obsolescence/ EOL - Mult Dev EOL 22/Dec/2017
PCN Assembly/Origin - Site Chg 22/Jan/2016
Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).
President, CEO
Hassane El-Khoury
Executive VP, CFO, Treasurer
Thad Trent
Senior VP
Ross F. Jatou
Aizu Fab
Fabrication
Fab Initiation
1995
Japan
Aizu Wakamatsu
Wafer Capacity
52,000
Si/EPI Fab
2018
Czech Republic
Rožnov pod Radhoštěm
10,000
Expansion Phase 1 for SiC / EPI
2019
14,500
Expansion Phase 2 for SiC / EPI
2024
SiC Fab
2022
USA
Hudson
Bucheon
2013
South Korea
61,000
ISMF - Malaysia
1990
Malaysia
Seremban
95,000
Roznov Device Fab
1987
80,000
Fab 10
2002
East Fishkill
15,000
Burlington
1986
Canada
Gresham
1998
45,000
Bucheon 150mm
2000
50,000
Rochester
1983
Nampa
Pennsylvania
1997
Mountain Top
36,000
2N2222A
Tt Electronics Plc
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Collector Current (IC): .8 A; JESD-30 Code: O-MBCY-W3;
SS14
Promax-johnton
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
Good-ark Electronics
RECTIFIER DIODE; Surface Mount: NO; No. of Elements: 1; Maximum Non Repetitive Peak Forward Current: .5 A; Maximum Forward Voltage (VF): 1 V; No. of Phases: 1;
BSS138
Sipex
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Moisture Sensitivity Level (MSL): 1; Peak Reflow Temperature (C): 240;
RC0402FR-0710KL
Yageo
Yageo's RC0402FR-0710KL is a 10000 ohm SMT fixed resistor with 1% tolerance, suitable for applications requiring a rated power dissipation of 0.0625 W. With a temperature coefficient of 100 ppm/°C, it operates b/w -55 to 155 °C, making it ideal for various electronic circuits.
Nte Electronics
NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Power Dissipation (Abs): 1 W; Maximum Collector Current (IC): .8 A; Terminal Form: WIRE;
M39029/56351
Souriau
CONNECTOR ACCESSORY; MIL Conformity: YES; Contact Gender: FEMALE; Insertion Tools: M81969/14-10; Tool Settings: M22520/2-10; DIN Conformity: NO;
MBR1560CT
General Instrument
MBR1560CT by General Instrument is a common cathode rectifier diode with a max forward voltage of 0.75V and max output current of 15A. It is used for efficiency applications, has a package shape of rectangular, and can operate in temperatures ranging from -65 to 150 °C.
BAV99
Jgd Semiconductors
RECTIFIER DIODE; Surface Mount: YES; Maximum Reverse Recovery Time: .006 us; Maximum Repetitive Peak Reverse Voltage: 70 V; Maximum Forward Voltage (VF): 1 V; Maximum Operating Temperature: 150 Cel;
BAV99+
Multicomp Pro
BAV99+ by Multicomp Pro is a series connected diode with 0.2A output current and 75V peak reverse voltage. Its 0.006us reverse recovery time makes it ideal for high-speed applications. This small outline rectifier diode is designed for surface mount installation in electronic circuits.
Panasonic
MIXER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
2N7002-7-F
Diodes Incorporated
Diodes Inc. 2N7002-7-F is a N-channel FET with 60V DS breakdown voltage, 0.115A max drain current, and 13.5 ohm RDS(on). Ideal for switching applications in enhancement mode operation. Features Gull Wing terminals, small outline package style, and operates up to 150°C.
Bytesonic Electronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Collector Current (IC): .6 A; No. of Elements: 1;
LM7805CT/NOPB
National Semiconductor
FIXED POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Terminal Form: THROUGH-HOLE; Maximum Voltage Tolerance: 5 %; Operating Temperature (TJ-Max): 125 Cel; Maximum Output Voltage-1: 5.25 V;
Plessey Semiconductors Discrete Components Div
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
SMBJ18CA
International Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Maximum Clamping Voltage: 29.2 V; Nominal Breakdown Voltage: 21.1 V; Maximum Repetitive Peak Reverse Voltage: 18 V; Polarity: BIDIRECTIONAL;
RC0805FR-0710RL
Yageo's RC0805FR-0710RL is a 10 ohm SMT fixed resistor with 1% tolerance and 0.125 W power dissipation. With a temperature range of -55 to 155 °C, it suits applications requiring precise resistance values in compact surface mount designs.
M24308/2-1F
Defense Logistics Agency
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Mounting Type: CABLE AND PANEL; Mating Info.: MULTIPLE MATING PARTS AVAILABLE; Empty Shell: NO;
2N7002
Formosa Microsemi
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .225 W; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR; Maximum Drain Current (Abs) (ID): .115 A;
Capar Components
RECTIFIER DIODE; Surface Mount: NO; No. of Phases: 1; Maximum Forward Voltage (VF): 1 V; Terminal Finish: Tin/Lead (Sn/Pb); Maximum Output Current: .15 A;
CC1310F128RHBT
Texas Instruments
CC1310F128RHBT by Texas Instruments is a Cortex-M3 CPU with 28672 RAM bytes. It operates b/w -40 to 85 °C and has a supply voltage range of 1.8V to 3.8V, making it ideal for industrial applications requiring a microprocessor circuit in a compact chip carrier package.
MKW01Z128CHN
Freescale Semiconductor
MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BUTT; No. of Terminals: 60; Package Code: VBCC; Package Shape: SQUARE;
TCI6630K2LDCMSA2
TCI6630K2LDCMSA2 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 900 terminals in a GRID ARRAY package. It operates at supply voltages ranging from 0.902V to 0.997V and can withstand peak reflow temperatures up to 245°C. This IC is suitable for applications requiring high-performance processing capabilities in electronic systems.
XCZU1EG-2SFVA625E
Xilinx
MICROPROCESSOR CIRCUIT; Peak Reflow Temperature (C): 250; Moisture Sensitivity Level (MSL): 4; JESD-609 Code: e1; Maximum Time At Peak Reflow Temperature (s): 30; Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu);
MCIMX6X4CVM08AB
SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 529; Package Code: LFBGA; Package Shape: SQUARE;
MCIMX286CVM4CR2
NXP Semiconductors
MCIMX286CVM4CR2 by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 85 °C, with supply voltage range of 1.35-1.55 V. This low profile, fine pitch IC is ideal for industrial applications requiring high performance in a compact form factor.
CY8C21434-24LTXI
Infineon Technologies
CY8C21434-24LTXI by Infineon is a 32-terminal, square-shaped chip carrier with a supply voltage range of 4.75V to 5.25V. It operates in industrial temperatures (-40°C to 85°C) and features a CMOS technology for programmable SoC applications. Suitable for surface mount assembly, it has a compact size (5mm x 5mm) and no-lead terminal form, making it ideal for various embedded systems requiring high performance in limited space.
NRF9160-SIBA-R7
Nordic Semiconductor Asa
Nordic Semiconductor's NRF9160-SIBA-R7 is a CMOS MICROCONTROLLER with 127 terminals, operating b/w -40 to 85 °C. It has a supply voltage range of 3-5.5 V and is ideal for industrial applications requiring low power consumption and compact design.
AM6422BSDGHAALV
AM6422BSDGHAALV by Texas Instruments is a SYSTEM ON CHIP with a max supply voltage of 0.79 V and a min operating temperature of -40 °C. It is used in applications requiring high speed and low power consumption.
MGM210PA22JIA2R
Silicon Labs
SYSTEM ON CHIP;
MCIMX31CVMN4CR2
MCIMX31CVMN4CR2 by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates at 1.22-1.47V, suitable for industrial applications. Featuring 473 terminals in a low profile grid array package, it can withstand temperatures from -40 to 85°C.
NRF52810-QCAA-R7
NRF52810-QCAA-R7 by Nordic Semiconductor Asa is a 32-terminal microprocessor circuit with CMOS technology. It operates b/w -40 to 85 °C and has a supply voltage range of 1.7V to 3.6V, making it ideal for industrial applications requiring low power consumption and compact design.
TMS320DM368ZCEDF
TMS320DM368ZCEDF by Texas Instruments is a 32-bit microprocessor with 8192 RAM words. It operates in industrial temperature range (-40 to 85 °C) and supports I2C, SPI, UART, USB buses. This MICROPROCESSOR CIRCUIT is ideal for applications requiring low profile and fine pitch package style.
XCZU4EV-1FBVB900I
XCZU4EV-1FBVB900I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C and has 900 terminals in a GRID ARRAY package style. Suitable for industrial applications, it requires a supply voltage of 0.825V to 0.876V.
EFR32MG24A010F1536IM40-B
EFR32MG24A010F1536IM40-B by Silicon Labs is a SoC peripheral IC with 40 terminals in a square chip carrier package. It operates b/w -40 to 125°C, with supply voltage ranging from 1.71V to 3.8V. Ideal for applications requiring low-profile and high-temperature performance like IoT devices and wearables.
DA14531-00000OG2
Renesas Electronics
SoC; Moisture Sensitivity Level (MSL): 1;
DS8007-ENG+
Maxim Integrated
MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: LFQFP; Package Shape: SQUARE;
MPFS250T-1FCSG536E
Microchip Technology
MPFS250T-1FCSG536E by Microchip: Programmable SoC with CMOS tech, 536 terminals in grid array package. Operates b/w 0-100°C, voltage range of 0.97-1.03V. Ideal for applications requiring low profile and fine pitch components.
XCZU5CG-2SFVC784I
XCZU5CG-2SFVC784I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates in an industrial temperature range from -40 to 100 °C and has a nominal voltage of 0.85 V. This device, featuring a GRID ARRAY package style, is suitable for various applications requiring high-performance processing capabilities.
QT60168-ASG
Quantum Research Group
Other uPs/uCs/Peripheral ICs; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
AX8052F143-3-TX30
Onsemi
AX8052F143-3-TX30 by Onsemi is a 40-terminal System on Chip with CMOS technology. It operates b/w -40 to 85°C, with supply voltage ranging from 1.8V to 3.6V. Ideal for industrial applications requiring a compact, low-profile chip carrier package style.
AX8052F143-3-TX40
SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 40; Package Code: HVQCCN; Package Shape: RECTANGULAR;
AX8052F151-2-TB05
SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 40; Package Code: HVQCCN; Package Shape: SQUARE;
AX8052F131-2-TB05
AX8052F131-2-TB05 by Onsemi is a System on Chip (SoC) with a max supply voltage of 3.6V and a min supply voltage of 2.2V. It is used in industrial applications and has a package style of CHIP CARRIER, VERY THIN PROFILE, HEAT SINK/SLUG.
AX8052F131-3-TB05
SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 28; Package Code: HVQCCN; Package Shape: SQUARE;
AX8052F131-3-TX30
AX8052F143-2-TB05
AX8052F143-2-TX30
AX8052F143-3-TB05
AX8052F151-2-TX30
AX8052F151-3-TX30
Supply Digital Components
$106.00
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12,000 In-Stock
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