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MCIMX6S7CVM08AB

NXP Semiconductors

MCIMX6S7CVM08AB by NXP Semiconductors

MCIMX6S7CVM08AB by NXP Semiconductors is a SYSTEM ON CHIP with 624 terminals, operating at -40 to 105 °C. It has a low profile package style, 0.8 mm terminal pitch, and is suitable for industrial applications requiring CMOS technology.

Median Price

$44.959

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 549 parts In-Stock

1+ parts

$54.030

100+ parts

$39.346

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549

$54.030

$39.346

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Mouser Electronics

USA . 218 parts In-Stock

1+ parts

$57.590

100+ parts

$41.480

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-

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218

$57.590

$41.480

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EBV Elektronik

Germany . 14,280 parts In-Stock

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14,280

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Flip Electronics (Authorized)

USA . 282 parts In-Stock

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Rochester

USA . 262 parts In-Stock

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$27.480

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$24.590

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$23.140

262

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$27.480

$24.590

$23.140

Verical

USA . 262 parts In-Stock

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$35.888

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$32.450

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262

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$35.888

$32.450

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Avnet

USA . 120 parts In-Stock

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120

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Digiode

USA . 2,806 parts In-Stock

1+ parts

$29.013

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2,806

$29.013

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Nova Conductors

Japan . 200 parts In-Stock

1+ parts

$35.067

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200

$35.067

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Vyrian

USA . 3,832 parts In-Stock

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3,832

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Anansix

USA . 1,983 parts In-Stock

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Flip Electronics

USA . 461 parts In-Stock

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Chip Stock

USA . 206 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 772 parts In-Stock

1+ parts

$18.491

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772

$18.491

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Ampacity Inc.

Singapore . 3,415 parts In-Stock

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$25.960

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3,415

$25.960

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Semicontronic

India . 3,386 parts In-Stock

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$25.960

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$25.311

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$25.181

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$25.960

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$25.181

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Corphita

USA . 1,265 parts In-Stock

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$27.486

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$27.486

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Aztec Data Supply Inc.

USA . 110 parts In-Stock

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$29.651

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110

$29.651

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Continental Prestige Electronics

USA . 1,575 parts In-Stock

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$35.067

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$34.366

1,575

$35.067

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$34.366

Microchip USA

USA . 2,534 parts In-Stock

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$109.296

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2,534

$109.296

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Perfect Parts

USA . 6,384 parts In-Stock

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6,384

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UNI Independent Distributors

Spain . 3,345 parts In-Stock

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Futuretech Components

Singapore . 3,000 parts In-Stock

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Argo Parts USA

USA . 244 parts In-Stock

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Bastille Electronics

Australia . 55 parts In-Stock

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Overview

Unlock endless possibilities with the MCIMX6S7CVM08AB by NXP Semiconductors. This cutting-edge System on Chip offers unparalleled performance and reliability for a wide range of applications. From industrial automation to IoT devices, this innovative technology delivers superior functionality and efficiency. Trust NXP Semiconductors to provide top-quality solutions that exceed expectations. Embrace the future with the MCIMX6S7CVM08AB and experience the difference firsthand.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the components within the package, making it suitable for various industrial applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and reducing manufacturing costs.

Maximum Supply Voltage: 1.5 V

Low maximum supply voltage helps in reducing power consumption and extending the battery life of the device.

Minimum Supply Voltage: 1.275 V

Wide range of supply voltage options allows for flexibility in different operating conditions.

Maximum Operating Temperature: 105 °C

High maximum operating temperature ensures reliable performance even in harsh environmental conditions.

Terminal Finish: TIN SILVER COPPER

Tin silver copper terminal finish provides good conductivity and corrosion resistance for reliable connections.

Width: 21 mm

Compact width makes the product suitable for space-constrained applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MCIMX6S7CVM08AB attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

Additional Features:

24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE

JESD-30 Code:

S-PBGA-B624

JESD-609 Code:

e1

Length:

21 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

624

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage:

1.5 V

Minimum Supply Voltage:

1.275 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

21 mm

Peripheral IC Type:

Trade Compliance

MCIMX6S7CVM08AB Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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