Loading...

AX8052F131-3-TX30

Onsemi

AX8052F131-3-TX30 by Onsemi

The Onsemi AX8052F131-3-TX30 is a CMOS System on Chip with 40 terminals, operating b/w -40 to 85 °C. It has a supply voltage range of 1.8V to 3.6V and is ideal for industrial applications requiring very thin profile ICs in a square package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,031 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,031

-

-

-

-

Digiode

USA . 732 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

732

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 50 parts In-Stock

1+ parts

$18.410

100+ parts

-

1k+ parts

-

10k+ parts

-

50

$18.410

-

-

-

Native Components

USA . 21 parts In-Stock

1+ parts

$19.120

100+ parts

-

1k+ parts

-

10k+ parts

-

21

$19.120

-

-

-

Northwest PG Solutions

USA . 233 parts In-Stock

1+ parts

$21.032

100+ parts

$18.929

1k+ parts

-

10k+ parts

-

233

$21.032

$18.929

-

-

Ampacity Inc.

Singapore . 950 parts In-Stock

1+ parts

$34.000

100+ parts

-

1k+ parts

-

10k+ parts

-

950

$34.000

-

-

-

Problanco Electronics

Mexico . 2,976 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,976

-

-

-

-

SupplyDigital Components

Austria . 2,479 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,479

-

-

-

-

TANS Electronics

Latvia . 1,759 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,759

-

-

-

-

Kulean Microsystems

USA . 1,685 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,685

-

-

-

-

Corphita

USA . 711 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

711

-

-

-

-

UHIMA Technologies

Türkiye . 646 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

646

-

-

-

-

Corohmni

South Africa . 412 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

412

-

-

-

-

Overview

Unlock the power of cutting-edge technology with the AX8052F131-3-TX30 by Onsemi. This versatile System on Chip offers unparalleled quality and reliability, backed by Onsemi's reputation for excellence in semiconductor manufacturing. Ideal for a wide range of applications, this chip provides customers with seamless integration and high performance, making it a valuable asset for any project. Experience the benefits of superior design and engineering with the AX8052F131-3-TX30 and elevate your innovations to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body material makes the product lightweight and durable, ideal for various applications.

Surface Mount: YES

The surface mount feature allows for easy integration onto circuit boards, saving space and improving efficiency in electronic designs.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6 V, this product can handle higher power requirements and provide stable performance in demanding applications.

Package Shape: SQUARE

The square package shape offers uniformity and ease of placement on the circuit board, ensuring compatibility with standard mounting procedures.

No. of Terminals: 40

Having 40 terminals provides flexibility in connecting to other components, enabling complex functionality and versatile use cases.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85 °C ensures reliability and stability in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40 °C allows the product to function in cold environments without performance degradation.

Terminal Finish: NICKEL GOLD PALLADIUM

The nickel gold palladium terminal finish offers corrosion resistance, excellent conductivity, and reliable connections for long-term use.

Terminal Position: QUAD

The quad terminal position simplifies the installation process and ensures proper alignment on the circuit board, reducing potential errors during assembly.

Maximum Seated Height: 1 mm

The low maximum seated height of 1 mm facilitates a compact design for space-constrained applications, enhancing overall system integration.

Width: 5 mm

The narrow width of 5 mm allows for efficient board layout and spacing optimization, contributing to a streamlined and organized circuit design.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures proper solder reflow and component reliability during the assembly process.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260 °C enables secure solder joints and high-temperature tolerance, enhancing the product's durability.

Length: 7 mm

The compact length of 7 mm allows for space-saving installation and versatile placement options, accommodating various board layouts and configurations.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures the product's reliability and performance in demanding industrial environments with fluctuating temperature conditions.

Peripheral IC Type: SYSTEM ON CHIP

The system-on-chip peripheral IC type combines multiple functions within a single integrated circuit, offering enhanced performance, reduced power consumption, and simplified system design.

Technology: CMOS

The CMOS technology used in the product ensures low power consumption, high speed, and compatibility with a wide range of applications, making it a versatile choice for various electronic designs.

Terminal Form: NO LEAD

The no-lead terminal form eliminates the risk of lead contamination, complies with environmental regulations, and provides a reliable connection for long-term use.

Nominal Supply Voltage: 3 V

The nominal supply voltage of 3 V offers a balance between power efficiency and performance, making it suitable for a wide range of applications requiring moderate power requirements.

Terminal Pitch: 0.5 mm

The narrow terminal pitch of 0.5 mm allows for higher component density on the circuit board, enabling more functionalities in a compact space and enhancing design flexibility.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs AX8052F131-3-TX30 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Onsemi

Specs

JESD-30 Code:

R-PQCC-N40

Length:

7 mm

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

40

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC40,.2X.28,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL GOLD PALLADIUM

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Peripheral IC Type:

Trade Compliance

AX8052F131-3-TX30 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 11