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AX8052F151-3-TX30

Onsemi

AX8052F151-3-TX30 by Onsemi

AX8052F151-3-TX30 by Onsemi is a 40-terminal chip carrier with CMOS technology, operating at -40 to 85 °C. It has a supply voltage range of 2.2V to 3.6V and is ideal for industrial applications requiring a system on chip peripheral IC in a compact square package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 4,523 parts In-Stock

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Digiode

USA . 2,438 parts In-Stock

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AZTECH Wire

Italy . 913 parts In-Stock

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$13.870

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Advanced Electronics

New Zealand . 91 parts In-Stock

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$18.233

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$16.592

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$14.951

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Corohmni

South Africa . 154 parts In-Stock

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$36.189

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Problanco Electronics

Mexico . 5,578 parts In-Stock

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Kulean Microsystems

USA . 3,955 parts In-Stock

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Northwest PG Solutions

USA . 2,257 parts In-Stock

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SupplyDigital Components

Austria . 1,101 parts In-Stock

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UHIMA Technologies

Türkiye . 835 parts In-Stock

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Native Components

USA . 312 parts In-Stock

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Robosynatics

Brazil . 300 parts In-Stock

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Lucentia Tech

USA . 300 parts In-Stock

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$23.171

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Corphita

USA . 124 parts In-Stock

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TANS Electronics

Latvia . 53 parts In-Stock

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Overview

Unleash the power of innovation with the AX8052F151-3-TX30 by Onsemi. This cutting-edge system on chip is designed to revolutionize the way you approach embedded systems. With a wide operating temperature range and a compact design, this product is perfect for industrial applications where reliability is key. Trust in Onsemi's reputation for quality and let the AX8052F151-3-TX30 take your projects to new heights. Experience the value and benefits of this versatile chip carrier and unlock endless possibilities for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is lightweight and cost-effective, making the product suitable for a wide range of applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly, reducing production costs and improving reliability.

Maximum Supply Voltage: 3.6 V

Supports a high supply voltage, making it suitable for applications requiring robust performance.

Package Shape: SQUARE

Square package shape allows for efficient use of board space, ideal for compact designs.

Maximum Operating Temperature: 85 °C

Can operate in high-temperature environments, suitable for industrial applications with demanding operating conditions.

Terminal Finish: NICKEL GOLD PALLADIUM

Nickel Gold Palladium terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable connections.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Nominal Supply Voltage: 3 V

Nominal supply voltage of 3V is commonly used in many electronics applications, providing compatibility and flexibility.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs AX8052F151-3-TX30 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Onsemi

Specs

JESD-30 Code:

R-PQCC-N40

Length:

7 mm

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

40

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC40,.2X.28,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.2 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL GOLD PALLADIUM

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Peripheral IC Type:

Trade Compliance

AX8052F151-3-TX30 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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