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AX8052F143-3-TX30

Onsemi

AX8052F143-3-TX30 by Onsemi

AX8052F143-3-TX30 by Onsemi is a 40-terminal System on Chip with CMOS technology. It operates b/w -40 to 85°C, with supply voltage ranging from 1.8V to 3.6V. Ideal for industrial applications requiring a compact, low-profile chip carrier package style.

Median Price

$13.380

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 2,685 parts In-Stock

1+ parts

$10.300

100+ parts

-

1k+ parts

-

10k+ parts

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2,685

$10.300

-

-

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Farnell

UK . 2,881 parts In-Stock

1+ parts

$13.380

100+ parts

$8.910

1k+ parts

-

10k+ parts

-

2,881

$13.380

$8.910

-

-

Verical

USA . 515 parts In-Stock

1+ parts

$14.300

100+ parts

$12.190

1k+ parts

$11.830

10k+ parts

-

515

$14.300

$12.190

$11.830

-

Arrow

USA . 515 parts In-Stock

1+ parts

$14.300

100+ parts

$12.190

1k+ parts

$11.830

10k+ parts

-

515

$14.300

$12.190

$11.830

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Element14

Singapore . 2,991 parts In-Stock

1+ parts

$17.617

100+ parts

$13.427

1k+ parts

$13.272

10k+ parts

-

2,991

$17.617

$13.427

$13.272

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Mouser Electronics

USA . 11,058 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

$11.190

11,058

-

-

-

$11.190

Flip Electronics (Authorized)

USA . 3,000 parts In-Stock

1+ parts

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10k+ parts

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3,000

-

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Rochester

USA . 2 parts In-Stock

1+ parts

-

100+ parts

$3.610

1k+ parts

$3.230

10k+ parts

$3.040

2

-

$3.610

$3.230

$3.040

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,242 parts In-Stock

1+ parts

$7.476

100+ parts

-

1k+ parts

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10k+ parts

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1,242

$7.476

-

-

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Nova Conductors

Japan . 900 parts In-Stock

1+ parts

$12.786

100+ parts

-

1k+ parts

-

10k+ parts

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900

$12.786

-

-

-

Chip Stock

USA . 19,400 parts In-Stock

1+ parts

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19,400

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Vyrian

USA . 3,383 parts In-Stock

1+ parts

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3,383

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Flip Electronics

USA . 3,000 parts In-Stock

1+ parts

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3,000

-

-

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VNN

France . 688 parts In-Stock

1+ parts

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688

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Advanced Electronics

New Zealand . 10 parts In-Stock

1+ parts

$4.125

100+ parts

$3.919

1k+ parts

$3.919

10k+ parts

-

10

$4.125

$3.919

$3.919

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Ampacity Inc.

Singapore . 3,490 parts In-Stock

1+ parts

$6.690

100+ parts

-

1k+ parts

-

10k+ parts

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3,490

$6.690

-

-

-

Semicontronic

India . 3,472 parts In-Stock

1+ parts

$6.720

100+ parts

$6.552

1k+ parts

$6.518

10k+ parts

-

3,472

$6.720

$6.552

$6.518

-

Corphita

USA . 1,489 parts In-Stock

1+ parts

$7.083

100+ parts

-

1k+ parts

-

10k+ parts

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1,489

$7.083

-

-

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Continental Prestige Electronics

USA . 2,991 parts In-Stock

1+ parts

$8.300

100+ parts

-

1k+ parts

-

10k+ parts

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2,991

$8.300

-

-

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Corohmni

South Africa . 471 parts In-Stock

1+ parts

$10.300

100+ parts

-

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471

$10.300

-

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

$12.786

100+ parts

-

1k+ parts

-

10k+ parts

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1,000

$12.786

-

-

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Aztec Data Supply Inc.

USA . 48,596 parts In-Stock

1+ parts

$18.380

100+ parts

-

1k+ parts

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10k+ parts

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48,596

$18.380

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-

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Problanco Electronics

Mexico . 6,750 parts In-Stock

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6,750

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Lixinc

USA . 5,499 parts In-Stock

1+ parts

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5,499

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TANS Electronics

Latvia . 5,229 parts In-Stock

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5,229

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Kepictronics

USA . 5,000 parts In-Stock

1+ parts

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5,000

-

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Argo Parts USA

USA . 4,857 parts In-Stock

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4,857

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-

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SupplyDigital Components

Austria . 3,714 parts In-Stock

1+ parts

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3,714

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-

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Kulean Microsystems

USA . 3,457 parts In-Stock

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3,457

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-

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Robosynatics

Brazil . 808 parts In-Stock

1+ parts

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808

-

-

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Lucentia Tech

USA . 808 parts In-Stock

1+ parts

-

100+ parts

$3.925

1k+ parts

$3.845

10k+ parts

$3.845

808

-

$3.925

$3.845

$3.845

UHIMA Technologies

Türkiye . 586 parts In-Stock

1+ parts

-

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1k+ parts

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586

-

-

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Authorized Procurement Solutions

USA . 500 parts In-Stock

1+ parts

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500

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Overview

Discover the cutting-edge AX8052F143-3-TX30 by Onsemi, a high-quality system-on-chip that brings unmatched performance and efficiency to a wide range of applications. With Onsemi's reputation for excellence in semiconductor manufacturing, this chip offers reliability and innovation like no other. Whether you're in need of advanced functionality for IoT devices or superior processing power for industrial automation, the AX8052F143-3-TX30 delivers unparalleled value, benefits, and advantages to customers looking to stay ahead of the curve. Upgrade your technology with Onsemi today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials are lightweight and durable, making this product suitable for portable and long-lasting applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and resources during production.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage of 3.6 V provides flexibility in power requirements for various applications.

Minimum Supply Voltage: 1.8 V

The low minimum supply voltage of 1.8 V enables energy-efficient operation and extends battery life in portable devices.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this product can withstand demanding industrial environments and high-temperature conditions.

Minimum Operating Temperature: -40 °C

The wide temperature range from -40°C to 85°C ensures reliable performance in extreme cold and hot conditions.

Peripheral IC Type: SYSTEM ON CHIP

The integration of various functions into a single System on Chip design reduces component count, board space, and power consumption, making it a cost-effective and efficient solution.

Terminal Form: NO LEAD

No lead terminals are environmentally friendly and comply with RoHS regulations, ensuring the product's sustainability and compatibility with modern manufacturing standards.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs AX8052F143-3-TX30 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Onsemi

Specs

JESD-30 Code:

R-PQCC-N40

Length:

7 mm

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

40

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC40,.2X.28,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL GOLD PALLADIUM

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Peripheral IC Type:

Trade Compliance

AX8052F143-3-TX30 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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