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AX8052F151-2-TB05

Onsemi

AX8052F151-2-TB05 by Onsemi

AX8052F151-2-TB05 by Onsemi is a 40-terminal IC with max supply voltage of 3.6V and min of 2.2V. Ideal for industrial applications, it operates b/w -40 to 85°C, featuring CMOS technology and system-on-chip design for compact solutions in various electronic systems.

Median Price

$1.705

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 432 parts In-Stock

1+ parts

$0.916

100+ parts

$0.859

1k+ parts

$0.844

10k+ parts

-

432

$0.916

$0.859

$0.844

-

Chip1Stop

Japan . 432 parts In-Stock

1+ parts

$1.170

100+ parts

$0.859

1k+ parts

$0.844

10k+ parts

-

432

$1.170

$0.859

$0.844

-

Rochester

USA . 9,925 parts In-Stock

1+ parts

-

100+ parts

$1.750

1k+ parts

$1.560

10k+ parts

$1.470

9,925

-

$1.750

$1.560

$1.470

DigiKey

USA . 9,925 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.300

10k+ parts

-

9,925

-

-

$2.300

-

Verical

USA . 6,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.950

10k+ parts

-

6,500

-

-

$1.950

-

Mouser Electronics

USA . 690 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.660

10k+ parts

$1.620

690

-

-

$1.660

$1.620

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 432 parts In-Stock

1+ parts

$0.870

100+ parts

-

1k+ parts

-

10k+ parts

-

432

$0.870

-

-

-

Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$1.730

100+ parts

-

1k+ parts

-

10k+ parts

-

300

$1.730

-

-

-

Chip Stock

USA . 68,000 parts In-Stock

1+ parts

-

100+ parts

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68,000

-

-

-

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Vyrian

USA . 7,614 parts In-Stock

1+ parts

-

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-

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7,614

-

-

-

-

VNN

France . 2,986 parts In-Stock

1+ parts

-

100+ parts

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2,986

-

-

-

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Bristol Electronics

USA . 500 parts In-Stock

1+ parts

-

100+ parts

-

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500

-

-

-

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Dan-Mar Components

USA . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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500

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 3,479 parts In-Stock

1+ parts

$0.720

100+ parts

$0.702

1k+ parts

$0.698

10k+ parts

-

3,479

$0.720

$0.702

$0.698

-

Corphita

USA . 2,049 parts In-Stock

1+ parts

$0.824

100+ parts

-

1k+ parts

-

10k+ parts

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2,049

$0.824

-

-

-

Corohmni

South Africa . 401 parts In-Stock

1+ parts

$0.844

100+ parts

-

1k+ parts

-

10k+ parts

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401

$0.844

-

-

-

Ampacity Inc.

Singapore . 3,309 parts In-Stock

1+ parts

$1.560

100+ parts

-

1k+ parts

-

10k+ parts

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3,309

$1.560

-

-

-

Argo Parts USA

USA . 953 parts In-Stock

1+ parts

$1.730

100+ parts

-

1k+ parts

-

10k+ parts

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953

$1.730

-

-

-

Netroflash

USA . 100 parts In-Stock

1+ parts

$1.730

100+ parts

$1.695

1k+ parts

-

10k+ parts

-

100

$1.730

$1.695

-

-

Advanced Electronics

New Zealand . 900 parts In-Stock

1+ parts

$29.298

100+ parts

$26.661

1k+ parts

$24.024

10k+ parts

-

900

$29.298

$26.661

$24.024

-

Aztec Data Supply Inc.

USA . 4,266 parts In-Stock

1+ parts

$70.140

100+ parts

-

1k+ parts

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10k+ parts

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4,266

$70.140

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-

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Continental Prestige Electronics

USA . 9,925 parts In-Stock

1+ parts

-

100+ parts

$1.410

1k+ parts

-

10k+ parts

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9,925

-

$1.410

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TANS Electronics

Latvia . 7,836 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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7,836

-

-

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Problanco Electronics

Mexico . 7,027 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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7,027

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-

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SupplyDigital Components

Austria . 4,159 parts In-Stock

1+ parts

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4,159

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-

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Kulean Microsystems

USA . 3,822 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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3,822

-

-

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UHIMA Technologies

Türkiye . 466 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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466

-

-

-

-

Overview

Unlock the power of innovation with the AX8052F151-2-TB05 by Onsemi. This cutting-edge product is designed for a wide range of applications, offering unparalleled quality and reliability. Manufactured by Onsemi, a leader in the industry, this chip carrier with a very thin profile provides maximum efficiency and performance. With a wide temperature range and advanced technology, the AX8052F151-2-TB05 is perfect for industrial use. Experience the value and benefits that this system on chip brings to your projects, revolutionizing the way you work.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the electronic components inside, ensuring a longer lifespan for the product.

Surface Mount: YES

Allows for easy and efficient installation onto circuit boards, saving time and effort during production.

Maximum Supply Voltage: 3.6 V

Allows for compatibility with a wide range of power sources, making the product versatile in various applications.

Package Shape: SQUARE

Enables easier placement and arrangement on circuit boards, optimizing space utilization.

Minimum Supply Voltage: 2.2 V

Ensures stable operation even under lower power supply conditions, enhancing reliability in different environments.

Maximum Operating Temperature: 85 °C

Ensures the product can operate efficiently and reliably in higher temperature environments without compromising performance.

Minimum Operating Temperature: -40 °C

Allows the product to function effectively in extremely cold conditions, expanding its usage in various settings.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Provides strong and reliable electrical connections, reducing the risk of signal loss or interference.

Technology: CMOS

Offers low power consumption and high noise immunity, making the product energy-efficient and stable in operation.

Nominal Supply Voltage: 3 V

Maintains consistent performance under standard operating conditions, ensuring reliable functionality.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs AX8052F151-2-TB05 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Onsemi

Specs

JESD-30 Code:

R-PQCC-N40

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

40

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC28,.35X.55

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.2 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

5 mm

Peripheral IC Type:

Trade Compliance

AX8052F151-2-TB05 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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