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AX8052F151-2-TX30

Onsemi

AX8052F151-2-TX30 by Onsemi

AX8052F151-2-TX30 by Onsemi is a 40-terminal IC with supply voltage range of 2.2V to 3.6V, operating temperature from -40 °C to 85°C. It features CMOS technology, no-lead terminal form, and is ideal for industrial applications requiring system-on-chip peripherals in a compact square package style.

Median Price

$1.850

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 28,000 parts In-Stock

1+ parts

-

100+ parts

$1.750

1k+ parts

$1.560

10k+ parts

$1.470

28,000

-

$1.750

$1.560

$1.470

Verical

USA . 22,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.950

10k+ parts

$1.837

22,000

-

-

$1.950

$1.837

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,094 parts In-Stock

1+ parts

$1.843

100+ parts

-

1k+ parts

-

10k+ parts

-

1,094

$1.843

-

-

-

Vyrian

USA . 8,873 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,873

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 362 parts In-Stock

1+ parts

$1.730

100+ parts

-

1k+ parts

-

10k+ parts

-

362

$1.730

-

-

-

Corphita

USA . 1,181 parts In-Stock

1+ parts

$1.746

100+ parts

-

1k+ parts

-

10k+ parts

-

1,181

$1.746

-

-

-

Component Stockers USA

USA . 21,595 parts In-Stock

1+ parts

$1.990

100+ parts

$1.860

1k+ parts

$1.690

10k+ parts

$1.690

21,595

$1.990

$1.860

$1.690

$1.690

AZTECH Wire

Italy . 847 parts In-Stock

1+ parts

$14.780

100+ parts

-

1k+ parts

-

10k+ parts

-

847

$14.780

-

-

-

Continental Prestige Electronics

USA . 28,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.830

10k+ parts

-

28,000

-

-

$1.830

-

Problanco Electronics

Mexico . 7,022 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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7,022

-

-

-

-

Kulean Microsystems

USA . 5,538 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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5,538

-

-

-

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TANS Electronics

Latvia . 4,105 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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4,105

-

-

-

-

SupplyDigital Components

Austria . 2,696 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

-

2,696

-

-

-

-

Northwest PG Solutions

USA . 2,137 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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2,137

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-

-

-

Native Components

USA . 952 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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952

-

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UHIMA Technologies

Türkiye . 264 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

264

-

-

-

-

Overview

Unlock limitless possibilities with the AX8052F151-2-TX30 by Onsemi, a cutting-edge peripheral IC that delivers unparalleled performance and reliability. Manufactured by industry leader Onsemi, this innovative chip boasts a wide range of applications in the tech world. From advanced system-on-chip solutions to ultra-thin profiles, this product is designed to meet your every need. Experience the quality and value that Onsemi brings to the table with the AX8052F151-2-TX30 and take your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is durable and cost-effective, making the product suitable for various applications.

Surface Mount: YES

Surface mount technology makes the product easy to install and saves space on the PCB.

Maximum Supply Voltage: 3.6 V

Higher maximum supply voltage allows the product to support a wider range of applications.

Package Shape: SQUARE

The square shape of the package makes it easy to handle and install on the PCB.

Minimum Supply Voltage: 2.2 V

Lower minimum supply voltage ensures compatibility with various power sources.

Maximum Operating Temperature: 85 °C

High maximum operating temperature allows the product to function reliably in industrial environments.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature ensures the product can operate in extreme cold conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The terminal finish provides good conductivity and corrosion resistance, improving the product's reliability.

Terminal Position: QUAD

Quad terminal position allows for secure connectivity and stable performance.

Width: 5 mm

Compact width of the package saves space on the PCB and allows for efficient board layout.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures the product can withstand harsh operating conditions.

Peripheral IC Type: SYSTEM ON CHIP

System on Chip technology integrates multiple functions into a single chip, improving overall performance and reducing system complexity.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Nominal Supply Voltage: 3 V

Stable nominal supply voltage ensures consistent performance of the product.

Terminal Pitch: 0.5 mm

Fine terminal pitch facilitates high-density board design and improves signal integrity.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs AX8052F151-2-TX30 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Onsemi

Specs

JESD-30 Code:

R-PQCC-N40

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

40

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC40,.2X.28,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.2 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

5 mm

Peripheral IC Type:

Trade Compliance

AX8052F151-2-TX30 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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